Patent classifications
H02N2/22
Wire bonded common electrical connection in a piezoelectric micro-electro-mechanical system scanning mirror assembly
Electrical connections are created between the actuator frame of a piezoelectric MEMS scanning mirror system and the substrate separate from the structural adhesive creating the mechanical bond between the actuator frame and the substrate. A structural bond (with no conducive properties) is formed between the actuator frame and the substrate. After the bond is fully formed, separate electric connections can be created by one or both of: 1) coating the actuator frame with a coating that enables a surface of the actuator frame to be wire bondable and creating a wire bond between the actuator frame and the substrate; or 2) depositing a trace of conductive material on the outside edge of the mechanical bond between the actuator frame and the substrate and a final protection layer may be applied over the conductive trace to protect the trace from mechanical or environmental damage.
ELECTROMECHANICAL ACTUATORS WITH COMPOSITE DRIVE PADS
A manufacturing method for an electromechanical drive element comprises providing (S10) of an excitation body comprising at least one volume of electromechanical material. The excitation body has a metal plate integrated as a surface of the excitation body. The excitation body being arranged to cause shape changes of the electromechanical material and the metal plate when the volume(s) of electromechanical material being excited by a voltage signal. A composite drive pad is provided (S20). The composite drive pad comprises a metal portion directly joined to a ceramic portion. After the providing of a composite drive pad, the metal portion of the composite drive pad is irreversibly attached (S30) to the metal plate of the excitation body by use of a metal-based bond. An electromechanical drive element and an electromechanical motor using such an electromechanical drive element are also disclosed.
Piezoelectric device including displacement amplification of scissor-hinge structure
The present disclosure relates to a piezoelectric device, and more particularly, to a piezoelectric device including: a piezoelectric actuator; a displacement transmission structure disposed on the piezoelectric actuator; and a displacement amplification structure disposed between the piezoelectric actuator and the displacement transmission structure. Here, the displacement amplification structure includes: a first displacement amplification structure and a second displacement amplification structure, which cross each other; and a fixing pin that passes through the first displacement amplification structure and the second displacement amplification structure to connect the first displacement amplification structure and the second displacement amplification structure. Also, each of one end of the first displacement amplification structure and one end of the second displacement amplification structure may be fixed on the piezoelectric actuator.
PIEZOELECTRIC ELEMENT AND METHOD FOR MANUFACTURING PIEZOELECTRIC ELEMENT
The disclosure provides a piezoelectric element and a method for manufacturing a piezoelectric element. The disclosure provides the piezoelectric element comprising: a base layer, a piezoelectric layer which is disposed on one surface of the base layer, and in which upwardly curved convex portions and downwardly curved concave portions are continuously disposed along a first direction; and contact members which are disposed on the concave portions of the piezoelectric layer and on the one surface of the base layer to connect the piezoelectric layer to the base layer.
Piezoelectric MEMS actuator for compensating unwanted movements and manufacturing process thereof
A MEMS actuator includes a monolithic body of semiconductor material, with a supporting portion of semiconductor material, orientable with respect to a first and second rotation axes, transverse to each other. A first frame of semiconductor material is coupled to the supporting portion through first deformable elements configured to control a rotation of the supporting portion about the first rotation axis. A second frame of semiconductor material is coupled to the first frame by second deformable elements, which are coupled between the first and the second frames and configured to control a rotation of the supporting portion about the second rotation axis. The first and second deformable elements carry respective piezoelectric actuation elements.
High Voltage Energy Harvesting and Sensing with 3D Spiral Design
Described herein is a novel piezoelectric energy harvester based on a metamaterial structure capable of scavenging energy from multiple low-frequency ambient vibrations employing a mass-in-mass Phononic crystal structure and comprised of a piezoelectric snail structure, encapsulated in a cylindrical rubber matrix, and encased in a rigid cubic frame.
Piezoelectric energy harvesting using a nonlinear buckled beam and method for same
An energy harvester includes a frame having a base, a first side member affixed to the base, and a second side member affixed to the base and spaced apart from the first side member. A beam is coupled between the first side member of the frame and the second side member of the frame. The beam has a substrate layer with a first end affixed to the first side member of the frame, a second end affixed to the second side member of the frame, a first face, and a second face opposite to the first face. The substrate is elastically deformable in response to the vibratory force. The beam further includes a first piezoelectric layer joined to the first face of the substrate layer and having a terminal for electrical connection to a load, the first piezoelectric layer comprising at least one piezoelectric patch.
Vibratory actuator and method for manufacturing the same
A vibratory actuator includes a vibration member, a contact member, and a pressure member. The vibration member includes an elastic member, having protrusions. The contact member is in contact with the elastic member and moves in a direction relative to the vibration member. The pressure member pressurizes the vibration member and the contact member. Each of the protrusions includes a first contact surface in contact with the contact member. The contact member has a second contact surface made of metal sintered material and in contact with the vibration member. A ratio of a maximum amount of depression on the second contact surface in the direction of pressurization by the pressure member to a width of the first contact surface in a direction perpendicular to the direction of movement of the contact member relative to the vibration member and the direction of pressurization by the pressure member is 0.05% or less.
Friction member to contact opposite member, method for manufacturing friction member, vibration-type actuator, and electronic device
A vibration-type actuator capable of suppressing reduction in holding torque or holding force under influence of humidity. A vibration-type actuator 10 includes a vibrating body 2 and a driven body 1. The vibrating body 2 has a piezoelectric element 2c and an elastic body 2b. The driven body 1 is in contact with the vibrating body 2. The vibration-type actuator 10 moves the vibrating body 2 and the driven body 1 relatively to each other by vibration excited to the vibrating body 2. At least one of a first contact portion of the vibrating body 2 and a second contact portion of the driven body 1 includes a stainless-steel sintered body with pores and at least some of the pores are impregnated with a resin.
Vibration wave motor, drive control system, and optical apparatus
A vibration wave motor includes an annular oscillator, and an annular moving member provided so as to be in press contact with the oscillator. The oscillator includes an annular vibrating plate, and an annular piezoelectric element provided on a first surface of the vibrating plate. The vibrating plate is in contact with the moving member via a second surface of the vibrating plate, which is opposite the first surface. The piezoelectric element has a plurality of drive phase electrodes. When a driving region represents a region of the oscillator in which the drive phase electrodes are provided, and a non-driving region represents a remaining region of the oscillator, a contact area ratio S1 between the vibrating plate and the moving member in the non-driving region is less than a contact area ratio S2 between the vibrating plate and the moving member in the driving region.