A radiofrequency transmission/reception device includes a first and a second conductive wire element, a first far-field transmission/reception chip and a second near-field transmission/reception chip. The first and the second wire element combine with the characteristic impedance of the second transmission/reception chip in order to form a coupling device associated with the first transmission/reception chip at the operating frequency of the first chip. The first and the second wire element combine with the characteristic impedance of the first transmission/reception chip in order to form a coupling device associated with the second transmission/reception chip at the operating frequency of the second chip.

A semiconductor device package includes a glass carrier, a package body, a first circuit layer and a first antenna layer. The glass carrier has a first surface and a second surface opposite to the first surface. The package body is disposed on the first surface of the glass carrier. The package body has an interconnection structure penetrating the package body. The first circuit layer is disposed on the package body. The first circuit layer has a redistribution layer (RDL) electrically connected to the interconnection structure of the package body. The first antenna layer is disposed on the second surface of the glass carrier.

Disclosed is an electronic device including a housing, a wireless communication module, and an antenna module operatively connected to the wireless communication module and disposed inside the housing, wherein the antenna module includes a first substrate comprising at least one feed line, a first surface disposed in a first direction, and a second surface disposed in a second direction opposite the first surface, a second substrate disposed on the first surface of the first substrate and having a first antenna array and a second antenna array disposed on the second substrate, and a third substrate disposed in a portion of the second surface of the first substrate and having a third antenna array and a fourth antenna array disposed on the third substrate, wherein the second substrate and/or the third substrate is formed of a material having a higher permittivity than the first substrate.

An oscillator antenna unit and an antenna are disclosed. The oscillator antenna comprises a plurality of oscillator arms and a guiding sheet. The plurality of oscillator arms extend outwards along a middle axle of the oscillator antenna unit and are arranged at an interval from one another. Extension directions of the oscillator arms form a first plane, and the guiding sheet parallel to the first plane is arranged above the oscillator arms and has a predetermined interval therewith. The antenna comprises at least two oscillator antenna units arranged in an array. Therefore, the technical solution of the embodiment of the present disclosure may improve the isolation and achieve a better decoupling effect.

An inflatable beacon antenna assembly includes an inflatable sock, an antenna, an attachment port, and a ballast. The inflatable sock may have an inflated state and a deflated state, where the inflatable sock assumes an elongated configuration in the inflated state. The antenna may extend along the length of the inflatable sock. The attachment port may be configured for operable connection to an inflation mechanism. Two or more integrated antennas can be used for multi-frequency VHF/UHF beacon operation and/or a GPS antenna for position location.

A filter which stops the propagation of an electromagnetic wave of a predetermined frequency band in a signal line or a power supply line is provided. This filter is a conductor connected to the signal line or the power supply line. This conductor is configured to include a linear portion. The first portion of the linear portion with an end portion connected to the signal line or the power supply line has the first width, and the second portion different from the first portion of the linear portion has the second width different from the first width.

An example method of designing a multi-band antenna includes specifying a first portion of the multi-band antenna in a tangible medium, where the first portion corresponds to an existing design of a single-band monopole antenna for operating in a first frequency band, and specifying in the tangible medium a second portion of the multi-band antenna that is added to the first portion, where the second portion includes a dipole parasitic resonator that is resonant in a second frequency band.

An example method of designing a multi-band antenna includes specifying a first portion of the multi-band antenna in a tangible medium, where the first portion corresponds to an existing design of a single-band monopole antenna for operating in a first frequency band, and specifying in the tangible medium a second portion of the multi-band antenna that is added to the first portion, where the second portion includes a dipole parasitic resonator that is resonant in a second frequency band.

Aspects of the subject disclosure may include, for example, an integrated circuit that includes at least one die having transceiver circuitry that generates outbound signals that convey outbound data and that receives inbound signals that convey inbound data. A first array of antenna elements arranged along the top portion of the IC package operate in conjunction with the transceiver circuitry to transmit at least a first portion of the outbound signals as first wireless transmissions and/or generate at least a first portion of the inbound signals from first wireless receptions. A second array of antenna elements arranged along the bottom portion of the IC package operate in conjunction with the transceiver circuitry to transmit at least a second portion of the outbound signals as second wireless transmissions and/or to generate at least a second portion of the inbound signals from second wireless receptions. Other embodiments are disclosed.

Aspects of the subject disclosure may include, for example, an integrated circuit that includes at least one die having transceiver circuitry that generates outbound signals that convey outbound data and that receives inbound signals that convey inbound data. A first array of antenna elements arranged along the top portion of the IC package operate in conjunction with the transceiver circuitry to transmit at least a first portion of the outbound signals as first wireless transmissions and/or generate at least a first portion of the inbound signals from first wireless receptions. A second array of antenna elements arranged along the bottom portion of the IC package operate in conjunction with the transceiver circuitry to transmit at least a second portion of the outbound signals as second wireless transmissions and/or to generate at least a second portion of the inbound signals from second wireless receptions. Other embodiments are disclosed.