Disclosed are non-linear transmission lines using ferromagnetic materials to generate ferromagnetic resonance oscillations. In one aspect, a non-linear transmission line apparatus is disclosed. The apparatus includes an outer conductor having a first side and a second internally facing side, and an inner conductor positioned internal to the non-linear transmission line apparatus. The apparatus further includes a ferromagnetic material surrounding the inner conductor, wherein the ferromagnetic material comprises nanoparticles of an ε-polymorph of iron oxide expressed as ε—Fe.sub.2O.sub.3. The apparatus also includes a first dielectric material positioned between the outer conductor and the inner conductor, the dielectric material in contact with both the ferromagnetic material and with the second internally facing side of the outer conductor, wherein the outer conductor, the inner conductor, the dielectric material and the ferromagnetic material form the nonlinear transmission line.

A cavity device is disclosed comprising a plurality of flat boards stacked one on lop of the other to form a multilayered structure. At least some of the flat boards comprise at least one opening or perforations having one or more layers of electrically conducting materials configured to establish electrical conduction with one or more layers of electrically conducting materials of another one of the flat boards, to thereby form electrically conducting patterns in the multilayered structure for interacting with electromagnetic radiation introduced into the cavity device.

The present invention relates to a method for manufacturing a nonmagnetic water-cooled microwave ablation needle. The manufacturing method is designed for a microwave ablation needle of a nonmagnetic material and has a proper process procedure, favorable assembly quality, and high production efficiency. The produced nonmagnetic water-cooled microwave ablation needle is applicable to microwave tumor ablation surgery in a nuclear magnetic resonance imaging environment, and helps a doctor in charge to clearly determine a position of a tumor, improve piercing precision, have preferable control on a whole surgery process, improve a success rate of the surgery, reduce damage on surrounding normal tissues as much as possible on the premise of effectively inactivating the tumor, alleviate pain of a patient, and shorten a recovery cycle.

The present invention relates to a microwave signal transition component (1) having a first signal conductor side (2) and a second signal conductor side (3). The signal transition component (1) is arranged for transfer of microwave signals from the first signal conductor side (2) to the second signal conductor side (3). The transfer component (1) comprises at least one, at least partly circumferentially running, electrically conducting frame (4), a dielectric filling (5) positioned at least partly within said conducting frame (4), at least one filling aperture (6; 6a, 6b) miming through the dielectric filling, and, for each filling aperture (6; 6a, 6b), an electrically conducting connection (7; 7a, 7b) that at least partly is positioned within said filling aperture (6; 6a, 6b). The present invention also relates to a method for manufacturing a microwave signal transition component according to the above.

A high-frequency signal transmission structure capable of transmitting high frequency signals with reduced attenuation includes a first wiring board and a second wiring board. The first wiring board includes a first conductor layer, a second conductor layer, and a first base film layer sandwiched between the first conductor layer and the second conductor layer. The second wiring board includes a second base film layer and a third conductor layer. the second base film layer covers the surface of the first conductor layer facing away from the first base film layer. The first base film layer and the second base film layer surround the first conductor layer and both include an aerogel film layer having an air to gel ratio by volume of 80-99%. A method for manufacturing the high-frequency signal transmission structure is also disclosed.

Cables, cable connectors, and support structures for cantilever package and/or cable attachment may be fabricated using additive processes, such as a coldspray technique, for integrated circuit assemblies. In one embodiment, cable connectors may be additively fabricated directly on an electronic substrate. In another embodiment, seam lines of cables and/or between cables and cable connectors may be additively fused. In a further embodiment, integrated circuit assembly attachment and/or cable attachment support structures may be additively formed on an integrated circuit assembly.

A cryptographic device (100) arranged to compute a target block cipher (B.sub.t) on an input message (110), the device comprising a first and second block cipher unit (121, 122) arranged to compute the target block cipher (B.sub.t) on the input message, and a first control unit (130) arranged to take the first block cipher result and the second block cipher result as input, and to produces the first block cipher result only if the block cipher results are equal.

Devices, systems, and/or methods that can facilitate plating one or more metal layers onto a niobium-titanium substrate are provided. According to an embodiment, a device can comprise a niobium-titanium substrate. The device can further comprise a first metal layer plated on a portion of the niobium-titanium substrate. The device can further comprise a second metal layer plated on the first metal layer. The device can further comprise a third metal layer plated on the second metal layer.

Embodiments include semiconductor packages and method of forming the semiconductor packages. A semiconductor package includes first waveguides over a package substrate. The first waveguides include first angled conductive layers, first transmission lines, and first cavities. The semiconductor package also includes a first dielectric over the first waveguides and package substrate, second waveguides over the first dielectric and first waveguides, and a second dielectric over the second waveguides and first dielectric. The second waveguides include second angled conductive layers, second transmission lines, and second cavities. The first angled conductive layers are positioned over the first transmission lines and package substrate having a first pattern of first triangular structures. The second angled conductive layers are positioned over the second transmission lines and first dielectric having a second pattern of second triangular structures, where the second pattern is shaped as a coaxial interconnects enclosed with second triangular structures and portions of first dielectric.

Devices, systems, and/or methods that can facilitate plating one or more metal layers onto a niobium-titanium substrate are provided. According to an embodiment, a device can comprise a niobium-titanium substrate. The device can further comprise a first metal layer plated on a portion of the niobium-titanium substrate. The device can further comprise a second metal layer plated on the first metal layer. The device can further comprise a third metal layer plated on the second metal layer.