A dual-comb measuring system is provided. The dual comb measuring system may include a bi-directional mode-locked femtosecond laser, a high-speed rotation stage, and a fiber coupler. The high-speed rotation stage may be coupled to a pump diode.

A dual-comb measuring system is provided. The dual comb measuring system may include a bi-directional mode-locked femtosecond laser, a high-speed rotation stage, and a fiber coupler. The high-speed rotation stage may be coupled to a pump diode.

A laser apparatus may include: a quantum cascade laser outputting, based on a supplied current, laser light at an oscillation start timing when a first delay time elapses from a current rising timing of the supplied current: an amplifier disposed in a laser light optical path, and selectively amplifying light of a predetermined wavelength to output the amplified laser light to a chamber including a plasma generation region into which a target is fed; and a laser controller controlling a third delay time, from an output timing of a laser output instruction to the current rising timing, to cause a laser light wavelength to be equal to the predetermined wavelength at an aimed timing when a second delay time elapses from the oscillation start timing, based on oscillation parameters including the first delay time, a supplied current waveform, and a device temperature of the quantum cascade laser.

A ring amplifier amplifies one or more spot-beams that scan a circular pattern in a two-dimensional FOV to extend the range of range steerable laser transmitter or an active situational sensor. Mechanical, solid-state or optical phase array techniques may be used to scan the spot-beam(s) in the circular pattern. Mirrors are preferably positioned to redirect the spot-beams to enter and exit the ring amplifier through sidewalls to amplify the spot-beam and return it along a path to scan the circular pattern. For efficiency, the pumps and thermal control may be synchronized to the circular scan pattern to only pump and cool the section of gain medium in which the spot-beam is currently scanned and the next section of gain medium in the circular scan pattern.

A semiconductor laser device includes: a semiconductor laser element including an emitter that emits emission light; a lens that transmits the emission light emitted from the emitter; a driver that supports the lens in a state in which a position and an orientation of the lens are changeable; a detector that detects an intensity distribution of the emission light emitted from the emitter and transmitted through the lens; and a controller that, based on a detection result of the detector, controls at least one of the position or the orientation of the lens by driving the driver to cause the intensity distribution of the emission light detected by the detector to be a predetermined light intensity distribution.

A system for laser bonding of flip chip, and more particularly, to a system for laser bonding of flip chip for bonding a flip chip-type semiconductor chip to a substrate by using a laser beam is provided. According to the system for laser bonding of flip chip of the present disclosure, by performing laser bonding on a substrate while pressurizing semiconductor chips, even semiconductor chips which are bent or likely to bend may be bonded to the substrate without causing poor contact of solder bumps.

A method for controlling the exposure of a selective laser sintering or laser melting apparatus. The method includes providing a selective laser sintering apparatus or laser melting apparatus that uses successive solidification of layers of a powder-type construction material that can be solidified using radiation. The apparatus comprises an irradiation device for irradiating layers of the construction material that has a plurality of scanners that can separately be actuated, simultaneously irradiating the construction material, the separate detection of irradiation times of each scanner and/or the irradiation areas detected by each scanner, and storing the detected irradiation times and/or irradiation areas; comparing the irradiation times and/or irradiation areas of the scanners with each other; re-determining the surface sections of a powder layer to be irradiated by each scanner so the irradiation times for each scanner are approximated to each other and/or the irradiation areas of each scanner are aligned.

A method for controlling the exposure of a selective laser sintering or laser melting apparatus. The method includes providing a selective laser sintering apparatus or laser melting apparatus that uses successive solidification of layers of a powder-type construction material that can be solidified using radiation. The apparatus comprises an irradiation device for irradiating layers of the construction material that has a plurality of scanners that can separately be actuated, simultaneously irradiating the construction material, the separate detection of irradiation times of each scanner and/or the irradiation areas detected by each scanner, and storing the detected irradiation times and/or irradiation areas; comparing the irradiation times and/or irradiation areas of the scanners with each other; re-determining the surface sections of a powder layer to be irradiated by each scanner so the irradiation times for each scanner are approximated to each other and/or the irradiation areas of each scanner are aligned.

A laser system includes a first laser cavity to output a laser light along a first path, a first mirror to receive the laser light from the first laser cavity, and redirect the laser light along a second path that is different than the first path, a second mirror to receive the laser light from the first mirror, and redirect the laser light along a third path that is different than the first path and the second path, a beam splitter located at a first position on the third path, a beam combiner located at a second position on the third path; and a coupling lens assembly, the coupling lens assembly including a lens located at a third position on the third path, wherein the coupling lens assembly moves the lens in x-, y-, and x-directions.

A laser emitting apparatus includes a detection and control system, a pump source, a first reflecting mirror group, a gain medium, and a beam deflection system on an optical path. The gain medium is pumped by the pump source to emit fluorescence, and is stimulated by resonance, between the first reflecting mirror group and a laser receiving apparatus, of the fluorescence to emit laser light. The beam deflection system emits the fluorescence or the laser light emitted by the gain medium, and emits the fluorescence or the laser light reflected by the laser receiving apparatus into the gain medium. The detection and control system adjusts the beam deflection system to preset emission angles, detects light intensities of the fluorescence or the laser light, and a light spot position of the laser light on the detection and control system, and adjusts the emission angle based on the light spot position.