An antenna device is provided. The antenna device includes: a first dielectric layer; a second dielectric layer disposed on the first dielectric layer; a third dielectric layer disposed between the first dielectric layer and the second dielectric layer; a feed via configured to penetrate the first dielectric layer; a first feed pattern disposed between the first dielectric layer and the third dielectric layer; a second feed pattern disposed between the second dielectric layer and the third dielectric layer and configured to overlap the first feed pattern; and a patch antenna pattern disposed on the second dielectric layer and configured to overlap the first feed pattern and the second feed pattern, wherein a dielectric constant of the third dielectric layer is less than a dielectric constant of the first dielectric layer and a dielectric constant of the second dielectric layer.

A simple multi-directional, multi-port array antenna structure is disclosed that can be used for a variety of applications, including but not limited to direction finding (DF) and beam-forming applications in receive and transmit modes, respectively. The disclosed antenna structure offers unique functionalities in both receive and transmit modes. For DF applications in the receive mode, the back-end of the antenna structure features a power sensing mechanism to monitor the power received at all ports. In the transmit mode, the disclosed antenna structure is used for beamforming applications by providing individual port excitation and using antenna arrays.

A single stage unequal power combiner is proposed. Instead of conventional combiner plus impedance transformer of 2-stage unequal combiner, the single stage combiner gets rid of the input impedance transformer. The single stage combiner supports adjustable transmission line impedance and reasonable mismatch loss, assuming the that power ratio of the input signals is within a certain range. The single stage combiner also has an adjustable isolation resistor for different power ratios. A structure of switchable branch characteristic impedance, switchable isolation resistor for the unequal combiner is proposed as the preferred embodiment. In one advantageous aspect, broader coverage angle in a single array module can be realized via an antenna diversity switch.

A semiconductor device package includes a substrate and a shielding layer. The substrate has a first surface, a second surface opposite to the first surface and a first lateral surface extending between the first surface and the second surface. The substrate has an antenna pattern disposed closer to the second surface than the first surface. The shielding layer extends from the first surface toward the second surface of the substrate. The shielding layer covers a first portion of the first lateral surface adjacent to the first surface of the substrate. The shielding layer exposes a second portion of the first lateral surface adjacent to the second surface of the substrate.

A method for monitoring a health parameter in a person is disclosed. The method involves transmitting radio waves below the skin surface of a person and across a range of stepped frequencies, receiving radio waves on a two-dimensional array of receive antennas, the received radio waves including a reflected portion of the transmitted radio waves across the range of stepped frequencies, generating data that corresponds to the received radio waves, wherein the data includes amplitude and phase data, deriving data from at least one of the amplitude and phase data, and determining a value that is indicative of a health parameter in the person in response to the derived data.

An antenna module includes an antenna substrate, a first semiconductor package, disposed on the antenna substrate, including a first connection member including one or more first redistribution layers, electrically connected to the antenna substrate, and a first semiconductor chip disposed on the first connection member, and a second semiconductor package, disposed on the antenna substrate to be spaced apart from the first semiconductor package, including a second connection member including one or more second redistribution layers, electrically connected to the antenna substrate, and a second semiconductor chip disposed on the second connection member. The first semiconductor chip and the second semiconductor chip are different types of semiconductor chips.

A semiconductor device package includes a first circuit layer and an emitting device. The first circuit layer has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The emitting device is disposed on the second surface of the first circuit layer. The emitting device has a first surface facing the second surface of the first circuit layer, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The emitting device has a conductive pattern disposed on the second surface of the emitting device. The lateral surface of the emitting device and the lateral surface of the first circuit layer are discontinuous.

An antenna module includes a first antenna element disposed at a first dielectric substrate, a second antenna element disposed at a second dielectric substrate, a joint connecting the first dielectric substrate and the second dielectric substrate, and a power supply line. The second dielectric substrate is different from the first dielectric substrate with respect to the normal direction. The power supply line extends from the first dielectric substrate via the joint to the second antenna element and is configured to communicate a radio-frequency signal to the second antenna element. At least a part of the power supply line at the joint is formed in a direction crossing the polarization plane of radio waves radiated by the first antenna element and the second antenna element.

An electronic device includes a multilevel package substrate with first, second, third, and fourth levels, a semiconductor die mounted to the first level, and a conductor backed coplanar waveguide transmission line feed with an interconnect and a conductor, the interconnect including coplanar first, second, and third conductive lines extending in the first level along a first direction from respective ends to an antenna, the second and third conductive lines spaced apart from opposite sides of the first conductive line along an orthogonal second direction, and the conductor extending in the third level under the interconnect and under the antenna.

Signal conductor patterns (21, 31) are respectively formed on a first main surface (101) and a second main surface (102) of an insulating substrate (100). Ground conductor patterns (222, 322) are formed on the first main surface (101) and the second main surface (102). A first conductive member (41) is formed in the insulating substrate (100) and electrically connects the signal conductor patterns (21, 31) in the thickness direction. A second conductive member (42) is formed in the insulating substrate (100) and connected to the ground conductor patterns (222, 322). A dielectric member (43) is disposed between the first conductive member (41) and the second conductive member (42), is in contact with the first conductive member (41) and the second conductive member (42), and has a dielectric constant different from the dielectric constant of the insulating substrate (100).