H01R4/04

Process for constructing lightning strike protection for adhesively bonded graphite composite joints

A bonded joint for use in bonding composite materials is provided and includes a composite rib having electrically conductive properties and a composite structure having electrically conductive properties. An electrically conductive preform is provided that facilitates a bond between the composite rib and the composite structure. A mesh composition that bonds the composite rib to the preform and that bonds the preform to the composite structure is provided and is electrically conductive to conduct current between the composite rib and the composite structure.

Process for constructing lightning strike protection for adhesively bonded graphite composite joints

A bonded joint for use in bonding composite materials is provided and includes a composite rib having electrically conductive properties and a composite structure having electrically conductive properties. An electrically conductive preform is provided that facilitates a bond between the composite rib and the composite structure. A mesh composition that bonds the composite rib to the preform and that bonds the preform to the composite structure is provided and is electrically conductive to conduct current between the composite rib and the composite structure.

ANISOTROPIC CONDUCTIVE FILM

An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 μm or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter.

ANISOTROPIC CONDUCTIVE FILM

An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 μm or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter.

ELECTRICALLY CONDUCTIVE BONDING TAPE WITH LOW PASSIVE INTERMODULATION

An electrically conductive bonding tape includes a conductive self-supporting first layer conductive in each of three mutually orthogonal directions and including conductive opposing first and second major surfaces, an conductive second layer coated on the first major surface of the self-supporting first layer and having at least 60% by weight of nickel, the second layer having an exposed major surface facing away from the first major surface of the self-supporting first layer and exposing at least some of the nickel in the second layer, and a conductive adhesive third layer bonded to the second major surface of the self-supporting first layer opposite the second layer. The adhesive third layer is conductive in at least one of the three mutually orthogonal directions and includes a plurality of conductive elements dispersed in an insulative material, at least some of the conductive elements physically contacting the self-supporting first layer.

ELECTRICALLY CONDUCTIVE BONDING TAPE WITH LOW PASSIVE INTERMODULATION

An electrically conductive bonding tape includes a conductive self-supporting first layer conductive in each of three mutually orthogonal directions and including conductive opposing first and second major surfaces, an conductive second layer coated on the first major surface of the self-supporting first layer and having at least 60% by weight of nickel, the second layer having an exposed major surface facing away from the first major surface of the self-supporting first layer and exposing at least some of the nickel in the second layer, and a conductive adhesive third layer bonded to the second major surface of the self-supporting first layer opposite the second layer. The adhesive third layer is conductive in at least one of the three mutually orthogonal directions and includes a plurality of conductive elements dispersed in an insulative material, at least some of the conductive elements physically contacting the self-supporting first layer.

Connection structure between sensor and cable, and connection cable
11705646 · 2023-07-18 · ·

A connection structure between sensor and cable includes a cable formed by assembling a plurality of electric wires each including a covering portion covering a core and a core-exposing portion exposing the core at an end of the covering portion, a spacer that is interposed in a space surrounded by the covering portions of the electric wires and holds end portions of the covering portions in the state that the end portions are spaced from each other, and a sensor that detects a physical quantity, and the core-exposing portion of each of the electric wires of the cable is electrically connected to the sensor via a fixing member in the state that each of the electric wires is held by the spacer.

Connection structure between sensor and cable, and connection cable
11705646 · 2023-07-18 · ·

A connection structure between sensor and cable includes a cable formed by assembling a plurality of electric wires each including a covering portion covering a core and a core-exposing portion exposing the core at an end of the covering portion, a spacer that is interposed in a space surrounded by the covering portions of the electric wires and holds end portions of the covering portions in the state that the end portions are spaced from each other, and a sensor that detects a physical quantity, and the core-exposing portion of each of the electric wires of the cable is electrically connected to the sensor via a fixing member in the state that each of the electric wires is held by the spacer.

TERMINAL CONNECTION PORTION FOR ELECTRONIC DEVICE
20230223049 · 2023-07-13 · ·

A first terminal provided on a tail pad portion includes a base portion, a bent portion and an overlapping portion. The base portion includes a first surface fixed to a base insulating layer and a second surface on an opposite side to the first sur face. The bent portion is reversed in a thickness direction of the base portion from an end of the base portion towards the second surface. The overlapping portion extends from the bent portion in a direction along the second surface. An ansotropic conductive film (ACE) is disposed between the overlapping portion and the second terminal. The overlapping portion and the second terminal are connected to each other via the ACE.

TERMINAL CONNECTION PORTION FOR ELECTRONIC DEVICE
20230223049 · 2023-07-13 · ·

A first terminal provided on a tail pad portion includes a base portion, a bent portion and an overlapping portion. The base portion includes a first surface fixed to a base insulating layer and a second surface on an opposite side to the first sur face. The bent portion is reversed in a thickness direction of the base portion from an end of the base portion towards the second surface. The overlapping portion extends from the bent portion in a direction along the second surface. An ansotropic conductive film (ACE) is disposed between the overlapping portion and the second terminal. The overlapping portion and the second terminal are connected to each other via the ACE.