A radio frequency amplifier includes a first input terminal, a second input terminal, an output terminal, and first and second amplifiers. The first amplifier includes a first amplifier input coupled to the first input terminal, and a first amplifier output. The second amplifier includes a second amplifier input coupled to the second input terminal, and a second amplifier output coupled to the output terminal by an output inductive element. An output combiner circuit is coupled between the first amplifier output and the second amplifier output. The output combiner circuit includes a first inductive element, a capacitor, and a second inductive element. The first inductive element is coupled between the first amplifier output and a first terminal of the capacitor, and the second inductive element is coupled between the second amplifier output and the first terminal of the capacitor. A second terminal of the capacitor is coupled to ground.

Aspects of the disclosure relate to a radio frequency phase shifter. An example includes an amplification stage to produce an amplified voltage, the amplification stage having a first amplifier with a first input coupled to a first output of a hybrid coupler and a second amplifier with a complementary second input coupled to a complementary second output of the hybrid coupler. A vector modulation stage coupled to the amplification stage receives the amplified voltage and produces a modulated vector, the vector modulation stage has an in-phase section and a quadrature section to control the phase of the modulated vector in response to a phase control signal. A varactor coupled across the first input and the second input of the amplification stage adjusts the capacitance between the first input and the second input in response to a capacitance control signal.

A power amplifying circuit includes a first input terminal applied with a first bias voltage, a first amplifying circuit generating a first output signal and a second output signal according to an input signal and a first matching circuit combining the first output signal and the second output signal to generate an output signal. The first amplifying circuit includes a first transistor having a first electrode coupled to the first input terminal and a second electrode applied with a second bias voltage and a second transistor having a first electrode s coupled to the first input terminal and a second electrode applied with a third bias voltage. The first transistor generates the first output signal according to the first bias voltage and the second bias voltage. The second transistor generates the second output signal according to the first bias voltage and the third bias voltage.

Power amplifier supply networks with harmonic terminations are disclosed. In certain embodiments, a power amplifier system includes a first power amplifier that amplifies a first radio frequency (RF) signal of a first fundamental frequency, a second power amplifier that amplifies a second RF signal of a second fundamental frequency, and a power amplifier supply network that distributes a power amplifier supply voltage to the first power amplifier at a first distribution node and to the second power amplifier at a second distribution node. The power amplifier supply network includes a first harmonic termination circuit connected to the first distribution node that provide an open circuit at about twice the first fundamental frequency, and a second harmonic termination circuit connected to the second distribution node and that provides an open circuit at about twice the fundamental frequency.

Disclosed is power amplifier circuitry having a bipolar junction power transistor with a base, a collector, and an emitter. The power amplifier circuitry includes bias correction sub-circuitry configured to generate a compensation current substantially opposite in phase and substantially equal in magnitude to an error current passed by a parasitic base-collector capacitance inherently coupled between the base and collector, wherein the bias correction sub-circuitry has a compensation output coupled to the base and through which the compensation current flows to substantially cancel the error current.

Disclosed is power amplifier circuitry having a bipolar junction power transistor with a base, a collector, and an emitter. The power amplifier circuitry includes bias correction sub-circuitry configured to generate a compensation current substantially opposite in phase and substantially equal in magnitude to an error current passed by a parasitic base-collector capacitance inherently coupled between the base and collector, wherein the bias correction sub-circuitry has a compensation output coupled to the base and through which the compensation current flows to substantially cancel the error current.

A radio frequency (RF) transistor amplifier package includes a submount, and first and second leads extending from a first side of the submount. The first and second leads are configured to provide RF signal connections to one or more transistor dies on a surface of the submount. At least one rivet is attached to the surface of the submount between the first and second leads on the first side. One or more corners of the first side of the submount may be free of rivets. Related devices and associated RF leads and non-RF leads are also discussed.

A semiconductor device includes a substrate, an active region provided in the substrate, a plurality of gate fingers provided on the active region, extending in an extension direction, and arranged in an arrangement direction orthogonal to the extension direction, and a gate connection wiring commonly connected to the plurality of gate fingers and provided between the plurality of gate fingers and a first side surface of the substrate, wherein when viewed from the arrangement direction, a first position where a first end of a first gate finger as a part of the plurality of gate fingers is connected to the gate connection wiring is closer to the first side surface than a second position where a first end of a second gate finger as another part of the plurality of gate fingers is connected to the gate connection wiring.

A semiconductor device includes a substrate, an active region provided in the substrate, a plurality of gate fingers provided on the active region, extending in an extension direction, and arranged in an arrangement direction orthogonal to the extension direction, and a gate connection wiring commonly connected to the plurality of gate fingers and provided between the plurality of gate fingers and a first side surface of the substrate, wherein when viewed from the arrangement direction, a first position where a first end of a first gate finger as a part of the plurality of gate fingers is connected to the gate connection wiring is closer to the first side surface than a second position where a first end of a second gate finger as another part of the plurality of gate fingers is connected to the gate connection wiring.

Impedance matching circuit for radio-frequency amplifier. In some embodiments, an impedance matching circuit can include a primary metal trace having a first end configured to be capable of being coupled to a voltage source for the power amplifier, and a second end configured to be capable of being coupled to an output of the power amplifier. The impedance matching circuit can further include a secondary metal trace having first end coupled to the second end of the primary metal trace, and a second end configured to be capable of being coupled to an output node. The impedance matching circuit can further include a capacitance implemented between the first and second ends of the secondary metal trace, and be configured to trap a harmonic associated with an amplified signal at the output of the power amplifier.