Provided is an electric device including a display panel, and a first antenna disposed on the display panel and including a first patch part, a first transmission part, and a first additional transmission part, wherein the first transmission part faces a first side of the first patch part extending along a first cross direction, is spaced apart from the first patch part, and is capacitively coupled to the first patch part, and wherein the first additional transmission part faces a second side of the patch part extending in a second cross direction crossing the first cross direction, is symmetrical about a line of symmetry with the first transmission part, and is spaced apart from the first patch part.

A thermal management system and process for use in a wireless access point antenna housing. The access point typically includes two or more stacked antenna housings or bays. Each bay includes an upper end, a lower end spaced from the upper end, and at least one sidewall surface extending between the upper end the lower end to define an enclosed interior area of the bay. Each bay typically includes a plurality of antennas. In an arrangement, the upper end, lower end and a one or more partitions between the upper and lower ends in conjunction with one or more sidewall surfaces form the antenna bays. In an arrangement, divider panels form the partitions and/or the upper and lower ends. Each partition panel includes one or more airflow channels that provide an air inlet and/or outlet for at least one adjacent antenna bay.

An antenna package according to an embodiment includes antenna units, and a circuit board electrically connected to the antenna units. The circuit board includes a core layer, antenna feeding lines distributed on a surface of the core layer and connected to the antenna units, power/data lines distributed on the surface of the core layer, power/data ports connected to end portions of the power/data lines, and antenna feeding ports connected to end portions of the antenna feeding lines and arranged to be closer to the antenna units than the power/data ports.

Disclosed is an electronic device including an antenna module comprising a first array antenna disposed on a first surface, a radio frequency integrated circuit (RFIC) disposed on a second surface which is parallel to the first surface, and a connector, a wireless communication circuit electrically connected with the antenna module through the connector, and a flexible printed circuit board (FPCB) electrically connected with the antenna module through the connector, the FPCB comprising a second array antenna, wherein the wireless communication circuit is configured to transmit and receive a first signal via the first array antenna, and to transmit and receive a second signal which is distinct from the first signal via the second array antenna

Methods of antenna pointing and antenna assemblies implementing those methods are disclosed. An example method includes providing a user terminal antenna assembly including an antenna and an auto-peak device. The antenna includes a reflector, a subreflector, and a feed, the feed oriented relative to the reflector and the subreflector to produce a beam. The antenna further includes a tilt assembly to tilt the subreflector relative to the reflector and the feed. The method further includes providing a control signal to tilt the subreflector in a plurality of tilt positions to move the beam while measuring corresponding signal strength of a signal communicated via the antenna at each of the plurality of tilt positions. Additionally, the method includes selecting a tilt position from the plurality of tilt positions based on a measured signal strength, and providing the control signal to tilt the subreflector to the selected tilt position.

An antenna design solution is provided. A metal frame and a PCB ground layer of an electronic device are used to form a slot. Through symmetric feeding and anti-symmetric feeding, the slot can be excited to generate two slot antenna patterns: a CM slot antenna pattern and a DM slot antenna pattern. In addition, the two slot antenna patterns share a same slot antenna radiator.

An antenna package according to an embodiment includes an antenna unit including a radiator, a transmission line extending from the radiator and an antenna ground pad disposed around the transmission line, and a circuit board electrically connected to the antenna unit. The circuit board includes a core layer, a circuit wiring layer disposed on one surface of the core layer, the circuit wiring layer including a signal transmission wiring electrically connected to the transmission line of the antenna unit and a first ground pattern bonded to the antenna ground pad, and a ground layer disposed on an opposite surface facing the one surface of the core layer. The ground layer does not overlap a portion of the antenna ground pad except for a region bonded to the first ground pattern in a planar view.

An electronic device includes: a side member forming sides of the electronic device, the side member including a first conductive portion, a second conductive portion, a first non-conductive portion, and a slit; a printed circuit board including the ground; and a wireless communication circuit, wherein the first conductive portion includes a first electrical path and a second electrical path, the second conductive portion includes a third electrical path and a fourth electrical path, a capacitor is arranged along the third electrical path, and the wireless communication circuit may feed, to the first conductive portion via the first electrical path, an RF signal of a first frequency band and may feed, to the second conductive portion via the third electrical path, an RF signal of a second frequency band which at least partially overlaps the first frequency band.

An antenna laminate according to an embodiment may include a display panel which includes an electrode structure, a dielectric layer disposed on the display panel, an antenna conductive layer disposed on the dielectric layer, and a lower ground layer disposed on a lower side of the display panel and having a lower resistance than the display panel.

A heat dissipation apparatus and antenna assembly using the same is disclosed herein. According to an embodiment of the present disclosure, a heat dissipation apparatus configured to cool a circuit board including at least one heat generation element is provided, the heat dissipation apparatus including: a plate disposed to face the circuit board; a plurality of first heat dissipation fins disposed in a first direction on one surface of the plate spaced apart from the circuit board; and a blowing unit disposed to face the one surface of the plate, the blowing unit including at least one fan configured to discharge air toward the one surface of the plate, wherein a space between two adjacent first heat dissipation fins defines a side flow path configured to guide the air discharged from the at least one fan.