A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. One or more signal pins in a contact array are electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins. These buried ground layers provide additional crosstalk isolation in close proximity to signal pins, resulting in improved signal integrity in a significantly reduced space.

Disclosed herein are various implementations of communications connectors. In some implementations, a communications plug may include a housing and a body positioned in the housing. A flexible printed circuit board (PCB) may be wrapped at least partially around the body, a and a plurality of metal contact pads may be positioned on the flexible PCB to mate with plug interface contacts (PICs) of a communications jack when the communications plug is inserted into the communications jack.

Disclosed herein are various implementations of communications connectors. In some implementations, a communications plug may include a housing and a body positioned in the housing. A flexible printed circuit board (PCB) may be wrapped at least partially around the body, a and a plurality of metal contact pads may be positioned on the flexible PCB to mate with plug interface contacts (PICs) of a communications jack when the communications plug is inserted into the communications jack.

An insulation displacement contact system includes a first insulation displacement contact, a second insulation displacement contact, and a cover having a first portion over the first insulation displacement contact and a second portion over the second insulation displacement contact. The cover includes a retention gap between the first portion and the second portion to engage the cover with a first pair of prongs of the first insulation displacement contact. The first portion of the cover includes a first ledge and a second ledge configured to engage the cover with a second pair of prongs of the first insulation displacement contact.

An insulation displacement contact system includes a first insulation displacement contact, a second insulation displacement contact, and a cover having a first portion over the first insulation displacement contact and a second portion over the second insulation displacement contact. The cover includes a retention gap between the first portion and the second portion to engage the cover with a first pair of prongs of the first insulation displacement contact. The first portion of the cover includes a first ledge and a second ledge configured to engage the cover with a second pair of prongs of the first insulation displacement contact.

A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. One or more signal pins in a contact array are electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins. These buried ground layers provide additional crosstalk isolation in close proximity to signal pins, resulting in improved signal integrity in a significantly reduced space.

A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. One or more signal pins in a contact array are electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins. These buried ground layers provide additional crosstalk isolation in close proximity to signal pins, resulting in improved signal integrity in a significantly reduced space.

Connection systems and methods thereof facilitate establishing electrical connections through a barrier such as a drape without compromising a sterile field established by the barrier. A connection system can include two connectors. A first connector can include a first-connector housing defining a cavity, a slideable end piece coupled to a distal-end portion of the first-connector housing, and at least a first piercing element connected to a first electrical lead. The first piercing element can be configured to enter the cavity and pierce a barrier disposed in the cavity when the slideable end piece is advanced toward a proximal-end portion of the first-connector housing. A second connector can include at least a first receptacle within a second-connector housing connected to a second electrical lead. The first receptacle can be configured to form at least a first electrical connection with the first piercing element after the first piercing element pierces the barrier.

A plug includes at least one spring or blade contact element which is disposed in a housing and is connected in an electrically conducting manner to at least one insulation displacement contact that contacts and secures at least one insulated single-core cable. The at least one insulation displacement contact extends at a 90° angle from the spring or blade contact element in the plug-in direction of the spring or blade contact element in such a way that the at least one insulated single-core cable extending in the plug-in direction is contacted and secured by an insulation displacement contact.

The present invention provides for a protective enclosure comprising a base comprising a first continuous mating surface and at least one conveyance aperture, a cover comprising a second continuous mating surface, wherein the second continuous mating surface is configured to form a seal with the first continuous mating surface, and a clamp, wherein at least a portion of the clamp is coupleable to the base, wherein a mouth of the clamp is configured to be offset from the aperture when the clamp is coupled to the base, wherein the clamp comprises a first sealing layer, and wherein the clamp is configured to seal the aperture against contaminants. The protective enclosure may be configured for use in a remotely controllable model vehicle to protect a control module.