In one embodiment, an RFID device is disclosed that contains a first conductive structure and a second conductive structure formed from multiple conductive materials configured to move between a first operating condition and a second operating condition when exposed to an event or other stimuli. The second conductive structure is initially operatively coupled to the first conductive structure in the first operating condition. However, after exposure to the event, the first conductive structure is altered to change the behavior of the RFID device. The RFID device is attachable to a substrate, such as a garment or a fabric, and the event may be a single or multiple occurrence event, such as washing, stretching, heating, or exposure of the RFID device to electrical signals.

An antenna device according to an embodiment includes an array antenna including a plurality of antenna elements, a first flexible printed circuit board (FPCB) including a plurality of first transmission lines which are electrically connected to the plurality of antenna elements and have different lengths, and a radio frequency integrated circuit (RFIC) electrically connected to the plurality of first transmission lines.

An electronic device including a plurality of antennas is provided. The electronic device includes a housing, a first antenna disposed in the housing, a second antenna disposed in the housing, and spaced apart from the first antenna, a printed circuit board disposed in the housing and a wireless communication circuit disposed on the PCB, and transmitting or receiving a RF signal of a frequency band through the first antenna and the second antenna, the first antenna includes a first dielectric substrate including a first surface and a second surface facing away from the first surface, a first conductive pattern disposed on the first surface, and operating as an antenna radiator for transmitting or receiving an RF signal of a first frequency band and a second conductive pattern disposed on the second surface, and operating as an antenna radiator for transmitting or receiving an RF signal of the first frequency band.

A package structure includes a semiconductor die, an insulating encapsulant, a first redistribution layer, a second redistribution layer, antenna elements and a first insulating film. The insulating encapsulant is encapsulating the at least one semiconductor die, the insulating encapsulant has a first surface and a second surface opposite to the first surface. The first redistribution layer is disposed on the first surface of the insulating encapsulant. The second redistribution layer is disposed on the second surface of the insulating encapsulant. The antenna elements are located over the second redistribution layer. The first insulating film is disposed in between the second redistribution layer and the antenna elements, wherein the first insulating film comprises a resin rich region and a filler rich region, the resin rich region is located in between the filler rich region and the second redistribution layer and separating the filler rich region from the second redistribution layer.

A sensor may include a bladder, and a deformable conductor disposed on the bladder such that deformation of the bladder causes deformation of the deformable conductor, wherein the bladder is constrained so as to enhance the deformation of the conductor in response to the deformation of the bladder. A method may include applying a stimulus to a bladder having a deformable conductor attached thereto, detecting a change in an electrical characteristic associated with the deformable conductor in response to the stimulus, and selectively constraining the bladder to amplify the change in electrical characteristic in response to the stimulus.

An antenna system capable of operating among all LTE bands, and also capable of operation among all remote side cellular applications, such as GSM, AMPS, GPRS, CDMA, WCDMA, UMTS, and HSPA among others. The antenna system provides a low cost alternative to active-tunable antennas suggested in the prior art for the same multi-platform objective.

A distributing/synthesizing circuit includes first to fourth ports. A first radio frequency circuit transmits and receives a radio frequency signal to and from the first port through a first transmission line. A second transmission line is connected to the second port. A first radiating element is connected to the third port and the fourth port through a third transmission line and a fourth transmission line, respectively. The distributing/synthesizing circuit distributes and outputs the radio frequency signal input to the first port to the third port and the fourth port, synthesizes radio frequency signals that are reflected by the first radiating element and that are input to the third port and the fourth port to output the synthesized radio frequency signal to the second port. The second transmission line is longer than all of the first transmission line, the third transmission line, and the fourth transmission line.

An electronic device may comprise: a display; an antenna module including at least one antenna; a conductive connection member comprising a conductive material; and at least one antenna structure. The display may be arranged in the inner space of a housing to be visible from the outside and may include a curved side surface portion. The antenna module may be arranged in the inner space of the housing. The conductive connection member may be electrically connected to the antenna module. The at least one antenna structure may be arranged on a side surface portion of the display. The conductive connection member may electrically connect the antenna structure to the antenna module. The antenna structure may include at least one first-type antenna and at least one second-type antenna configured to radiate radio waves in different directions.

An antenna module includes a first antenna layer, including at least one main radiation unit including at least two main radiation patches symmetrically arranged and spaced apart from each other and at least one feeder portion located at or corresponds to a gap between adjacent two of the main radiation patches; a second antenna layer, stacked with the first antenna layer and including a reference ground arranged opposite to the main radiation patches and at least one microstrip insulated from the reference ground; at least one first electrically conductive member, electrically connected to the main radiation patches and the reference ground; and at least one second electrically conductive member, with an end being electrically connected to the feeder portion and another end being electrically connected to another end of the microstrip. An end of the microstrip is electrically connected to a radio frequency transceiver chip.

An antenna structure includes a substrate, a radiator mounted at an upper portion of a front surface of the substrate, and a grounding element mounted at a lower portion of the front surface of the substrate. The radiator has a first radiating portion. A lower edge of the first radiating portion extends downward to form a second radiating portion. Two portions of a middle of the lower edge of the first radiating portion extend downward to form a third radiating portion and a feeding portion. A free end of the feeding portion is a feeding end. One side edge of the first radiating portion is recessed inward to form a recess. The grounding element has a first grounding portion and a second grounding portion. The first grounding portion and the second grounding portion are located to two sides of the feeding portion, respectively.