The disclosure is directed to a PMF-transceiver (1) comprising a housing (2) with a recess (5) in which a printed circuit board (6) is arranged. The printed circuit board (6) comprises at least one radiating element (7) being in a mounted position inter-connected to a thereto related PMF-cable (18) by a PMF-interposer (13) arranged 5 between the printed circuit board (6) and the PMF-cable (18) and comprising a main body (14) arranged in a cavity (17) in the housing (2). The PMF-interposer (13) extends between the radiating element (7) and the PMF-cable (19).

Transitional elements to offset a capacitive impedance in a transmission line are disclosed. Described are various examples of transitional elements in a multilayer substrate that introduce a transitional reactance to cancel the transmission line capacitive effects. The transitional elements reduce insertion loss.

A signal transmission system 1a is mounted on circuit boards 10A and 10B and on circuit boards 10A and 10B and includes semiconductor packages 12A and 12B containing an RF circuit as well as a dielectric waveguide 21E. The semiconductor packages 12A and 12B include the package surface 12f and the antenna 12e formed on the package surface 12f. The dielectric waveguide 21E includes a waveguide end surface 21a facing antenna 12e. An air gap G is ensured between the waveguide end surface 21a and the antenna 12e.

A signal transmission system including: a first connector apparatus, and a second connector apparatus that is coupled with the first connector apparatus. The first connector apparatus and the second connector apparatus are coupled together to form an electromagnetic field coupling unit, and a transmission object signal is converted into a radio signal, which is then transmitted through the electromagnetic field coupling unit, between the first connector apparatus and the second connector apparatus.

This disclosure provides a radio frequency chip, a signal transceiver, and a communication device. The radio frequency chip includes: a chip; a coupling structure, including: a resonator, where a resonant cavity is formed, and an inner wall of the resonant cavity is made of metal; a redistribution layer, arranged above the resonant cavity and including an redistribution layer (RDL) dielectric layer; a radiator, made of metal, formed into a centro-symmetric shape, arranged on a surface that is of the dielectric layer and that faces the resonator, and accommodated in the resonant cavity; a feeder, where one end of the feeder is connected to the chip, and the other end is inserted into the resonant cavity; a packaging structure, configured to package the chip and cover the redistribution layer, so that a signal generated by the chip can be efficiently coupled to a polymer transmission line.

A semiconductor device including an Integrated Circuit (IC) package and a plastic waveguide. The IC package includes a semiconductor chip; and an embedded antenna formed within a Redistribution Layer (RDL) coupled to the semiconductor chip, wherein the RDL is configured to transport a Radio Frequency (RF) signal between the semiconductor chip and the embedded antenna. The plastic waveguide is attached to the IC package and configured to transport the RF signal between the embedded antenna and outside of the IC package.

Disclosed is a transmission line-waveguide transition device including side surfaces and a top surface having a size and shape corresponding to a waveguide to which a signal of a transmission line is transmitted, the side surfaces and top surface having a plate shape; and a plate-shaped ridge formed in an inner space defined by the side surfaces and the top surface, the ridge being provided with a slope having one end connected to the transmission line and an opposite end contacting the top surface.

A transition device includes a first metal layer, a signaling metal line, an excitation metal piece, a first dielectric layer, a plurality of conductive via elements, a reflector, and a waveguide. The first metal layer has a notch. The notch extends to the interior of the first metal layer, forming a first slot region. The signaling metal line is disposed in the notch. The excitation metal piece is disposed in the first slot region and is coupled to the signaling metal line. The first dielectric layer has a pair of first openings. The first dielectric layer includes a bridging portion disposed between the first openings. The bridging portion is configured to carry the excitation metal piece. The conductive via elements penetrate the first dielectric layer and are coupled to the first metal layer. The conductive via elements at least partially surround the first slot region.

A device includes a multilayer substrate having a first surface and a second surface opposite the first surface. An integrated circuit is mounted on the second surface of the multilayer substrate, the integrated circuit having transmission circuitry configured to process millimeter wave signals. A substrate waveguide having a substantially solid wall is formed within a portion of the multilayer substrate perpendicular to the first surface. The substrate waveguide has a first end with the wall having an edge exposed on the first surface of the multilayer substrate. A reflector is located in one of the layers of the substrate and is coupled to an edge of the wall on an opposite end of the substrate waveguide.

In accordance with one or more embodiments, a dielectric coupler includes a neck portion configured to receive a first electromagnetic wave from a hollow waveguide. A flared portion is configured to generate, responsive to the first electromagnetic wave, a second electromagnetic wave along a surface of a transmission medium, wherein the flared portion at least partially surrounds the transmission medium, wherein the second electromagnetic wave propagates along the surface of the transmission medium without requiring an electrical return path. A tapered portion is configured to interface the neck portion to the flared portion.