A sensor module according to an embodiment of the present technology includes a housing, a sensor board, an external connector, a flexible printed circuit, and a metallic shield case. The flexible printed circuit electrically connects the sensor board and the external connector, the flexible printed circuit including a signal line and a ground line. The shield case includes a bottom portion that is arranged between the flexible printed circuit and the external connector. The external connector includes a first connection pin that is connected to the signal line, a second connection pin that is connected to the ground line, and a third connection pin that is connected to the bottom portion of the shield case. The bottom portion includes a first hole, a second hole, a third hole, and a thermal storage, the first hole being a hole through which the first connection pin passes, the second hole being a hole through which the second connection pin passes, the third hole being a hole through which the third connection pin passes, the thermal storage being provided around the third hole and covered with a solder material used to join the third connection pin to the bottom portion.

An electric component manufacturing device includes a preheater that contacts and preheats a transported work, a melting heater that is downstream of the preheater in a transport direction of the work and contacts and heats the work at a temperature which is higher than a temperature of the preheater and at which a solder melts, a cooler that is downstream of the melting heater in the transport direction and contacts and cools the work, and a transporter that supports and transports the work to sequentially contact the preheater, the melting heater, and the cooler in this order. The transporter performs intermittent transport in which the work is transported from the preheater to the melting heater without stopping to contact both the preheater and the melting heater at the same time, and then the work stops on the melting heater.

An external-leadwire crimping apparatus is provided by embodiments of the present invention, including: a heating base provided with a heating rod and a temperature sensor; a crimping tool tip which is connected with the heating base and supplied with heat from the heating base, the crimping tool tip being configured to to crimp a leadwire of a flexible printed circuit board onto a printed circuit board assembly, by curing a conductive adhesive after receipt of heat, and the crimping tool tip comprising a crimping tool tip body. The crimping tool tip body is provided with at least one heat dissipation slot on an upper surface thereof, the heat dissipation slot being configured to extend in a thickness direction of the crimping tool tip body and to penetrate therethrough at both ends; and/or the crimping tool tip body is provided with at least one heat dissipation hole penetrating the thickness direction thereof. Thereby, aforementioned design with heat dissipation slots and/or heat dissipation holes solve a problem of uneven surface temperatures of the crimping tool tip caused by a transmission of most of the heat generated by the heating rod, directing towards a central position of the crimping tool tip, such that a uniformity of surface temperatures of the crimping tool tip is ensured to control a temperature difference between both left and right ends and a central portion of a lower surface of the crimping tool tip to be constrained within 10° C. so as to offer guarantee for a uniformity of reactions of the conductive adhesive, resulting in an enhanced crimping quality.

A braided part connection structure includes a braided part having a tubular shape covering an insulated wire along a longitudinal direction of the braided part connection structure and a shield member having a tubular shape and electrically connected and fixed to the braided part. The shield member includes a braided part joining portion having a plurality of openings arranged at intervals along a circumferential direction of the shield member in a portion of the shield member in the longitudinal direction, and a welding portion defined by two openings adjacent to each other of the plurality of openings. The braided part covers the braided part joining portion and is welded to the welding portion.

An apparatus that melts and monitors sleeves for installation onto shielded cables. The apparatus includes a heat source for melting the sleeve, cable supports for supporting the cable during the melting process, a sensor system that is configured to measure a dimension of the sleeve during melting, and a computer that is connected to receive sensor data from the sensor system and send heater control signals to the heat source. The computer is configured to receive dimensional data from the sensor system, monitor that dimensional data by performing a dimensional analysis, and then deactivate or remove the heat source in response to dimensional analysis results indicating that the sleeve is fully melted (in the case of a solder sleeve) or only fully shrunken (in the case of a dead end sleeve) onto the cable.

An apparatus that melts and monitors sleeves for installation onto shielded cables. The apparatus includes a heat source for melting the sleeve, cable supports for supporting the cable during the melting process, a sensor system that is configured to measure a dimension of the sleeve during melting, and a computer that is connected to receive sensor data from the sensor system and send heater control signals to the heat source. The computer is configured to receive dimensional data from the sensor system, monitor that dimensional data by performing a dimensional analysis, and then deactivate or remove the heat source in response to dimensional analysis results indicating that the sleeve is fully melted (in the case of a solder sleeve) or only fully shrunken (in the case of a dead end sleeve) onto the cable.

An apparatus that melts and monitors sleeves for installation onto shielded cables. The apparatus includes a heat source for melting the sleeve, cable supports for supporting the cable during the melting process, a sensor system that is configured to measure a dimension of the sleeve during melting, and a computer that is connected to receive sensor data from the sensor system and send heater control signals to the heat source. The computer is configured to receive dimensional data from the sensor system, monitor that dimensional data by performing a dimensional analysis, and then deactivate or remove the heat source in response to dimensional analysis results indicating that the sleeve is fully melted (in the case of a solder sleeve) or only fully shrunken (in the case of a dead end sleeve) onto the cable.

A resistance soldering device configured for use with an electrical terminal having a first surface and a second surface opposite the first surface on which a layer of a solder composition is disposed includes an electrode having a first electrical conductor configured to be connected to a positive pole of an electrical power supply, a second electrical conductor configured to be connected to a negative pole of the electrical power supply and an electrically resistive bridge interconnecting the first and second electrical conductors. A method of using such a device is also presented herein.

The invention relates to a method for sealing a contact point region comprising at least one contact point at an electrical line connection, wherein the line connection comprises at least one electrical line and at least one conductive element electrically connected thereto. The method starts by arranging a shrink tube on the outer circumference of the contact point region, in a first region extending over the contact point region on both sides in the longitudinal direction. This is followed by heating the shrink tube to shrinking temperature. During the heating of the shrink tube, an inductive heating of the electrical conductor is additionally performed, at least in the contact point region, and so hotmelt adhesive arranged inside the shrink tube and/or on the outer circumference of the contact point region is heated to its melting temperature. The invention also relates to a device for sealing a contact point region and to a sealing at such a region.

An electric component manufacturing device includes a preheater that contacts and preheats a transported work, a melting heater that is downstream of the preheater in a transport direction of the work and contacts and heats the work at a temperature which is higher than a temperature of the preheater and at which a solder melts, a cooler that is downstream of the melting heater in the transport direction and contacts and cools the work, and a transporter that supports and transports the work to sequentially contact the preheater, the melting heater, and the cooler in this order. The transporter performs intermittent transport in which the work is transported from the preheater to the melting heater without stopping to contact both the preheater and the melting heater at the same time, and then the work stops on the melting heater.