To provide an optical module and a scan-type image projection display device at low power consumption in a configuration of enhancing a heat radiation property with excellent assembly performance. An optical module for coupling and irradiating laser beams from a plurality of laser diodes, and onto a desired position is characterized in that a first protruded part corresponding to a first laser holder for holding a first laser diode 1a and a second protruded part corresponding to a second laser holder for holding a second laser diode are provided on a base for placing the optical module thereon, and heat conductive materials are provided between the first protruded part and the first laser holder and between the second protruded part and the second laser holder, respectively.

A semiconductor laser source includes a structured layer formed on a substrate made of silicon and having an upper face. The structured layer includes a passive optical component chosen from the group composed of an optical reflector and a waveguide. The component is encapsulated in silica or produced on a silica layer. At least one pad extends from a lower face of the structured layer, making direct contact with the substrate made of silicon, to an upper face flush with the upper face of the structured layer. The pad is produced entirely from silicon nitride, in order to form a thermal bridge through the structured layer. An optical amplifier is bonded directly above the passive optical component and partially to the upper face of the pad in order to dissipate the heat that it generates to the substrate made of silicon.

A laser device has a plurality of laser diodes; a plurality of optical elements installed corresponding to the plurality of the laser diodes; a plurality of units formed by fixing the laser diodes and the optical elements per each laser diode and installed corresponding to the plurality of the laser diodes; a converging element that converges laser beams emitted from the plurality of the laser diodes to a fiber; a housing element houses the plurality of the units and the converging element; and a thermal transfer plate performs heat dissipation of the plurality of the units. The heat resistance reducing element having a heat resistance value that is smaller than a predetermined value is installed between the thermal transfer plate and each unit or the processing for reducing the heat resistance is performed.

To provide a method of manufacturing a light-emitting module capable of accurately arranging a plurality of light-emitting elements at narrow intervals, and a light-emitting module manufactured by the method of manufacturing, and, moreover, a device on which the light-emitting module is mounted. Provided is a method of manufacturing a light-emitting module including: a plurality of light-emitting element arrays each including, in a plane parallel to resonator length of a light-emitting element, a plurality of the light-emitting elements arranged along a width direction perpendicular to a direction of the resonator length; and a substrate on which the plurality of light-emitting element arrays is mounted, the method including arranging the plurality of light-emitting elements on the substrate at predetermined intervals along the width direction in the light-emitting module, by causing side surfaces of the respective light-emitting element arrays adjacent to each other along the width direction to be in contact with each other and mounting the respective light-emitting element arrays on the substrate.

A method of determining initial parameters and target values for tuning an emission wavelength of a wavelength tunable laser capable of emitting laser light in a substantial wavelength range is disclosed. The method iterates an evaluation of initial parameters and target values at target wavelengths in a preset order. The evaluation includes steps of supplying empirically obtained parameters to the t-LD, confirming whether the t-LD generates an optical beams, determining the initial parameters and the target values by carrying out feedback loops of the AFC and the APC when the t-LD generates the optical beam, or shifting the wavelength range so as to exclude the current target wavelength when the t-LD generates no optical beam.

An optoelectronic device includes an optoelectronic die, a laser die, and electrical interconnects. The optoelectronic device has a surface. A trench having first and second walls and a floor is formed in the surface, and an electrically conductive layer extends from the floor, via the first wall, to the surface. The laser die includes first and second electrodes and a laser output aperture. The laser die is mounted in the trench and is configured to emit a laser beam. The first electrode is coupled to the electrically conductive layer and the laser output aperture is mechanically aligned with a waveguide that extends from the second wall. The interconnects are formed on the second electrode of the laser die and on selected locations on the surface of the optoelectronic die. The interconnects are coupled to a substrate, and are configured to conduct electrical signals between the optoelectronic die and the substrate.

A thermoelectric module includes a substrate; a thermoelectric element; a bonding portion including an electrode that bonds the substrate and the thermoelectric element; an organic material film that covers a front surface of the bonding portion; and an inorganic material film that covers the organic material film.

Embodiments of the present application provide a laser light source and a laser projection device. The laser light source includes a laser assembly, where the laser assembly includes a laser and a circuit board, the laser includes a substrate and a light emitting chip arranged on the substrate, a lateral surface of the substrate is provided with a plurality of pins extending outwards therefrom, the circuit board is arranged on a side where the pins extend, and the circuit board is electrically connected to the pins. The laser light source of the present application features simple assembling and disassembling, reliable performance and relatively low cost.

A light emitting device includes: a base having a first stepped portion and a second stepped portion; a light emitting element; an electronic member configured to be irradiated by light emitted from the light emitting element; a first wiring region located on the first stepped portion; a second wiring region located on the second stepped portion; wires connected to the light emitting element and the electronic member. The wires includes a first and second wires. The first wire has a first end that is connected to the first wiring region, and a second end. The second wire has a first end that is connected to the second wiring region, and a second end. A position of the second end of the first wire relative to the bottom face is lower than a position of the second end of the second wire relative to the bottom face.

A laser-based light source includes a material arranged on a package base adjacent to a laser diode chip and an optical element coupled to the material. The optical element is aligned to receive electromagnetic radiation from the laser diode chip. The optical element includes a wavelength conversion material and is configured to receive at least a portion of the electromagnetic radiation emitted by the laser diode chip. A reflective material surrounds sides of the optical element.