An EMI filtering, coaxial power connector may be formed as an inline component or a port of a device. The connector may have dimensions to accept F-type coaxial connectors. The connector includes a conductive outer shell with a first opening and a second opening. A dielectric member is disposed within the shell. A conductive pin is supported by the dielectric member. A feed-through capacitor has a central opening and a first lead formed within the central opening. The pin is electrically connected to the first lead. A second lead of the capacitor is formed at an outer perimeter of the capacitor and is electrically connected to the shell. A metal plate is mounted within the shell. The plate is disk-shaped with a central hole. An outer perimeter of the plate is in electrical contact with the shell. The pin passes through the central hole without making electrical contact with the plate, and the plate resides between the second opening of the shell and the capacitor.

An EMI filtering, coaxial power connector may be formed as an inline component or a port of a device. The connector may have dimensions to accept F-type coaxial connectors. The connector includes a conductive outer shell with a first opening and a second opening. A dielectric member is disposed within the shell. A conductive pin is supported by the dielectric member. A feed-through capacitor has a central opening and a first lead formed within the central opening. The pin is electrically connected to the first lead. A second lead of the capacitor is formed at an outer perimeter of the capacitor and is electrically connected to the shell. A metal plate is mounted within the shell. The plate is disk-shaped with a central hole. An outer perimeter of the plate is in electrical contact with the shell. The pin passes through the central hole without making electrical contact with the plate, and the plate resides between the second opening of the shell and the capacitor.

A connector assembly includes: a housing having a plurality of accommodating grooves into which a plurality of terminals are insertable, respectively, and having an insertion space recessed in a first direction intersecting a second direction in which the accommodating grooves extend, the plurality of accommodating grooves being formed in one surface of the housing; a terminal position assurance (TPA) mechanism inserted into the insertion space of the housing in the first direction, having a plurality of through-holes extending parallel to the plurality of accommodating grooves, and inhibiting the terminals inserted into the through-holes from being separated; joint terminals extending from an inside of the housing to the accommodating grooves, and electrically connected to the terminals inserted into the accommodating grooves; and a noise filter fixed to the housing or the TPA mechanism, and enclosing the accommodating grooves of the housing, the through-holes of the TPA mechanism, or the joint terminals.

An EMI/energy dissipating filter for an active implantable medical device (AIMD) comprises a first gold braze sealing an insulator to the ferrule of a glass-to-metal seal (GTMS) and a lead wire that is sealed in a passageway through the insulator by a second gold braze. A circuit board is disposed adjacent to the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization connected to its active electrode plates and a ground end metallization connected to its ground electrode plates. A ground electrical path extends from the ground end metallization of the chip capacitor, through a circuit board ground plate disposed on or within the circuit board, and to the ferrule. An active electrical path extends from the active end metallization of the chip capacitor to the lead wire of the GTMS.

A feedthrough terminal assembly for active implantable medical devices includes an electrically conductive pad for a convenient attachment of wires from either the circuitry inside the implantable medical device or wires external to the device. The electrically conductive pad enables direct thermal or ultrasonic bonding of a circuit board or lead wire to the terminal pin.

A feedthrough terminal assembly for active implantable medical devices includes an electrically conductive pad for a convenient attachment of wires from either the circuitry inside the implantable medical device or wires external to the device. The electrically conductive pad enables direct thermal or ultrasonic bonding of a circuit board or lead wire to the terminal pin.

An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises at least a first electrical connection material connected directly to the first gold braze, and at least an internal ground plate disposed within the circuit board substrate with the internal ground plate being electrically connected to both the first electrical connection material and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.

A hermetically sealed filtered feedthrough for an active implantable medical device includes a first conductive leadwire extending from a first end to a second end, the first leadwire second end extending outwardly beyond the device side of an insulator hermetically sealed to a ferrule for the feedthrough. A circuit board supporting a chip capacitor is disposed adjacent to a device side of the insulator and has a circuit board passageway. The first leadwire first end resides in the circuit board passageway. A second conductive leadwire on the device side has a second leadwire first end disposed in the circuit board passageway with a second leadwire second end extending outwardly beyond the circuit board to be connectable to AIMD internal electronics. The second leadwire first end is connected to the first leadwire first end and a capacitor internal metallization in the circuit board passageway. The circuit board further comprises a ground electrode plate that is connected to the ground termination of the chip capacitor and to the ferrule.

A hermetically sealed filtered feedthrough for an active implantable medical device includes a first conductive leadwire extending from a first end to a second end, the first leadwire second end extending outwardly beyond the device side of an insulator hermetically sealed to a ferrule for the feedthrough. A circuit board supporting a chip capacitor is disposed adjacent to a device side of the insulator and has a circuit board passageway. The first leadwire first end resides in the circuit board passageway. A second conductive leadwire on the device side has a second leadwire first end disposed in the circuit board passageway with a second leadwire second end extending outwardly beyond the circuit board to be connectable to AIMD internal electronics. The second leadwire first end is connected to the first leadwire first end and a capacitor internal metallization in the circuit board passageway. The circuit board further comprises a ground electrode plate that is connected to the ground termination of the chip capacitor and to the ferrule.

A circuit board for a high speed communication jack including a rigid circuit board in the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a middle layer in the substrate, with each trace extending from a corresponding one of the plurality of vias, a first shielding layer on a first side of the middle layer in the substrate, a second shielding layer on a second side of the middle layer in the substrate, and a third shielding layer adjacent to the second shielding layer.