A power combiner system includes four microwave solid-state power amplifiers, which are connected in an H configuration by a magic tee device.

A power combiner system includes four microwave solid-state power amplifiers, which are connected in an H configuration by a magic tee device.

A radio frequency (“RF”) waveguide device fabricated by additive manufacturing is provided that includes a RF channel comprising a wall and a RF component comprising an unsupported span extending from the wall of the RF channel. The unsupported span can include at least one unsupported surface extending from the wall at an oblique angle relative to the wall. The RF component formed in this manner with additive manufacturing does not negatively impact the RF performance of the RF waveguide.

A radio frequency (“RF”) waveguide device fabricated by additive manufacturing is provided that includes a RF channel comprising a wall and a RF component comprising an unsupported span extending from the wall of the RF channel. The unsupported span can include at least one unsupported surface extending from the wall at an oblique angle relative to the wall. The RF component formed in this manner with additive manufacturing does not negatively impact the RF performance of the RF waveguide.

The present disclosure provides a dual-band dual-polarization splitter connecting a cross-shaped waveguide power divider to with an E-plane waveguide magic T and an ortho-mode transition through an E/H-plane 90° curved waveguide to form a new type of coaxial waveguide ortho-mode transition, thereby implementing the structure of coaxial circular waveguide feeding in high and low frequencies at the same time, reducing the length of the high-frequency transmission line, and reducing the transmission loss. Meanwhile, the present disclosure implements dual-polarization transmission in each frequency band, and can flexibly switch between vertical polarization and horizontal polarization when the dual-polarization has been converted to the single-polarization.

The present disclosure provides a dual-band dual-polarization splitter connecting a cross-shaped waveguide power divider to with an E-plane waveguide magic T and an ortho-mode transition through an E/H-plane 90° curved waveguide to form a new type of coaxial waveguide ortho-mode transition, thereby implementing the structure of coaxial circular waveguide feeding in high and low frequencies at the same time, reducing the length of the high-frequency transmission line, and reducing the transmission loss. Meanwhile, the present disclosure implements dual-polarization transmission in each frequency band, and can flexibly switch between vertical polarization and horizontal polarization when the dual-polarization has been converted to the single-polarization.

Microelectronic assemblies that include a lithographically-defined substrate integrated waveguide (SIW) component, and related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate portion having a first face and an opposing second face; and an SIW component that may include a first conductive layer on the first face of the package substrate portion, a dielectric layer on the first conductive layer, a second conductive layer on the dielectric layer, and a first conductive sidewall and an opposing second conductive sidewall in the dielectric layer, wherein the first and second conductive sidewalls are continuous structures.

A measuring bridge (1) provides a first matching pad (2), a second matching pad (3) and a third matching pad (4), wherein all matching pads (2, 3, 4) comprise at least three resistors (2.sub.1, 2.sub.2, 2.sub.3, 3.sub.1, 3.sub.2, 3.sub.3, 4.sub.1, 4.sub.2, 4.sub.3) which are arranged in a T-structure. A second resistor (3.sub.2) of the second matching pad (3) is connected to a second resistor (2.sub.2) of the first matching pad (2), and a third resistor (4.sub.3) of the third matching pad (4) is connected to a third resistor (2.sub.3) of the first matching pad (2). A second resistor (4.sub.2) of the third matching pad (4) can be connected to a device under test (7). A third resistor (3.sub.3) of the second matching pad (3) can be connected to a calibration standard (5), and a first resistor (3.sub.1, 4.sub.1) of the second and the third matching pad (3, 4) are connected in each case to a signal input of an element (11) which suppresses a common-mode component on its two signal inputs.

Microelectronic assemblies that include a lithographically-defined substrate integrated waveguide (SIW) component, and related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate portion having a first face and an opposing second face; and an SIW component that may include a first conductive layer on the first face of the package substrate portion, a dielectric layer on the first conductive layer, a second conductive layer on the dielectric layer, and a first conductive sidewall and an opposing second conductive sidewall in the dielectric layer, wherein the first and second conductive sidewalls are continuous structures.

A first waveguide guides a first radio wave whose electric field is vibrated in a first direction along a second direction. A second waveguide guides the first radio wave along the second direction and is cascade connected to the first waveguide. An input and output end multiplexes the first radio waves from the first and second waveguides and outputs the multiplexed radio wave, and outputs the first radio wave branched off from a radio wave from outside to the first and second waveguides. A first waveguide shift portion is shifted from the first waveguide in the first direction. A second waveguide shift portion is shifted from the second waveguide in the first direction. The vibration directions of electric fields of radio waves passing through the end parts of the first and second waveguide shift portions are rotated by 90° about a third direction.