An antenna arrangement comprising a SIW with at least one radiating arrangement. The SIW comprises a dielectric material, a first and second metal layer and a first and second electric wall element running essentially parallel and electrically connecting the metal layers. For each radiating arrangement, the antenna arrangement comprises at least one coupling aperture in the first metal layer, and for each coupling aperture there is a third wall element running between the first and second electric wall elements, across a SIW longitudinal extension (e.sub.s). For each radiating arrangement, the antenna arrangement further comprises an at least partly electrically conducting antenna component which comprises at least four radiating elements and is surface-mounted on the first metal layer, enclosing at least one coupling aperture. For each radiating arrangement, electromagnetic signals are arranged to be transmitted between said coupling aperture and said radiating elements.

A leaky travelling wave array of elements provide a broadband radio frequency antenna.

A multi-band radiating array includes a planar reflector, first radiating elements defining a first column on the planar reflector, second radiating elements defining a second column on the planar reflector alongside the first column, and third radiating elements interspersed between the second radiating elements in the second column. The first radiating elements have a first operating frequency range, the second radiating elements have a second operating frequency range that is lower than the first operating frequency range, and the third radiating elements have a third, narrowband operating frequency range that is higher than the second operating frequency range but lower than the first operating frequency range. Respective capacitors are coupled between elongated arm segments and an elongated stalk of the third radiating elements, and a common mode resonance of the third radiating elements is present in a lower frequency range than the second operating frequency range.

Systems and methods are provided for a digital beamformed phased array feed. The system may include a radome configured to allow electromagnetic waves to propagate; a multi-band software defined antenna array tile; a power and clock management subsystem configured to manage power and time of operation; a thermal management subsystem configured to dissipate heat generated by the multi-band software defined antenna array tile; and an enclosure assembly. The multi-band software defined antenna array tile may include a plurality of coupled dipole array antenna elements; a plurality of frequency converters; and a plurality of digital beamformers.

The suprastructure over a substrate integrated waveguide (SIW) can provide for beam scanning utilizing a reconfigurable metasurface. The reconfigurable metasurface will have a plurality of PIN diode arrays that can be turned ON and OFF. In one design, the length of the reconfigurable metasurface is effectively enlarged or reduced in size to achieve beam scanning. In another design the tilt angle of the reconfigurable metasurface is adjusted to achieve beam scanning. The suprastructure also can be modified with metallic offset wings, where two or more pairs of offset wing can form a horn shaped element. The presence of the wings or horn, as well as control of the size and number of the wings can improve the gain of the SIW. These two suprastructure improvements may be used in combination, and they may be used over classical slotted SIWs or over an SIW with curved sections between consecutive slots.

An antenna assembly includes a dielectric layer having a upper side and a lower side, a ground plane disposed on the lower side of the dielectric layer, two antenna elements supported by and disposed on the upper side layer of the dielectric layer and a magneto-dielectric disposed between the two antenna elements.

This document describes techniques and apparatuses for a plastic air-waveguide antenna with conductive particles. The described antenna includes an antenna body made from a resin embedded with conductive particles, a surface of the antenna body that includes a resin layer with no or fewer conductive particles, and a waveguide structure. The waveguide structure can be made from a portion of the surface on which the embedded conductive particles are exposed. The waveguide structure can be molded as part of the antenna body or cut into the antenna body using a laser, which also exposes the conductive particles. If the waveguide is molded as part of the antenna body, the conductive particles can be exposed by an etching process or by using the laser. In this way, the described apparatuses and techniques can reduce weight, improve gain and phase control, improve high-temperature performance, and avoid at least some vapor-deposition plating operations.

There is disclosed a reconfigurable antenna device comprising a plurality of antennas disposed about a periphery of a substantially rectangular shape having top, bottom, left and right sides. The antenna device includes a first balanced antenna having first and second radiating arms each having a proximal portion and a distal portion, proximal portions extending along the top side in respectively opposed directions from a substantially central feed point, and the distal portions extending part way down the left and right sides. The antenna device further includes a first unbalanced antenna located generally between the distal portions and adjacent to the proximal portions of the first and second radiating arms. In addition, the antenna device includes a second balanced antenna having a first radiating arm extending up the left side from a feed peed point in a bottom left corner of the periphery and a second radiating arm extending along the bottom side from the feed point in the bottom left corner of the periphery, and a third balanced antenna having a first radiating arm extending up the right side from a feed point in a bottom right corner of the periphery and a second radiating arm extending along the bottom side from the feed point in the bottom right corner of the periphery.

An integrated antenna array device includes a circuitry component layer having bounds defining a circuitry zone. The circuitry component layer includes beam steering circuitry. The integrated antenna array device also includes an antenna component layer affixed to the circuitry component layer in the circuitry zone. The antenna component layer includes a radiating region and an interconnecting region. The radiating region is outside the circuitry zone and includes one or more antenna arrays having radiating antenna elements. The interconnecting region is substantially defined within the circuitry zone and interconnects the beam steering circuitry with the one or more radiating elements.

An electronic device is provided. The electronic device includes a housing including a first plate, a second plate facing a direction opposite to the first plate, and a lateral member surrounding a space between the first and second plates and connected to or integrally formed with the second plate. The electronic device further includes a display disposed in the space so as to be visible from outside through at least a part of the first plate, and at least one antenna structure disposed in the space, including a first surface and a second surface facing a direction opposite to the first surface, and including a first area and a second area surrounded by the first area when viewed from above the first surface. The antenna structure may also include a plurality of insulating layers disposed between the first and second surfaces, first conductive patches disposed in the first area, when viewed from above the first surface, and disposed on the first surface or on a first insulating layer closer to the first surface than the second surface, a second conductive patch overlapped at least in part with the second area, when viewed from above the first surface, and disposed on a second insulating layer between the first insulating layer and the second surface, a ground layer disposed on a third insulating layer between the second insulating layer and the second surface or on the second surface, and one or more conductive walls formed along at least a portion of an outer periphery of the first area, when viewed from above the first surface, and extended from the first insulating layer to the ground layer. The electronic device includes at least one wireless communication circuit electrically connected to the second conductive patch and configured to at least one of transmit or receive a signal having a frequency between about 3 GHz and about 100 GHz.