An antenna includes a first radiating layer including a first radiation patch, a slit formed in the first radiation patch, and a first feed point provided in the first radiation patch, a second radiating layer including a second radiation patch provided below the first radiation patch and a second feed point provided in the second radiation patch, a feeding layer including a coupling patch provided below the second radiation patch and at least one ground point provided in the coupling patch, a ground layer provided below the coupling patch, a feed line provided between the second radiation patch and the ground layer and including a third feed point, a signal via connecting the first feed point, the second feed point, and the third feed point, and a ground via connecting the at least one ground point and the ground layer.

An antenna is described. The antenna includes a first plurality of first elements. Each of the first elements is dual polarized and configured to support a first set of bands and a second set of bands that is mutually exclusive from the first set of bands. The antenna also includes a second plurality of second elements. Each of the second elements is dual polarized and configured to support the second set of bands. The second plurality of second elements is interleaved with the first plurality of first elements.

A low-profile array and a low-profile radiating element including: a stripline feed layer; a High Order Floquet (HOFS) part layer; and a radome layer in direct contact with the HOFS part layer, where the HOFS part layer is disposed between the stripline feed layer and the radome layer, and the radome layer includes a high dielectric constant (dk) environmentally robust material.

Disclosed are a microstrip antenna and a television. The microstrip antenna comprises a substrate, an excitation layer and a grounding layer which are provided on the substrate, and a feed unit and a coupling structure which are provided in the excitation layer. The feed unit is electrically connected to the excitation layer. A coupling layer and the excitation layer are electrically connected to the grounding layer. The coupling structure comprises the coupling layer and a dielectric layer. The dielectric layer is located between the excitation layer and the coupling layer. The coupling layer and the excitation layer are electrically connected to the grounding layer.

UWB Antenna comprising: a first substrate layer (10); a second substrate layer (20); a conductive ground layer (300) arranged on a first side of the first substrate layer and connected to a ground terminal; a first conductive layer (100) arranged between the first substrate layer (10) and the second substrate layer (20), wherein a central portion (140) of the first conductive layer (100) is connected to the feed terminal (3), wherein the first conductive layer (100) has a shape with a plurality of arms extending radially from the central portion (140), wherein the plurality of arms (110, 120, 130) is connected in its distal portion (111, 121, 131) with the ground layer (300); a second conductive layer (200) arranged on a second side of the second substrate layer (20, 20′), wherein the layers (10, 20, 100, 200, 300) are realised with a multilayer circuit board.

The invention discloses shared-aperture dual-band dual-polarized antenna array and communication equipment. The antenna array comprises a first dielectric substrate, a second dielectric substrate, a third dielectric substrate, a fourth dielectric substrate, and a fifth dielectric substrate. The first dielectric substrate, the second dielectric substrate, and the third dielectric substrate constitute a dielectric substrate group. The dielectric substrate group is provided with a low-frequency antenna element and four high-frequency antenna elements. The low-frequency antenna element is loaded with a filtering structure. The low-frequency antenna element and the high-frequency antenna element are fed by coaxial lines. The fourth dielectric substrate and the fifth dielectric substrate form a dual-function metasurface. When the dual-function metasurface is used as an artificial magnetic conductor reflector, the radiation of the low-frequency antenna element is enhanced in a low profile, and when used as a frequency selective surface, the electromagnetic scattering of the low-frequency antenna element in the high-frequency band is suppressed. Compared with the existing solutions, the present invention is more compact, and maintains high cross-band isolation and stable radiation patterns in dual bands.

A Wi-Fi antenna device is disclosed. The Wi-Fi antenna device comprises a ground plane, a plurality of first inverted-F antennas, a plurality of second inverted-F antennas and a plurality of third inverted-F antennas, thereby being capable of transceiving multi-band wireless signals. Particularly, there is an included angle between any two of the first inverted-F antennas. In the same way, any two of the second inverted-F antennas and any two of the third inverted-F antennas are both arranged to have said included angle therebetween. By such an arrangement, an omni radiation pattern can be measured on X-Y plane, X-Z plane and Y-Z plane in case of this novel Wi-Fi antenna device being applied in an environment. Therefore, the Wi-Fi antenna device according to the present invention has a significant potential for replacing the conventional multi-band antenna so as to be applied in a Wi-Fi router.

An antenna structure includes a main radiator element, a parasitic radiator element, a feeder and at least one first high-impedance member. The parasitic radiator element is disposed in parallel with the main radiator element. The feeder is configured to electrically or electromagnetically couple the main radiator element. The at least one first high-impedance member directly contacts the parasitic radiator element and is configured to be electrically grounded.

The present disclosure provides an electronic package. The electronic package includes an antenna structure having a first antenna and a second antenna at least partially covered by the first antenna. The electronic package also includes a directing element covering the antenna structure. The directing element has a first portion configured to direct a first electromagnetic wave having a first frequency to transmit via the first antenna and a second portion configured to direct a second electromagnetic wave having a second frequency different from the first frequency to transmit via the second antenna. A method of manufacturing an electronic package is also provided.

Techniques are provided for improving the performance of a multi-band antenna in a wireless device. An example wireless device includes at least one radio frequency integrated circuit, and at least one patch antenna operably coupled to the at least one radio frequency integrated circuit, including a first patch operably coupled to the at least one radio frequency integrated circuit, a ground plane disposed below the first patch, and a plurality of via wall structures disposed around the first patch, wherein each of the plurality of via wall structures is electrically coupled to the ground plane.