A differential input stage of a circuit includes a first transistor, a second transistor, a third transistor, and a fourth transistor. Drains of the first and third transistors couple together at a first node, and drains of the second and fourth transistors couple together at a second node. A first slew boost circuit includes a fifth transistor and a first current mirror. A gate of the fifth transistor couples to the second node. A source of the fifth transistor couples to the first node. The first current mirror couples to the fifth transistor and to the second node. A second slew boost circuit includes a sixth transistor and a second current mirror. A gate of the sixth transistor couples to the first node. A source of the sixth transistor couples to the second node. The second current mirror couples to the sixth transistor and to the first node.

In a preamplifier (amplifier) for the radiation detector, an interconnection layer connected to the bonding pad forms one electrode of a feedback capacitor. Since there is no wiring for connecting the bonding pad and capacitor, a parasitic capacitance caused by the wiring will not be generated. Moreover, the capacitor is arranged below the bonding pad with a conductive layer serving as the other electrode, so that the feedback capacitance of the capacitor is included in the parasitic capacitance between the interconnection layer and the substrate. Compared to the conventional case, an amount of capacitance corresponding to the parasitic capacitance caused by wiring and the feedback capacitance for the capacitor is reduced from the input capacitance. Thus, the input capacitance for the amplifying circuit is reduced.

A transimpedance amplifier (TIA) for converting an input current at an input node into an output voltage at an output node, the TIA comprising: a first amplifier stage having a first input coupled to the input node and a first output; a feedback path between the first output and the first input; a second amplifier stage in the feedback path having a second input, the second input coupled to the first output of the first amplifier stage; a feedback resistor in the feedback path coupled between an output of the second amplifier stage and first input of the first amplifier stage; and an output stage, comprising: a load resistor coupled between a reference voltage node and a T-coil, the T-coil comprising first and second inductors coupled in series at an inductor node, the T-coil coupled between the first output and the load resistor, the inductor node coupled to the output node of the TIA.

Transconductor circuits with programmable tradeoff between bandwidth and flicker noise are disclosed. An example circuit includes an input port, an output port, a plurality of transistors, and a switch arrangement that includes a plurality of switches, configured to change coupling between the input port, the output port, and the transistors to place the transconductor circuit in a first or a second mode of operation. An input capacitance of the transconductor circuit operating in the first mode is larger than when the transconductor circuit is operating in the second mode. In the first mode, having a larger input capacitance results in a decreased flicker noise because the amount of flicker noise is inversely proportional to the input capacitance. In the second mode, having a smaller input capacitance leads to an increased flicker noise but that is acceptable for wide-bandwidth applications because wide-bandwidth signals may be less sensitive to flicker noise.

A device, a memory interface device, and a method of implementing an active inductor circuit are disclosed. In one aspect, the device includes one or more active inductor circuits, each including a first metal-oxide-semiconductor (MOS) transistor and a second MOS transistor. The first MOS transistor has a first terminal connected to a first voltage level, a second terminal connected to a resistor, and a gate terminal. The second MOS transistor has a first terminal connected to the first voltage level, a second terminal connected to a first current source and the gate terminal of the first MOS transistor, and a gate terminal connected to the resistor and to a capacitor connected to a second voltage level. One of the first MOS transistor and the second MOS transistor is a p-channel MOS (PMOS) transistor, and another of the first MOS transistor and the second MOS transistor is an n-channel MOS (NMOS) transistor.

A receiver front end having low noise amplifiers (LNAs) is disclosed herein. A cascode having a “common source” configured input FET and a “common gate” configured output FET can be turned on or off using the gate of the output FET. A first switch is provided that allows a connection to be either established or broken between the source terminal of the input FET of each LNA. A drain switch is provided between the drain terminals of input FETs to place the input FETs in parallel. This increases the g.sub.m of the input stage of the amplifier, thus improving the noise figure of the amplifier.

A sensor assembly including a capacitive sensor, like a microelectromechanical (MEMS) microphone, and an electrical circuit therefor are disclosed. The electrical circuit includes a first transistor having an input gate connectable to the capacitive sensor, a second transistor having an input gate coupled to an output of the first transistor, a feedforward circuit interconnecting a back-gate of the second transistor and the output of the first transistor, and a filter circuit interconnecting the output of the first transistor and the input gate of the second transistor.

An application specific integrated circuit (ASIC) can drive semiconductor devices, such as, radio frequency amplifiers, switches, etc. The ASIC can include a supply and reference voltage generation circuit, a digital core, a clock generator, a plurality of analog-to-digital converters, low and high-speed communications interfaces, drain and gate sensing circuits (that can include one or more current sense amplifiers), and a gate driver circuit. The ASIC can be a low voltage semiconductor integrated circuit.

An operational amplifier 1 comprises transistors Q1 and Q2 forming an input stage, and input resistors R1 and R2 which form a filter together with parasitic capacitors C1 and C2 accompanying the transistors Q1 and Q2. Resistance values R of the resistors R1 and R2 may be set to R=1/(2π.Math.fc.Math.C), where C is the capacitance value of each of the parasitic capacitors C1 and C2, and fc is the target cutoff frequency of the filter. The operational amplifier 1 may also include a power supply resistor R0 which forms a filter together with a parasitic capacitor C0 accompanying a power supply line.

A semiconductor device (1) according to the present disclosure includes: an n-channel depletion-mode transistor (10); an input matching circuit inside which the gate terminal (11) and the ground terminal (22) are DC-connected; a self-bias circuit (26) including a resistor (14) biasing the transistor (10) by a voltage drop due to a current flowing through the resistor (14), and a capacitor (15) connected in parallel to the resistor 14) and regarded as short-circuit at a frequency of the high-frequency power; and a diode (31) having an endmost anode connected to the source terminal (12) and an endmost cathode connected to the ground terminal (22), and connected in one stage or connected in series in a plurality of stages in the same direction.