A power electronic converter includes a plurality of converter cells, each comprising an inductive power transfer stage having a coupled inductor coupling first and second sides of the converter cell, wherein the inductor comprises a first winding around a first magnetic core and a second winding around a second magnetic core; wherein the first winding and the first magnetic core are separated from the second winding and the second magnetic core by a flat electric insulation layer that provides electric insulation between the first and second sides of the converter cell; wherein at least two of the coupled inductors are arranged so that their insulation layers form a single contiguous insulation layer.

The present disclosure relates to a converter for an air conditioner. The converter includes a substrate; an inductor disposed in one side of the substrate, and comprising a core and a coil wound around the core; a switching element disposed in one side of the substrate, and selectively controlling a flow of a circuit; and a heat sink for absorbing heat generated from the switching element by contacting the switching element, wherein a lead-in hole is formed in one side of the substrate, and at least a portion of the inductor is disposed in the lead-in hole, thereby quickly discharging the heat generated by the inverter and more efficiently using a space.

In this semiconductor device, an emitter electrode of a power semiconductor element includes a first sub-electrode provided in a region including a central portion of a front surface of a semiconductor substrate and a second sub-electrode provided in a region not including the central portion of the front surface of the semiconductor substrate. A first bonding wire connects the first sub-electrode and an emitter terminal. A second bonding wire connects the second sub-electrode and the emitter terminal. First and second voltage detectors detect voltages between the emitter terminal and the first and second sub-electrodes, respectively. It is possible to separately detect degradation of both the first bonding wire that degrades in an early period and the second bonding wire that degrades in a terminal period.

A power converter apparatus includes a power module assembly including a power module and a cooler overlapping with the power module to allow the cooler to cover both sides of the power module, and a capacitor and a low voltage direct-current (DC)-DC converter (LDC) which are coupled in a state of pressing the power module assembly on both sides of the power module assembly.

A transformer includes two first cores, a primary winding and a secondary winding. The secondary winding has a first section and a second section. The first section has a first outlet end, a second outlet end, and a first connection end, wherein the first outlet end and the second outlet end are located at a side of the first section, the first connection end is located at an opposite side of the first section. The second section has a third outlet end, a fourth outlet end, and a second connection end. The third outlet end and the fourth outlet end are located at a side of the second section, and the second connection end is located at an opposite side of the second section. A portion of the primary winding is located between the first section and the second section of the secondary winding.

A semiconductor circuit includes: a first inductor part configured to connect in series with a source electrode of a first semiconductor element; and a second inductor part configured to connect in series with a source electrode in a second semiconductor element that is configured to connect in parallel with the first semiconductor element; the first inductor part and the second inductor part are arranged to generate an induced electromotive force in the first inductor part and the second inductor part by way of a magnetic interaction so that the currents flowing in the first inductor part and the second inductor part are reinforced in the same direction.

A semiconductor device includes a junction field effect transistor (JFET) including a source electrode, a drain electrode, and a gate electrode, and a metal oxide semiconductor field effect transistor (MOSFET) including a source electrode, a drain electrode, and a gate electrode. The JFET and the MOSFET are cascode-connected such that the source electrode of the JFET and the drain electrode of the MOSFET are electrically connected. A gate voltage dependency of the JFET or a capacitance ratio of a mirror capacitance of the MOSFET to an input capacitance of the MOSFET is adjusted in a predetermined range.

A power converter includes a semiconductor unit, a capacitor unit, a first input connector, a second input connector, an output connector, a housing case, a first input bus bar connecting the first input connector and the semiconductor unit, a second input bus bar connecting the second input connector and the semiconductor unit, an output bus bar connecting the semiconductor unit and the output connector, and a bus bar connecting portion at which the first input bus bar and the second input bus bar are connected. The capacitor unit is arranged in a portion of the first input bus bar between the first input connector and the bus bar connecting portion.

A semiconductor device includes a semiconductor element, a first wiring member, a second wiring member, and a terminal. The semiconductor element includes a first main electrode and a second main electrode on a side opposite from the first main electrode. The first wiring member is connected to the first main electrode. The terminal has a first terminal surface connected to the second main electrode and a second terminal surface. The second terminal has four sides. Two of the four sides are parallel to a first direction intersecting the thickness direction, and other two sides of the four sides are parallel to a second direction perpendicular to the thickness direction and the first direction. The second wiring member is connected to the second terminal surface of the terminal through solder, and has a groove. The groove overlaps one or two of the four sides of the second terminal surface.

A motor integrated inverter apparatus includes a drive motor on which a decelerator is installed, and an inverter installed to be directly connected to the drive motor. The inverter includes an inverter cover installed on a side of the drive motor and having an installation space defined therein, a capacitor having the installation space defined in the inverter cover so that an end of the drive shaft is inserted into the installation space, a control board installed on a side of the capacitor, and a cooling part installed between the control board and the capacitor.