The present disclosure relates to an oscillator device (1, 1′, 1″, 1′″) comprising an active circuit device (2, 2′″), a circuit board (3) and a cavity resonator (4, 4′). The active circuit device (2, 2′″) comprises an amplifier unit (5), and the circuit board (3) comprises a first main side (6) and a 5 second main side (7), where the active circuit device (2, 2′″) is mounted to the first main side (6). The cavity resonator (4, 4′) is positioned on the second main side (7). The oscillator device (1) further comprises at least one excitation via connection (8) that runs through the circuit board (3) and electrically connects the active circuit device (2, 2′″) to an excitation structure (9) inside the cavity resonator (4, 4′).

In an example, a system includes an oscillator circuit on a chip. The oscillator circuit includes a charging current generator including a current mirror, an amplifier, and an on-chip resistor, where the on-chip resistor is coupled to a pin on the chip. The oscillator circuit also includes oscillator circuitry coupled to the charging current generator, where the oscillator circuitry includes a comparator, a phase generator, a first capacitor coupled to a first resistor, and a second capacitor coupled to a second resistor. The system also includes an external resistor coupled to the pin, where the external resistor is external to the chip. The system includes an external capacitor coupled to the pin, where the external capacitor is external to the chip.

A method of manufacturing electronics using a nanoparticle ink printing method includes: synthesizing a phase change material (PCM) ink composition using hot injection to develop nanoparticles of the PCM; suspending the nanoparticles with a solvent; and printing a reconfigurable component using the PCM ink composition in additive manufacturing. Electronics includes: a substrate layer; an insulator layer printed on top of the substrate layer; a heater layer printed on top of the insulator layer; a barrier layer printed on top of one or more of the insulator layer and the heater layer; a phase change material (PCM) printed on top of the barrier layer; a connectivity layer printed on top of the PCM; and a passivation layer printed on top of one or more of the PCM and the connectivity layer.

In an example, a system includes an oscillator circuit on a chip. The oscillator circuit includes a charging current generator including a current mirror, an amplifier, and an on-chip resistor, where the on-chip resistor is coupled to a pin on the chip. The oscillator circuit also includes oscillator circuitry coupled to the charging current generator, where the oscillator circuitry includes a comparator, a phase generator, a first capacitor coupled to a first resistor, and a second capacitor coupled to a second resistor. The system also includes an external resistor coupled to the pin, where the external resistor is external to the chip. The system includes an external capacitor coupled to the pin, where the external capacitor is external to the chip.

A crystal blank includes a pair of tableland-shaped first mesa parts projecting from a flat plate and a pair of tableland-shaped second mesa parts projecting from the pair of first mesa parts. The flat plate's length in a long direction is less than 1000 m. The first mesa part is on an inner side of the flat plate's major surface. The second mesa part is on the first mesa part's inner side of an upper surface's outer edge at two ends of the long direction and has a width equivalent to the first mesa part's upper surface at two sides of a short direction. An excitation electrode reaches the second mesa part's outer edge of the upper surface, is located on the inner side of the first mesa part, and on the second mesa part's inner side of the upper surface's outer edge at two sides of the short direction.

A dual-mode resonator, devices employing the dual-mode resonator, and the methods of making the resonator and the devices are disclosed. Embodiments include a dual-mode resonator including a semiconductor substrate; a material on the semiconductor substrate, having a cavity formed therein; a seed layer over the cavity in a V-shape, wherein sides of the V-shape form an angle of 15 to 25 degrees with a horizontal line; a bottom electrode on the seed layer; an acoustic layer on the bottom electrode; a top electrode on the acoustic layer; and a mass loading layer on the top electrode; and a cap over the dual-mode resonator.

In an example, a system includes an oscillator circuit on a chip. The oscillator circuit includes a charging current generator including a current mirror, an amplifier, and an on-chip resistor, where the on-chip resistor is coupled to a pin on the chip. The oscillator circuit also includes oscillator circuitry coupled to the charging current generator, where the oscillator circuitry includes a comparator, a phase generator, a first capacitor coupled to a first resistor, and a second capacitor coupled to a second resistor. The system also includes an external resistor coupled to the pin, where the external resistor is external to the chip. The system includes an external capacitor coupled to the pin, where the external capacitor is external to the chip.

A crystal blank includes a pair of tableland-shaped first mesa parts projecting from a flat plate and a pair of tableland-shaped second mesa parts projecting from the pair of first mesa parts. The flat plate's length in a long direction is less than 1000 m. The first mesa part is on an inner side of the flat plate's major surface. The second mesa part is on the first mesa part's inner side of an upper surface's outer edge at two ends of the long direction and has a width equivalent to the first mesa part's upper surface at two sides of a short direction. An excitation electrode reaches the second mesa part's outer edge of the upper surface, is located on the inner side of the first mesa part, and on the second mesa part's inner side of the upper surface's outer edge at two sides of the short direction.

A method of manufacturing electronics using a nanoparticle ink printing method includes: synthesizing a phase change material (PCM) ink composition using hot injection to develop nanoparticles of the PCM; suspending the nanoparticles with a solvent; and printing a reconfigurable component using the PCM ink composition in additive manufacturing. Electronics includes: a substrate layer; an insulator layer printed on top of the substrate layer; a heater layer printed on top of the insulator layer; a barrier layer printed on top of one or more of the insulator layer and the heater layer; a phase change material (PCM) printed on top of the barrier layer; a connectivity layer printed on top of the PCM; and a passivation layer printed on top of one or more of the PCM and the connectivity layer.

The present disclosure relates to an oscillator device (1, 1, 1, 1) comprising an active circuit device (2, 2), a circuit board (3) and a cavity resonator (4, 4). The active circuit device (2, 2) comprises an amplifier unit (5), and the circuit board (3) comprises a first main side (6) and a second main side (7), where the active circuit device (2, 2) is mounted to the first main side (6). The cavity resonator (4, 4) is positioned on the second main side (7). The oscillator device (1) further comprises at least one excitation via connection (8) that runs through the circuit board (3) and electrically connects the active circuit device (2, 2) to an excitation structure (9) inside the cavity resonator (4, 4).