H01S5/18388

DIFFUSE ILLUMINATION AND MULTIMODE ILLUMINATION DEVICES

Illumination modules are operable, in some implementations, to project a homogenous diffuse illumination onto a scene. Some implementations allow different subsets of light emitting elements to be addressed independently so that they can be turned on (or off) at different times, which can facilitate multi-mode operation.

Structured light projector and electronic apparatus including the same

Provided are a structured light projector that generates and projects structured light, and an electronic apparatus including the structured light projector. The structured light projector includes an illuminator configured to emit light, a pattern mask configured to form structured light by partially transmitting and partially blocking incident light from the illuminator based on a pattern of the pattern mask, and a lens configured to project the structured light. The illuminator includes a plurality of illumination areas respectively facing a plurality of areas of the pattern mask, wherein intensities of lights respectively emitted by the plurality of illumination areas are different from one other.

Light-emitting device, optical device, and information processing apparatus

A light-emitting device includes a light diffusing member that diffuses light emitted from a light source so that an object to be measured is irradiated with the light; and a holding unit that is provided on plural wires connected to the light source and holds the light diffusing member.

EMITTER WITH VARIABLE LIGHT REFLECTIVITY
20220385041 · 2022-12-01 ·

In some implementations, an emitter may include a substrate and a set of layers on the substrate. The set of layers may include a first mirror, a second mirror that includes a partial reflector and an additional layer, and at least one active region between the first mirror and the second mirror. A first reflectivity of the second mirror at a lateral center of the second mirror may be different than a second reflectivity of the second mirror at a lateral edge of the second mirror.

Single Element Dot Pattern Projector
20220385042 · 2022-12-01 · ·

Disclosed herein are single element dot pattern projectors with a meta-optics. The projectors include a laser light source and a metasurface chip integrated onto the laser light source. The metasurface chip includes metasurface elements spaced apart from the laser light source by a distance equal to the collimating function focal length of the metasurface chip. the laser light source produces light which is diffracted through the metasurface elements to produce a dot pattern. Projectors enabled by meta-optics lead to unique methods of integrating the meta-optic and unique functionality that can be added to the dot pattern.

LIGHT-EMITTING ELEMENT AND METHOD OF MANUFACTURING THE SAME

A light-emitting element includes: a laminated structure body 20 which is formed from a GaN-based compound semiconductor and in which a first compound semiconductor layer 21 including a first surface 21a and a second surface 21b that is opposed to the first surface 21a, an active layer 23 that faces the second surface 21b of the first compound semiconductor layer 21, and a second compound semiconductor layer 22 including a first surface 22a that faces the active layer 23 and a second surface 22b that is opposed to the first surface 22a are laminated; a first light reflection layer 41 that is provided on the first surface 21a side of the first compound semiconductor layer 21; and a second light reflection layer 42 that is provided on the second surface 22b side of the second compound semiconductor layer 22. The first light reflection layer 41 includes a concave mirror portion 43, and the second light reflection layer 42 has a flat shape.

LIGHT EMITTING ELEMENT

A light emitting element includes a laminated structure 20 in which a first compound semiconductor layer 21, an active layer 23, and a second compound semiconductor layer 22 are laminated, a first light reflecting layer 41, and a second light reflecting layer 42 having a flat shape, a base surface 90 located on a side of a first surface of the first compound semiconductor layer 21 has a first region 91 (upwardly convex first-A region 91A and first-B region 91B) including a protruding portion protruding in a direction away from the active layer and a second region 92 having a flat surface, the first light reflecting layer 41 is formed at least on the first-A region 91A, a second curve formed by the first-B region 91B and a straight line formed by the second region 92 intersects at an angle exceeding 0°, and the second curve includes at least one kind of figure selected from the group consisting of a combination of a downwardly convex curve, a line segment, and an arbitrary curve.

LIGHT SOURCE MODULE

A light source module includes a first semiconductor laser element hermetically sealed, a second semiconductor laser element hermetically sealed, and firth to fourth optical elements. A first laser beam prior to reaching the first optical element has divergence angle θfd1 in a direction along a second optical axis and divergence angle θsd1 in a direction along a third optical axis, and satisfy 90°>θfd1>θsd1>0°. Divergence angle θfd12 of a first laser beam in the direction along the second optical axis decreases from divergence angle θfd1, the first laser beam having exited the first optical element. A component of a first laser beam in the direction along the second optical axis is collimated, the first laser beam having exited the second optical element. The same applies to the second semiconductor laser element.

INDEPENDENTLY-ADDRESSABLE HIGH POWER SURFACE-EMITTING LASER ARRAY WITH TIGHT-PITCH PACKING

A semiconductor surface-emitting laser array can be provided with a group of independently addressable light-emitting pixels arranged in at least two rows and in a linear array on a common substrate chip and including a common cathode and a dedicated channel associated with an address trace line for each pixel. An aggregate linear pitch can be achieved between pixels of the at least two rows along the linear array in a cross process direction that is less than the size of a pixel. The semiconductor laser array can include more than one common substrate chip tiled and stitched together in a staggered arrangement to provide an at least 11-inch wide, 1200pdi imager with timing delays associated with each of the more than one common substrate chip in the staggered arrangement.

FOCUSING OPTICS FOR USE WITH SEMICONDUCTOR LASERS FOR IMAGING APPLICATIONS
20230055986 · 2023-02-23 ·

Focusing optics can include optical elements disposed and bonded in a linear arrangement (linear array) in at least two rows. A transparent bonding agent can secure alignment of the at least two rows of the optical elements. Scattering elements can also be disposed in the transparent polymer to cause light diffusion. Diffused or un-diffused light from a semiconductor laser array can then be caused to pass through the optical element and illuminate a target substrate such as an imaging member in a printing system.