A radio-frequency device comprising (1) a ceramic component that forms a hole and (2) a connector coupled to the ceramic component, wherein the connector comprises an electrically conductive pin that at least partially extends into the hole formed in the ceramic component. Various other apparatuses, systems, and methods are also disclosed.

The disclosure is directed to a PMF-transceiver (1) comprising a housing (2) with a recess (5) in which a printed circuit board (6) is arranged. The printed circuit board (6) comprises at least one radiating element (7) being in a mounted position inter-connected to a thereto related PMF-cable (18) by a PMF-interposer (13) arranged 5 between the printed circuit board (6) and the PMF-cable (18) and comprising a main body (14) arranged in a cavity (17) in the housing (2). The PMF-interposer (13) extends between the radiating element (7) and the PMF-cable (19).

Embodiments may relate to a semiconductor package that includes a die and a package substrate. The package substrate may include one or more cavities that go through the package substrate from a first side of the package substrate that faces the die to a second side of the package substrate opposite the first side. The semiconductor package may further include a waveguide communicatively coupled with the die. The waveguide may extend through one of the one or more cavities such that the waveguide protrudes from the second side of the package substrate. Other embodiments may be described or claimed.

A semiconductor structure and a method of forming the same are provided. A method of manufacturing the semiconductor structure includes: providing a substrate; depositing a first dielectric layer over the substrate; attaching a waveguide to the first dielectric layer; depositing a second dielectric layer to laterally surround the waveguide; and forming a first conductive member and a second conductive member over the second dielectric layer and the waveguide, wherein the first conductive member and the second conductive member are in contact with the waveguide. The waveguide is configured to transmit an electromagnetic signal between the first conductive member and the second conductive member.

A composite electronic device comprises a ceramic waveguide, CWG, device having at least two input/output, I/O, ports; and a ceramic stripline, CS, device comprising at least one stripline transmission paths having at least two I/O ports. The CS device is affixed to the CWG device such that at least one of the I/O ports of the CWG device is electrically connected to a corresponding one I/O port of the CS device.

A method of manufacturing the semiconductor structure includes: providing a substrate; forming a first conductive via and a second conductive via extending in the substrate; depositing a first dielectric layer over the substrate and the first and second conductive vias; receiving a waveguide; moving the waveguide to a location over the first dielectric layer and aligning the waveguide with a position of the first dielectric layer; attaching the waveguide to the position of the first dielectric layer; forming a first conductive member and a second conductive member over the waveguide, the first conductive member and the second conductive member being in contact with the waveguide; and etching a backside of the substrate to electrically expose the first and second conductive vias. The first conductive member or the second conductive member is electrically connected to the first or second conductive via.

An interconnection includes a circuit board assembly and a hybrid cable assembly. The circuit board assembly includes first and second outer layer assemblies and an intermediate layer assembly. The first and second outer layer assemblies each include an electrically conductive layer. A cable-receiving space is formed at a first side edge of the circuit board assembly. The hybrid cable assembly includes a dielectric waveguide system having a core and a cladding and being configured to transmit a radar wave in a frequency range from about 70 to about 300 GHz. A first conductor system configured to transmit power and/or data is disposed adjacent to the dielectric waveguide system and includes an electrically conductive inner conductor assembly inserted into the cable-receiving space and galvanically connected to a first inner-conductor connection region. The core of the dielectric waveguide system is inserted into the cable-receiving space and disposed at a waveguide connection region.

Embodiments of the invention include dielectric waveguides and connectors for dielectric waveguides. In an embodiment a dielectric waveguide connector may include an outer ring and one or more posts extending from the outer ring towards the center of the outer ring. In some embodiments, a first dielectric waveguide secured within the dielectric ring by the one or more posts. In another embodiment, an enclosure surrounding electronic components may include an enclosure wall having an interior surface and an exterior surface and a dielectric waveguide embedded within the enclosure wall. In an embodiment, a first end of the dielectric waveguide is substantially coplanar with the interior surface of the enclosure wall and a second end of the dielectric waveguide is substantially coplanar with the exterior surface of the enclosure wall.

A redirecting device for mm-waves includes an input section, an output section disposed at 90 degrees to the input section, and a waveguide member extending from the input section to the output section. The waveguide member is a rigid dielectric material.

A signal transmission system 1a is mounted on circuit boards 10A and 10B and on circuit boards 10A and 10B and includes semiconductor packages 12A and 12B containing an RF circuit as well as a dielectric waveguide 21E. The semiconductor packages 12A and 12B include the package surface 12f and the antenna 12e formed on the package surface 12f. The dielectric waveguide 21E includes a waveguide end surface 21a facing antenna 12e. An air gap G is ensured between the waveguide end surface 21a and the antenna 12e.