A base configured to be joined with other bases to form a substrate for an antenna array comprises a body, a plurality of male interconnecting features, and a plurality of female interconnecting features. The body includes a front surface and a rear surface and a plurality of edges positioned therebetween. The front surface or the rear surface is configured to retain an antenna. The male interconnecting features of a first base connect with the female interconnecting features of a second base when the first base is joined with the second base to form the substrate or a portion of the substrate.

A field-assembled satellite communications terminal has a plurality of discrete, modular aperture blocks. Each aperture block contains an electrically steered antenna aperture, and a plurality of interconnection ports for power and data communications between the plurality of aperture blocks. The plurality of interconnection ports are removably connectable by the end user in the field. The terminal further has a signal processing system for receiving, processing, and generating signals to and from the apertures. The aperture blocks are connected to each other in the field and self-configure to form an electrically-steered antenna.

Methods and systems for implementing and operating antennas, particularly multiple-input and multiple-output (MIMO) antennas. An example antenna may include a planar dielectric substrate, a primary conductive area on a first surface of the planar dielectric substrate, a first secondary conductive area on the first surface, and a second secondary conductive area, and a ground plane on a second surface, on other side of the planar dielectric substrate. The primary conductive area may have a shape defining a first region of the first surface bounded by at least a portion of the primary conductive area, and a second region that includes a remaining portion of the first surface; a first secondary conductive area on the first surface, wherein the first secondary conductive area lies in the first region of the first surface. The second secondary conductive area may be provided on the first surface, and may lie in the second region.

An antenna module that includes an antenna substrate, a plurality of three-dimensional (3-D) antenna cells on a first surface of the antenna substrate, a plurality of packaged circuitry on a second surface of the antenna substrate, and a plurality of supporting balls mounted on the second surface of the antenna substrate. The plurality of packaged circuitry includes a plurality of radio-frequency (RF) chips on the second surface of the antenna substrate. Each of the plurality of 3-D antenna cells comprises a raised antenna patch with a plurality of projections and a plurality of supporting legs, where at least a relief cut is provided between one of the plurality of projections and one of the plurality of supporting legs.

An antenna structure according to an embodiment of the present disclosure includes an antenna unit array including a plurality of antenna units, and a parasitic element disposed to be adjacent to the antenna units and to be electrically and physically separated from the antenna units. Each of the antenna units includes a radiator, and a transmission line including a first transmission line and a second transmission line connected to the radiator in different directions. The parasitic element includes a first parasitic element disposed between the first transmission line and the second transmission line included in the same antenna unit, and a second parasitic element disposed between the first transmission line and the second transmission line included in different neighboring antenna units. The second parasitic element includes a branched portion including a first branched portion and a second branched portion bent in different directions.

An apparatus is provided that includes a set of antenna elements and switching nodes. Each switching node has physical interconnects to a sub-set of the antenna elements for transferring communication signals and the switching nodes have physical interconnects to other switching nodes forming a network of switching nodes for transferring communication signals between switching nodes. The apparatus also includes a controller for controlling operation of switching nodes to control use of the physical interconnects between switching nodes and control creation of different patterns of antenna elements operationally interconnected via multiple operationally interconnected switching nodes.

An electronic device is provided. An electronic device includes a radio frequency integrated circuit (RFIC) chip, and an antenna array electrically connected to the RFIC chip, the antenna array including a first face and a second face facing each other in a first direction, and a third face and a fourth face connecting the first and second faces to each other and facing each other in a second direction intersecting the first direction, the antenna array including a plurality of substrates sequentially stacked in a third direction intersecting a plane defined by the first and second directions, first and second antenna modules on the plurality of substrates and sequentially arranged along the first direction, a first metal partition-wall including at least one metal via extending through the plurality of substrates in the third direction, and a second metal partition-wall surrounding the first to fourth faces.

An apparatus includes a plurality of conductive structures having first sides and second sides opposite the first sides, wherein the second sides of the plurality of conductive structures are configured to be physically coupleable with a printed circuit board (PCB) of a receiver or a transmitter. The first sides of the plurality of conductive structures are configured to be spaced from the PCB by a first distance when the plurality of conductive structures is physically coupled with the PCB. The apparatus includes an antenna having a first side and a second side opposite the first side. The first side of the antenna includes a radiating side of the antenna and the second side of the antenna is disposed closer to the plurality of conductive structures than the first side of the antenna when the plurality of conductive structures is physically coupled with the PCB.

The disclosure relates to a pre-5.sup.th-Generation (5G) or 5G communication system for supporting higher data rates Beyond 4.sup.th-Generation (4G) communication system, such as long term evolution (LTE). An antenna device is provided. The antenna device includes a first printed circuit board (PCB), a second PCB for a plurality of antenna elements, and a radio frequency integrated circuit (RFIC) coupled through a first surface of the first PCB. The second PCB may include a radio frequency (RF) routing layer including RF lines for the respective plurality of antenna elements. The first PCB may include a feeding structure for connecting the RF routing layer and the RFIC. The second PCB may be electrically connected to a second surface of the first PCB opposite to the first surface of the first PCB, through a first surface of the second PCB. The second PCB may be coupled to the plurality of antenna elements.

The present disclosure relates to an antenna element comprising a lower conducting plane, an upper conducting plane and an upper dielectric layer structure that is positioned between the conducting planes. The upper dielectric layer structure comprises a plurality of conducting vias that electrically connect the conducting planes to each other and circumvent an upper radiating patch formed in, below or above the upper conducting plane. The conducting vias circumvent at least one intermediate radiating patch that is formed in the upper dielectric layer structure, and a lowest intermediate radiating patch that is closest to the lower conducting plane is connected to a feed arrangement that comprises at least one feeding probe that extends via a corresponding aperture in the lower conducting plane and is electrically connected to the lowest intermediate radiating patch.