A control method for a line narrowed gas laser apparatus is a control method for a line narrowed gas laser apparatus configured to emit a pulse laser beam including a first wavelength component and a second wavelength component. The apparatus includes a laser chamber including a pair of electrodes, an optical resonator including an adjustment mechanism configured to adjust a parameter of an energy ratio of the first and second wavelength components, and a processor in which relation data indicating a relation of the parameter of the energy ratio with a control parameter of the adjustment mechanism is stored. The control method includes receiving a command value of the parameter of the energy ratio from an external device, and acquiring, based on the relation data, a value of the control parameter corresponding to the command value and controlling the adjustment mechanism based on the value of the control parameter.

A sensor degradation evaluation method according to an aspect of the present disclosure includes an evaluation step of evaluating degradation of at least one of a sensor for coarse measurement that receives interference fringes produced by a spectrometer for coarse measurement and a sensor for fine measurement that receives interference fringes produced by a spectrometer for fine measurement, and the evaluation step includes causing a plurality of kinds of laser light having wavelengths different from one another to be sequentially incident on the spectrometer for coarse measurement and the spectrometer for fine measurement and acquiring a coarse-measurement wavelength and a fine-measurement wavelength on a wavelength basis from a plurality of the received interference fringes, acquiring a degradation parameter on a wavelength basis from the coarse-measurement wavelength and the fine-measurement wavelength on a wavelength basis, and comparing the degradation parameter on a wavelength basis with a threshold.

An exposure system according to an aspect of the present disclosure includes a laser apparatus emitting a pulse laser beam, an illumination optical system guiding the pulse laser beam to a reticle, a reticle stage moving the reticle, and a processor controlling emission of the pulse laser beam and movement of the reticle. The exposure system performs scanning exposure of a semiconductor substrate by irradiating the reticle with the pulse laser beam. The reticle has first and second regions. The processor instructs the laser apparatus about, based on proximity effect characteristics corresponding to the first and second regions, a value of a control parameter of the pulse laser beam corresponding to each region so that the laser apparatus emits the pulse laser beam with which a difference of the proximity effect characteristic of each region from a reference proximity effect characteristic is in an allowable range.

A laser chamber apparatus may include a pipe, an inner electrode extending along a longitudinal direction of the pipe and disposed in a through hole in the pipe, an outer electrode including a contact plate extending along the longitudinal direction of the pipe and being in contact with an outer circumferential surface of the pipe and a ladder section formed of bar members each having one end connected to the contact plate and juxtaposed along a longitudinal direction of the contact plate, and a leaf spring extending along the longitudinal direction of the pipe and configured to press the outer electrode against the pipe. The leaf spring may include leaf spring pieces separated by slits, and the leaf spring pieces may each include a bent section bent along the edge and are configured to press the bar members in a position shifted from the bent sections toward the edge.

A laser apparatus according to the present disclosure includes: a laser output unit configured to perform laser oscillation; and a control unit configured to acquire first laser performance data obtained when the laser output unit performs laser oscillation based on a first laser control parameter, and second laser performance data obtained when the laser output unit performs laser oscillation based on a second laser control parameter, while laser output from the laser output unit to an external device is stopped, and determine whether the second laser performance data has been improved as compared to the first laser performance data.

A laser apparatus according to the present disclosure includes: a laser output unit configured to perform laser oscillation; and a control unit configured to acquire first laser performance data obtained when the laser output unit performs laser oscillation based on a first laser control parameter, and second laser performance data obtained when the laser output unit performs laser oscillation based on a second laser control parameter, while laser output from the laser output unit to an external device is stopped, and determine whether the second laser performance data has been improved as compared to the first laser performance data.

An optical processing apparatus, an optical processing method, and an optically-processed product production method. The optical processing apparatus and the optical processing method includes emitting a first process light to a focal point set inside an object to be processed, using a first light-emitting unit, and emitting a second process light during a period of time in which plasma or gas is generated inside the object to be processed, by the first process light, using a second light-emitting unit. The processed product production method includes emitting a first process light to a focal point set inside an object to be processed, using a first light-emitting unit, and emitting a second process light during a period in which plasma or gas is generated inside the object to be processed by the first process light, using a second light-emitting unit.

An optical processing apparatus, an optical processing method, and an optically-processed product production method. The optical processing apparatus and the optical processing method includes emitting a first process light to a focal point set inside an object to be processed, using a first light-emitting unit, and emitting a second process light during a period of time in which plasma or gas is generated inside the object to be processed, by the first process light, using a second light-emitting unit. The processed product production method includes emitting a first process light to a focal point set inside an object to be processed, using a first light-emitting unit, and emitting a second process light during a period in which plasma or gas is generated inside the object to be processed by the first process light, using a second light-emitting unit.

A laser processing method of performing laser processing on a transparent material that is transparent to ultraviolet light by using a laser processing system includes: performing relative positioning of a transfer position of a transfer image and the transparent material in an optical axis direction of a pulse laser beam so that the transfer position is set at a position inside the transparent material at a predetermined depth ΔZsf from a surface of the transparent material in the optical axis direction; and irradiating the transparent material with the pulse laser beam having a pulse width of 1 ns to 100 ns inclusive and a beam diameter of 10 μm to 150 μm inclusive at the transfer position.

A laser apparatus includes a first optical element, a second optical element, a first actuator configured to change a first wavelength component included in a pulse laser beam by changing a posture of the first optical element, a second actuator configured to change a second wavelength component included in the pulse laser beam by changing a posture of the second optical element, a first encoder configured to measure a position of the first actuator, a second encoder configured to measure a position of the second actuator, and a processor. The processor reads a first relation and a second relation and performs control of the first actuator based on the first relation and the position of the first actuator measured by the first encoder and control of the second actuator based on the second relation and the position of the second actuator measured by the second encoder.