A power amplifying circuit includes a first input terminal applied with a first bias voltage, a first amplifying circuit generating a first output signal and a second output signal according to an input signal and a first matching circuit combining the first output signal and the second output signal to generate an output signal. The first amplifying circuit includes a first transistor having a first electrode coupled to the first input terminal and a second electrode applied with a second bias voltage and a second transistor having a first electrode s coupled to the first input terminal and a second electrode applied with a third bias voltage. The first transistor generates the first output signal according to the first bias voltage and the second bias voltage. The second transistor generates the second output signal according to the first bias voltage and the third bias voltage.

A filter device configured to directly connect to a differential power amplifier of a transmit chain circuit. The filter device may include a transformer and a filter configured as a half lattice equivalent topology and having a single-ended output. The filter may be a lattice filter configured as a full lattice topology or a lattice equivalent filter configured as a half lattice equivalent topology. The filter includes a first branch having a first impedance network of one or more first impedance elements and a second branch having a second impedance network of one or more second impedance elements. The single-ended output of the filter device may connect to an antenna switch that is in turn connected to an antenna.

A radio frequency (RF) transistor amplifier package includes a submount, and first and second leads extending from a first side of the submount. The first and second leads are configured to provide RF signal connections to one or more transistor dies on a surface of the submount. At least one rivet is attached to the surface of the submount between the first and second leads on the first side. One or more corners of the first side of the submount may be free of rivets. Related devices and associated RF leads and non-RF leads are also discussed.

A power amplifier circuit includes a current generator and a current mirror driver. The current generator has a first input connected to a first voltage supply and an output configured to generate a first current. The current generator includes a first transistor, a second transistor, a first resistor and a second resistor. The first transistor has an emitter connected to ground. The second transistor has a base connected to a base of the first transistor and an emitter connected to ground. The first resistor is connected between the first voltage supply and a collector of the first transistor. The second resistor is connected between the first voltage supply and a collector of the second transistor. The current mirror drive has a first input connected to the output of the current generator to receive the first current and an output configured to generate a second current.

Impedance matching circuit for radio-frequency amplifier. In some embodiments, an impedance matching circuit can include a primary metal trace having a first end configured to be capable of being coupled to a voltage source for the power amplifier, and a second end configured to be capable of being coupled to an output of the power amplifier. The impedance matching circuit can further include a secondary metal trace having first end coupled to the second end of the primary metal trace, and a second end configured to be capable of being coupled to an output node. The impedance matching circuit can further include a capacitance implemented between the first and second ends of the secondary metal trace, and be configured to trap a harmonic associated with an amplified signal at the output of the power amplifier.

A Doherty amplifier circuit comprising: a splitter having: a splitter-input-terminal for receiving an input signal; a main-splitter-output-terminal; and a peaking-splitter-output-terminal; a main-power-amplifier having a main-power-input-terminal and a main-power-output-terminal, wherein; the main-power-input-terminal is connected to the main-splitter-output-terminal; and the main-power-output-terminal is configured to provide a main-power-amplifier-output-signal; a peaking-power-amplifier having a peaking-power-input-terminal and a peaking-power-output-terminal, wherein: the peaking-power-input-terminal is connected to the peaking-splitter-output-terminal; and the peaking-power-output-terminal is configured to provide a peaking-power-amplifier-output-signal. The splitter, the main-power-amplifier and the peaking-power-amplifier are provided by means of an integrated circuit.

Provided is a bias circuit that supplies a first bias current or voltage to an amplifier that amplifies a radio frequency signal. The bias circuit includes: an FET that has a power supply voltage supplied to a drain thereof and that outputs the first bias current or voltage from a source thereof; a first bipolar transistor that has a collector thereof connected to a gate of the FET, that has a base thereof connected to the source of the FET, that has a common emitter and that has a constant current supplied to the collector thereof; and a first capacitor that has one end thereof connected to the collector of the first bipolar transistor and that suppresses variations in a collector voltage of the first bipolar transistor.

An embodiment of a Doherty amplifier module includes a substrate, an RF signal splitter, a carrier amplifier die, and a peaking amplifier die. The RF signal splitter divides an input RF signal into first and second input RF signals, and conveys the first and second input RF signals to first and second splitter output terminals. The carrier amplifier die includes one or more first power transistors configured to amplify, along a carrier signal path, the first input RF signal to produce an amplified first RF signal. The peaking amplifier die includes one or more second power transistors configured to amplify, along a peaking signal path, the second input RF signal to produce an amplified second RF signal. The carrier and peaking amplifier die are coupled to the substrate so that the RF signal paths through the carrier and peaking amplifier die extend in substantially different (e.g., orthogonal) directions.

Example multi-band phased array are described. One example multi-band phased array includes a plurality of branches coupled to a plurality of multi-band antennas. Each of the plurality of branches includes a low noise amplifier and a power amplifier. The power amplifier and the low noise amplifier are configured to transmit and receive, in a time-sharing manner, a signal of a first frequency band and a signal of a second frequency band that are received by the multi-band phased array, and the first frequency band and the second frequency band are different and do not overlap. Each of the plurality of branches further includes a phase shifter, where the phase shifter is configured to perform phase shifting on the signal of the first frequency band, and the phase shifter is further configured to perform phase shifting on the signal of the second frequency band.

An amplifier circuit to be used in a sonar is described. The amplifier circuit includes a transducer and a matching circuit. The transducer has an impedance characteristic having a resonance frequency and an anti-resonance frequency higher than the resonance frequency. The matching circuit is connected to the transducer. The impedance characteristic of the transducer connected to the matching circuit has a first resonance frequency and a second resonance frequency higher than the first resonance frequency.