An electrical contact for use with an electrical connector includes a conducting part and a supporting part wherein the conducting part has a better conduction characteristic than the supporting part while the supporting part has a better resiliency/strength characteristic than the conducting part. The conducting part includes a main body, an upper contacting arm extending upwardly from the main body and a lower contacting arm extending downwardly from the main body. The supporting part includes a secondary body, an upper supporting arm upwardly extending from the secondary body and a lower supporting arm downwardly extend from the secondary body. The main body and the secondary body are engaged together securely. The end of the upper contacting arm and that of the upper supporting arm are coupled together and the end of the lower contacting arm and that of the lower supporting arm are coupled together.

A testing head for testing a device includes a couple of plate-like supports separated from each other by a suitable gap and provided with respective guide holes to slidably house a plurality of contact probes, each including a rod-like body extending along a preset longitudinal axis between a first and second ends, the first end being a contact tip that abuts a contact pad of the device and the second end being a contact head that abuts a contact pad of a space transformer. At least one of the supports comprises a couple of guides that are parallel to each other and separated by an additional gap and provided with corresponding guide holes. Each contact probe comprises a protruding element or stopper originating from a lateral wall and realized in correspondence of one wall of a guide hole of the guides contacting the lateral wall of the contact probe.

To provide an electric component socket in which a pressing surface of a pressing member is prevented from contacting a contact pin when the socket is pressed by the pressing surface in a state where a first electric component is not housed in the socket. A pressing surface of a pressing mechanism contacts a first electric component when the pressing mechanism is moved downward in a state where the first electric component is housed in a plate. On the other hand, when the pressing mechanism is moved downward in a state where the first electric component is not housed in the plate, a push-up member is lifted up with the plate to push up the pressing surface. Therefore, the pressing surface is moved upward to prevent the pressing surface from contacting the contact pin.

An electrical connector assembly includes a housing defining an interior space and a slot and a spring pin terminal disposed within the slot of the housing. The spring pin terminal includes a first contact portion, a second contact portion, and an intermediate portion that extends between the first contact portion and the second contact portion. The first contact portion includes a contact point that engages a first electrically conductive structure and a retention force support that engages a portion of the intermediate portion of the spring pin terminal. The second contact portion includes a contact point that engages a second electrically conductive structure and a retention force and alignment support that engages the intermediate portion of the spring pin terminal.

A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. One or more signal pins in a contact array are electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins. These buried ground layers provide additional crosstalk isolation in close proximity to signal pins, resulting in improved signal integrity in a significantly reduced space

An electrical connector includes multiple conductive terminals respectively retained in multiple accommodating slots of an insulating body. Each conductive terminal includes a base portion, a connecting portion extending from one side of the base portion, a first elastic arm and a second elastic arm extending from the connecting portion toward a direction away from the same one side of the base portion, and at least one fixing portion extending from another side of the base portion. A width of the connecting portion is less than a width of the base portion and less than a width of a location of the first elastic arm near the connecting portion as well as a width of a location of the second elastic arm near the connecting portion. The fixing portion and the first elastic arm are respectively located at different sides of the base portion, thus achieving good elasticity and thinness.

It is herein described a contact probe of a testing head of an apparatus for testing electronic devices comprising a probe body being essentially extended in a longitudinal direction between respective end portions adapted to realize a contact with respective contact pads, at least one end portion having transverse dimensions greater than the probe body and comprising an enlarged portion, projecting only in correspondence of a first side wall of the contact probe. Suitably, the at least one end portion further comprises at least one protrusion projecting from a second side wall, opposite to the first side wall and substantially extending toward the second and opposite wall along a longitudinal axis of the contact probe starting from the enlarged portion.

Memory on Package (MOP) apparatus with reverse CAMM (Compression Attached Memory Module) and compression mount technology (CMT) connector(s). The MOP includes a first (MOP) substrate to which one or more CPUs, SoC, and XPUs that is operatively coupled to one or more CAMMs with a CMT connector(s) disposed between an array of CMT contact pads on the CAMM substrate and an array of CMT contact pad on the substrate. The one or more CAMMs are include multiple memory chips or packages such as LP DDR chips or DDR (S)DRAM chips/packages mounted to an underside of the CAMM substrate via signal coupling means such as a ball grid array (BGA), where the CAMM orientation is inverted such that the memory chips/packages are disposed downward, resulting in a reduced Z-height of the MOP. A MOP may include two CAMMs with a respective CMT connector disposed between the CAMM substrates and the MOP substrate.

A system connects a board to a substrate through an interposer board having compressible connectors through the interposer board. The connectors through the interposer board are compression-based connector pins that extends above and below the interposer board to make electrical contact between the board and the substrate. The system can include a plate to secure the board to the substrate and compress the compression-based connectors of the interposer board.

An electrical connector assembly that can quickly and easily be secured to two electrically conductive structures, such as a flat flexible conductor having multiple electrically conductive traces and a printed circuit board having multiple electrically conductive traces, without the use of specialized tools and/or methods is disclosed. The electrical connector assembly includes a housing having a plurality of slots defined therein. An electrical contact is disposed within each of the plurality of slots. Each electrical contact includes a first portion engaged with the housing, a second portion adapted to engage the first electrically conductive structure when inserted within the housing, and an intermediate portion located between the first portion and the second portion and adapted to engage the second electrically conductive structure when inserted within the housing.