A cable assembly may include a cable having a plurality of electrically-conductive wires including a first set of wires and a second set of wires and a plug terminating an end of the cable, the plug comprising a housing including a locking tab formed on the outside of the housing on a first side of the housing and configured to mechanically couple the plug to a corresponding receptacle connector, a first contact formed on the first side of the housing and configured to expose the first set of wires to a first set of pins of the corresponding receptacle connector, and a second contact formed on a second side of the housing opposite the first side and configured to expose the second set of wires to a second set of pins of the corresponding receptacle connector.

A single element electrical connector includes a single conductive contact element formed into a cage structure having a wire insert end and a wire contact end along a longitudinal centerline axis of the connector. The cage structure defines an upper pick-up surface having a surface area suitable for placement of a suction nozzle of a vacuum transfer device, as well as a pair of contact tines biased towards the centerline axis to define a contact pinch point for an exposed core of a wire inserted into the connector. A contact surface is defined by a member of the cage structure for electrical mating contact with a respective contact element on a component on which the connector is mounted.

A connector (100) is disclosed that includes a housing (2) having a length, a width, a first end wall (15), a second end wall (19), and a plurality of first (17) and second (18) grooves disposed on upper-portion main surface and bottom-portion main surface of a base (2). The grooves receive pluralities of first (70) and second (71) insulated conductors, respectively. A plurality of terminals (16) make contact with the first and second insulated conductors so that the first insulated conductors and the second insulated conductors are electrically connected to each other.

A hybrid optical and electrical connection system includes a connectorized pigtail and a closure. The connectorized pigtail includes: a) a stub cable including a jacket containing at least one optical fiber and at least two electrical conductors, the stub cable having opposite first and second ends; and b) a hybrid optical and electrical connector that is factory terminated at the first end of the stub cable. The closure mounts at the second end of the stub cable for enclosing optical and electrical connections between the second end of the stub cable and a field cable.

A hybrid optical and electrical connection system includes a connectorized pigtail and a closure. The connectorized pigtail includes: a) a stub cable including a jacket containing at least one optical fiber and at least two electrical conductors, the stub cable having opposite first and second ends; and b) a hybrid optical and electrical connector that is factory terminated at the first end of the stub cable. The closure mounts at the second end of the stub cable for enclosing optical and electrical connections between the second end of the stub cable and a field cable.

The disclosed embodiments relate generally to a modular connector for a multi-conductor ribbon cable provided for power and data transmission to a network of devices. The modular connector is coupled to the conductors in the ribbon cable by insulation displacement members. The connector contains both fixed and movable conductor punches used to configure a network interface.

A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. One or more signal pins in a contact array are electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins. These buried ground layers provide additional crosstalk isolation in close proximity to signal pins, resulting in improved signal integrity in a significantly reduced space

A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. One or more signal pins in a contact array are electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins. These buried ground layers provide additional crosstalk isolation in close proximity to signal pins, resulting in improved signal integrity in a significantly reduced space

A connector, with which an electrical wire is attachable, is connectable with a mating connector which has a mating contact portion. The connector comprises a housing and at least one terminal. The housing is provided with a support. The support has a receiving portion. The receiving portion is configured to receive a part of the electrical wire. The at least one terminal has an insulation displacement connection (IDC) portion, a contact portion, a supporting portion and a coupling portion. The IDC portion is configured to be insulation-displacement connected with the electrical wire. The support is positioned between the IDC portion and the supporting portion in a first predetermined direction. The coupling portion couples the IDC portion and the supporting portion with each other. The coupling portion has a neighboring portion. The neighboring portion neighbors to the support in a second predetermined direction perpendicular to the first predetermined direction.

A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. One or more signal pins in a contact array are electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins. These buried ground layers provide additional crosstalk isolation in close proximity to signal pins, resulting in improved signal integrity in a significantly reduced space.