A low-profile array and a low-profile radiating element including: a stripline feed layer; a High Order Floquet (HOFS) part layer; and a radome layer in direct contact with the HOFS part layer, where the HOFS part layer is disposed between the stripline feed layer and the radome layer, and the radome layer includes a high dielectric constant (dk) environmentally robust material.

The present disclosure provides an electronic package. The electronic package includes an antenna structure having a first antenna and a second antenna at least partially covered by the first antenna. The electronic package also includes a directing element covering the antenna structure. The directing element has a first portion configured to direct a first electromagnetic wave having a first frequency to transmit via the first antenna and a second portion configured to direct a second electromagnetic wave having a second frequency different from the first frequency to transmit via the second antenna. A method of manufacturing an electronic package is also provided.

A solar battery unit (100) is provided that includes: a substrate (120); a solar battery (110) attached to a back face of the substrate (120); and a communications module (130) attached to the substrate (120). The communications module (130) includes an antenna (132) disposed so as not to overlap solar cells (115) in the solar battery (110) in a front view.

A package structure includes a semiconductor die, an insulating encapsulant, a first redistribution layer, a second redistribution layer, antenna elements and a first insulating film. The insulating encapsulant is encapsulating the at least one semiconductor die, the insulating encapsulant has a first surface and a second surface opposite to the first surface. The first redistribution layer is disposed on the first surface of the insulating encapsulant. The second redistribution layer is disposed on the second surface of the insulating encapsulant. The antenna elements are located over the second redistribution layer. The first insulating film is disposed in between the second redistribution layer and the antenna elements, wherein the first insulating film comprises a resin rich region and a filler rich region, the resin rich region is located in between the filler rich region and the second redistribution layer and separating the filler rich region from the second redistribution layer.

An antenna suitable for use in the 5 GHz WLAN/Wi-Fi and DSRC frequency band is integrated with a vehicle window that is includes outer and inner transparent plies bonded together by an interlayer. The inner transparent ply and the interlayer serve as an antenna substrate. A first conductive layer is formed on the inner surface of the outer transparent ply and a second conductive layer that defines a coupling slot is formed on the outer surface of the inner transparent ply. The antenna may be excited by a coaxial cable or a microstrip line that crosses the coupling slot.

A portable electronic device can include a housing defining an internal volume and an opening. The device can also include a rear cover disposed in the opening, with an inner surface of the rear cover defining the internal volume, and a conductive antenna component embedded within the rear cover.

A portable electronic device can include a housing defining an internal volume and an opening. The device can also include a rear cover disposed in the opening, with an inner surface of the rear cover defining the internal volume, and a conductive antenna component embedded within the rear cover.

Antenna having a housing (3), a core (1) and a coil (2), which is wound around the core (1), the core (1) with the coil (2) in a potting compound (5) being mounted in the housing (3), the potting compound (5) being softer than 40 Shore A.

A semiconductor package includes an antenna structure including an antenna member configured to transmit and receive a signal through the first surface in the dielectric layer, a connection via extending from the antenna member toward the second surface, and a ground member spaced apart from the connection via; a frame surrounding the side surface of the antenna structure; a first encapsulant covering at least a portion of the antenna structure and the frame; a redistribution structure on the second surface and including an insulating layer in contact with the antenna structure and the frame, and a redistribution conductor configured to be electrically connected to the ground member and the connection via in the insulating layer; a first semiconductor chip on the redistribution structure and electrically connected to the antenna member through the redistribution conductor; a second encapsulant encapsulating the first semiconductor chip on the redistribution structure; and a shielding layer surrounding a surface of the second encapsulant.

A semiconductor device package includes a substrate and an antenna module. The substrate has a first surface and a second surface opposite to the first surface. The antenna module is disposed on the first surface of the substrate with a gap. The antenna module has a support and an antenna layer. The support has a first surface facing away from the substrate and a second surface facing the substrate. The antenna layer is disposed on the first surface of the support. The antenna layer has a first antenna pattern and a first dielectric layer.