A multi-frequency low noise amplifier includes an input matching network, an amplifying circuit and an output matching network. The input matching network includes a first out-of-band rejection circuit and a first frequency band selection circuit. The output matching network includes a second out-of-band rejection circuit and a second frequency band selection circuit. The first out-of-band rejection circuit can reject signal of any frequency band in the radio frequency signals so that signals of the remaining frequency bands can pass through. The first frequency band selection circuit can screen out the signals of reference frequency spots from the remaining frequency bands. The second frequency band selection circuit can screen out the signals of partial frequency spots from the amplified signals of reference frequency spots. The second out-of-band rejection circuit can reject the signal of any frequency spot in the signals of partial frequency spots.

A device includes an integrated circuit (IC) die. The IC die includes a silicon germanium (SiGe) substrate, a first RF signal input terminal, a first RF signal output terminal, a first amplification path between the first RF signal input terminal and the first RF signal output terminal, a second RF signal input terminal, a second RF signal output terminal, and a second amplification path between the second RF signal input terminal and the second RF signal output terminal. The device includes a first power transistor die including a first input terminal electrically connected to the first RF signal output terminal and a second power transistor die including a second input terminal electrically connected to the second RF signal output terminal. The first amplification path can include two heterojunction bipolar transistors (HBTs) connected in a cascode configuration and the second amplification path can include two HBTs connected in a cascode configuration.

Inductance-capacitance (LC) resonators having different resonant frequencies, and radio frequency (RF) transistor amplifiers including the same. One usage of such LC resonators is to implement RF short/DC block circuits. A RF transistor amplifier may include a transistor on a base of the RF transistor amplifier coupled to an input and an output of the RF transistor amplifier; a first inductance-capacitance (LC) resonator comprising a first inductance and a first capacitance; and a second LC resonator comprising a second inductance and a second capacitance. The first LC resonator may be configured to resonate at a first frequency, and the second LC resonator may be configured to resonate at a second frequency different from the first frequency.

A Doherty amplifier includes a divider configured to divide an input signal into two signals, a first amplifier configured to amplify one of the two signals and output the amplified signal to a first node, a second amplifier configured to amplify the other of the two signals and output the amplified signal to a second node, a balun including lumped parameter elements and configured to output a signal obtained by combining the signal output from the first amplifier with the signal output from the second amplifier to a third node, and a path configured to DC-connect the first node to the second node, with the third node therebetween.

Two transistor rows are arranged on or in a substrate. Each of the two transistor rows is configured by a plurality of transistors aligned in a first direction, and the two transistor rows are arranged at an interval in a second direction orthogonal to the first direction. A first wiring is arranged between the two transistor rows when seen from above. The first wiring is connected to collectors or drains of the plurality of transistors in the two transistor rows. The first bump overlaps with the first wiring when seen from above, is arranged between the two transistor rows, and is connected to the first wiring.

A power amplifier including: a main power amplification device having an output; an auxiliary power amplification device having an output; a load modulation circuit operably connected to the output of the main power amplification device and the output of the auxiliary power amplification device; and a post-matching circuit operably connected to load modulation circuit. The load modulation circuit is arranged to enable fundamental frequency load modulation and to enable modulated harmonic terminations of at least the second and third harmonic frequencies. The modulated harmonic terminations may include drain terminations.

An amplification device includes an amplification circuit, an inductor, a regulator, and a impedance circuit. The amplification circuit has an input terminal for receiving a radio frequency signal, and an output terminal for outputting an amplified radio frequency signal. The inductor has a first terminal, and a second terminal coupled to the output terminal of the amplification circuit. The regulator is coupled to the first terminal of the inductor and generates a steady voltage and/or a steady current. The impedance circuit has a first terminal coupled to the output terminal of the amplification circuit, and a second terminal coupled to a first system voltage terminal. The impedance circuit provides a low frequency impedance path to suppress a beat frequency signal in the amplified radio frequency signal.

Inductance-capacitance (LC) resonators having different resonant frequencies, and radio frequency (RF) transistor amplifiers including the same. One usage of such LC resonators is to implement RF short/DC block circuits. A RF transistor amplifier may include a transistor on a base of the RF transistor amplifier coupled to an input and an output of the RF transistor amplifier; a first inductance-capacitance (LC) resonator comprising a first inductance and a first capacitance; and a second LC resonator comprising a second inductance and a second capacitance. The first LC resonator may be configured to resonate at a first frequency, and the second LC resonator may be configured to resonate at a second frequency different from the first frequency.

RF amplifiers are provided that include a submount such as a thermally conductive flange. A dielectric substrate is mounted on an upper surface of the submount, the dielectric substrate having a first outer sidewall, a second outer sidewall that is opposite and substantially parallel to the first outer sidewall, and an interior opening. An RF amplifier die is mounted on the submount within the interior opening of the dielectric substrate, where a longitudinal axis of the RF amplifier die defines a first axis. The RF amplifier die is positioned so that a first angle defined by the intersection of the first axis with the first outer sidewall is between 5° and 45°. The dielectric substrate may be a ceramic substrate or a dielectric layer of a printed circuit board.

An output matching circuit includes: a converter electrically connected to an output end of a power amplifier element to convert an impedance of the output end to an impedance higher than the impedance of the output end by magnetic coupling; and a first filter circuit electrically connected between the output end of the power amplifier element and the converter to make a short circuit in a frequency band different from a predetermined transmission frequency band.