A vibration device includes a semiconductor substrate having a first surface and a second surface in an obverse-reverse relationship, a vibration element disposed on the first surface, a lid bonded to the first surface, an integrated circuit disposed on the first surface, a terminal disposed on the second surface, a through electrode which penetrates the semiconductor substrate, and is configured to electrically couple the terminal and the integrated circuit to each other, and a first capacitor which is provided with a first recess provided to the semiconductor substrate and opening in the first surface, an insulating film disposed on an inside surface of the first recess, and an electrically-conductive material filling the first recess, and has a first capacitance between the electrically-conductive material and the semiconductor substrate, wherein the electrically-conductive material does not have contact with the terminal at the second surface side.

A vibration device includes a semiconductor substrate having a first surface and a second surface in an obverse-reverse relationship, a vibration element disposed on the first surface, a lid bonded to the first surface, an integrated circuit disposed on the first surface, a terminal disposed on the second surface, a through electrode which penetrates the semiconductor substrate, and is configured to electrically couple the terminal and the integrated circuit to each other, and a first capacitor which is provided with a first recess provided to the semiconductor substrate and opening in the first surface, an insulating film disposed on an inside surface of the first recess, and an electrically-conductive material filling the first recess, and has a first capacitance between the electrically-conductive material and the semiconductor substrate, wherein the electrically-conductive material does not have contact with the terminal at the second surface side.

A smart method is provided for a low-current oscillatory circuitry. The circuitry comprises an oscillator and a microcontroller unit (MCU). The oscillator comprises a proportional-to-absolute-temperature circuit connecting to a low-voltage regulator. The low-voltage regulator connects to a PMOS diode array and a delay unit circuit. The PMOS diode array connects to the MCU. The delay unit circuit connects to the MCU and a voltage converter. The method includes a normal temperature compensation algorithm; a smart learning algorithm of extra-high temperature compensation; and an ultra-high temperature compensation algorithm. Thus, clock variations are compensated; output frequency is stable and not affected by voltage or temperature variations; and process variations are suppressed. When process variations appear, there are not be too many errors generated. Therefore, a timebase clock is provided with high accuracy, wide operating voltage range, wide operating temperature range, and low power consumption operation.