A radio frequency (“RF”) waveguide device fabricated by additive manufacturing is provided that includes a RF channel comprising a wall and a RF component comprising an unsupported span extending from the wall of the RF channel. The unsupported span can include at least one unsupported surface extending from the wall at an oblique angle relative to the wall. The RF component formed in this manner with additive manufacturing does not negatively impact the RF performance of the RF waveguide.

A radio frequency (“RF”) waveguide device fabricated by additive manufacturing is provided that includes a RF channel comprising a wall and a RF component comprising an unsupported span extending from the wall of the RF channel. The unsupported span can include at least one unsupported surface extending from the wall at an oblique angle relative to the wall. The RF component formed in this manner with additive manufacturing does not negatively impact the RF performance of the RF waveguide.

Optical axis as central axis is defined as z-axis, and axes perpendicular to z-axis are defined as x- and y-axis. Metallic flat plates are formed parallel to x-z plane to overlap each other and be separated by a given distance. Multiple flat plates except the top flat plate and bottom flat plate are each provided with multiple through holes. Central flat plates are each provided with through holes of a first radius. Intermediate flat plates arranged between central flat plate and top flat plate and between central flat plate and bottom flat plate are each provided with through holes of a second radius smaller than first radius. Second radius of through holes formed in an intermediate flat plate arranged in a position farther from central flat plate is smaller than second size of through holes formed in an intermediate flat plate arranged in a position closer to central flat plate.

Optical axis as central axis is defined as z-axis, and axes perpendicular to z-axis are defined as x- and y-axis. Metallic flat plates are formed parallel to x-z plane to overlap each other and be separated by a given distance. Multiple flat plates except the top flat plate and bottom flat plate are each provided with multiple through holes. Central flat plates are each provided with through holes of a first radius. Intermediate flat plates arranged between central flat plate and top flat plate and between central flat plate and bottom flat plate are each provided with through holes of a second radius smaller than first radius. Second radius of through holes formed in an intermediate flat plate arranged in a position farther from central flat plate is smaller than second size of through holes formed in an intermediate flat plate arranged in a position closer to central flat plate.

A photonic integrated circuit is disclosed comprising: a dielectric substrate (110); a dielectric waveguide arrangement (120) on the substrate (110) for guiding terahertz (THz) waves; and a local functionalization (130) having a metallization in a surface area of the dielectric waveguide arrangement (120). The metallization is localized along a propagation direction of the THz waves to allow a metallization-free propagation of the THz wave outside of the local functionalization.

A photonic integrated circuit is disclosed comprising: a dielectric substrate (110); a dielectric waveguide arrangement (120) on the substrate (110) for guiding terahertz (THz) waves; and a local functionalization (130) having a metallization in a surface area of the dielectric waveguide arrangement (120). The metallization is localized along a propagation direction of the THz waves to allow a metallization-free propagation of the THz wave outside of the local functionalization.

A wave conductor for electromagnetic waves, waveguide connector and communications link A wave conductor for electromagnetic waves, preferably a millimeter-wave wave conductor, in particular for a digital communication application, with a conductor core and a one conductor sheathing. The conductor sheathing surrounds the conductor core at least partially in the longitudinal direction and at least partially in the circumferential direction of the wave conductor. One longitudinal section of the wave conductor has cross-sections which deviate from a circle at the outside of the wave conductor and/or at the outside of the conductor sheathing. Further, a waveguide connector for electromagnetic waves, preferably millimeter-wave waveguide connectors, in particular flying or installable waveguide connectors for a wave conductor. The waveguide connector has a wave conductor plug-in recess in which a longitudinal section of the wave conductor is directly placeable. The wave conductor plug-in recess has an inner circumference coding formation by means of which the wave conductor is placeable in at least one specific orientation in the wave conductor plug-in recess.

A wave conductor for electromagnetic waves, waveguide connector and communications link A wave conductor for electromagnetic waves, preferably a millimeter-wave wave conductor, in particular for a digital communication application, with a conductor core and a one conductor sheathing. The conductor sheathing surrounds the conductor core at least partially in the longitudinal direction and at least partially in the circumferential direction of the wave conductor. One longitudinal section of the wave conductor has cross-sections which deviate from a circle at the outside of the wave conductor and/or at the outside of the conductor sheathing. Further, a waveguide connector for electromagnetic waves, preferably millimeter-wave waveguide connectors, in particular flying or installable waveguide connectors for a wave conductor. The waveguide connector has a wave conductor plug-in recess in which a longitudinal section of the wave conductor is directly placeable. The wave conductor plug-in recess has an inner circumference coding formation by means of which the wave conductor is placeable in at least one specific orientation in the wave conductor plug-in recess.

The disclosed systems, structures, and methods are directed to a mm-Wave communication structure employing a first transmission structure employing a first ring transition structure followed by a first ground structure and a second ground structure configured to carry a ground signal, a second transmission structure employing a second ring transition structure followed by a third ground structure and a fourth ground structure configured to carry the ground signal, a third transmission structure configured to carry a mm-Wave signal, wherein the third transmission structure begins at the center of the first ring transition structure and the second ring transition structure and the third transmission structure is coplanar with the second transmission structure, and a fourth transmission structure configured to operatively couple an IC and the first transmission layer, the second transmission layer, and the third transmission structure.

The disclosed systems, structures, and methods are directed to a mm-Wave communication structure employing a first transmission structure employing a first ring transition structure followed by a first ground structure and a second ground structure configured to carry a ground signal, a second transmission structure employing a second ring transition structure followed by a third ground structure and a fourth ground structure configured to carry the ground signal, a third transmission structure configured to carry a mm-Wave signal, wherein the third transmission structure begins at the center of the first ring transition structure and the second ring transition structure and the third transmission structure is coplanar with the second transmission structure, and a fourth transmission structure configured to operatively couple an IC and the first transmission layer, the second transmission layer, and the third transmission structure.