Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a device may receive layout information that identifies a configuration of an antenna array of antennas, wherein the antenna array is to include a plurality of antenna subarrays and a plurality of antenna chips, wherein each antenna chip is communicatively coupled to antennas of an associated antenna subarray; determine, based at least in part on a phase shift characteristic associated with the antennas, a set of phase differences between antenna subarrays; determine, based at least in part on the set of phase differences, a chip position of each antenna chip relative to the associated antenna subarray; and generate, based at least in part on the chip position of each antenna chip, a layout of an antenna package to receive the antenna array and the plurality of antenna chips. Numerous other aspects are provided.

A device for mounting a cross beam in a base station antenna is provided. The device comprises a first knob formed on a first wall of the device, the first knob comprising a first shaft portion and a first head portion. The device further comprises a second knob formed on a second wall of the device, the second wall is arranged adjacent to the first wall. the second knob comprising a second shaft portion and a second head portion. The first shaft portion of the first knob is adapted to be received in a keyhole defined in the cross beam of base station antenna. The second shaft portion of the second knob in adapted to be received in a first slot defined in a reflector of base station antenna. The device eliminates requirement of hardware elements such as bolts, washers etc to mount cross beam in base station antenna.

There is provided an antenna structure for a radio frequency identification (RFID) reader. The antenna structure includes a substrate, and an antenna structure disposed on the substrate. The antenna includes a peripheral frame portion, a first strip section disposed at a first side of the peripheral frame portion, and a second strip section disposed at a second side of the peripheral frame portion. In particular, the first strip section and the second strip section each includes multiple spaced-apart strip portions extending from a first part of the peripheral frame portion to a second part of the peripheral frame portion. There is also provided a method of manufacturing the antenna structure, an RFID reader system including the antenna structure, and an RFID system including the RFID reader system and an RFID tag.

A phased array antenna includes multiple antenna elements where each antenna element is an antenna apparatus that includes an antenna integrated with a filter. Each antenna apparatus includes a plurality of resonators where at least some of the resonators are each enclosed in a metal cavity and at least one resonator is exposed to free space to form a radiator element. Each antenna apparatus has a filter transfer function that is at least partially determined by dimensions of the radiator element and the position of the radiator element within the antenna apparatus. The scan volume of the phased array antenna is dependent on at least one physical dimension of the filter of the antenna apparatus.

A wave phased array is manufactured using additive manufacturing technology (AMT). The wave phased array includes a radiator, a radiator dilation layer supporting the radiator, a beamformer supporting the radiator dilation layer, a beamformer dilation layer supporting the beamformer, and a substrate support layer supporting the beamformer dilation layer. At least one of the radiator, the radiator dilation layer, the beamformer, the beamformer dilation layer and the substrate support layer is fabricated at least in part by an AMT process.

The disclosure relates to a 5.sup.th generation (5G) or pre-5G communication system for supporting a data transmission rate higher than that of a 4.sup.th generation (4G) communication system such as long term evolution (LTE). An electronic device including an antenna in a wireless communication system is provided. The electronic device includes a radiator, a body, and a feeding circuit for transmitting a signal, wherein the radiator is coupled to at least a part of the body, the feeding circuit is coupled to the body to support the body, and the radiator is disposed to be spaced apart from the feeding circuit to form an air gap.

An antenna module and a method for manufacturing an antenna module are provided. The antenna module includes a first dielectric substrate, a first antenna and a second antenna. The first dielectric substrate has a top surface, a bottom surface and a first side surface between the top surface and the bottom surface. The first antenna is formed on the top surface of the first dielectric substrate. The second antenna is formed on the first side surface of the first dielectric substrate.

Structures and formation methods of a chip package are provided. The chip package includes a semiconductor die having a conductive element and an antenna element over the semiconductor die. The chip package also includes a first conductive feature electrically connecting the conductive element of the semiconductor die and the antenna element. The chip package further includes a protective layer surrounding the first conductive feature. In addition, the chip package includes a second conductive feature over the first conductive feature. A portion of the second conductive feature is between the first conductive feature and the protective layer.

A 5G antenna system is disclosed that comprises a substrate and at least one antenna element configured to transmit and receive 5G radio frequency signals. The at least one antenna element is coupled to the substrate. The substrate comprises a polymer composition that comprises a polymer matrix containing at least one polymer having a glass transition temperature of about 30° C. or more and at least one laser activatable additive wherein the polymer composition exhibits a dissipation factor of about 0.1 or less, as determined at a frequency of 2 GHz.

An apparatus includes a plurality of conductive structures having first sides and second sides opposite the first sides, wherein the second sides of the plurality of conductive structures are configured to be physically coupleable with a printed circuit board (PCB) of a receiver or a transmitter. The first sides of the plurality of conductive structures are configured to be spaced from the PCB by a first distance when the plurality of conductive structures is physically coupled with the PCB. The apparatus includes an antenna having a first side and a second side opposite the first side. The first side of the antenna includes a radiating side of the antenna and the second side of the antenna is disposed closer to the plurality of conductive structures than the first side of the antenna when the plurality of conductive structures is physically coupled with the PCB.