H03F2203/7209

MULTI-MODE MULTI-PORT DRIVER FOR TRANSCEIVER INTERFACE

A transceiver interface circuit, comprising a driver amplifier (DA), a load line impedance modulation circuit coupled to the DA; and multiple selectable output ports coupled to the load line impedance modulation circuit, an impedance presented by the load line impedance modulation circuit being adjustable dependent on at least a number of output ports coupled to the load line impedance modulation circuit.

Amplifier circuitry for carrier aggregation

An electronic device may include wireless circuitry with a baseband processor, a transceiver circuit, a front-end module, and an antenna. The front-end module may include amplifier circuitry such as a low noise amplifier for amplifying received radio-frequency signals. The amplifier circuitry is operable in a non-carrier-aggregation mode and a carrier aggregation mode. The amplifier circuitry may include an input transformer that is coupled to multiple amplifier stages such as a common gate amplifier stage, a cascode amplifier stage, and a common source amplifier stage. The common gate amplifier stage may include switches for selectively activating a set of cross-coupled capacitors to help maintain input impedance matching in the non-carrier-aggregation mode and the carrier-aggregation mode. The common source amplifier stage may include additional switches for activating and deactivating the common source amplifier stage to help maintain the gain in the non-carrier-aggregation mode and the carrier-aggregation mode.

Transconductor circuits with programmable tradeoff between bandwidth and flicker noise
11569797 · 2023-01-31 · ·

Transconductor circuits with programmable tradeoff between bandwidth and flicker noise are disclosed. An example circuit includes an input port, an output port, a plurality of transistors, and a switch arrangement that includes a plurality of switches, configured to change coupling between the input port, the output port, and the transistors to place the transconductor circuit in a first or a second mode of operation. An input capacitance of the transconductor circuit operating in the first mode is larger than when the transconductor circuit is operating in the second mode. In the first mode, having a larger input capacitance results in a decreased flicker noise because the amount of flicker noise is inversely proportional to the input capacitance. In the second mode, having a smaller input capacitance leads to an increased flicker noise but that is acceptable for wide-bandwidth applications because wide-bandwidth signals may be less sensitive to flicker noise.

HIGH-FREQUENCY SIGNAL TRANSMISSION-RECEPTION CIRCUIT
20230027206 · 2023-01-26 ·

A high-frequency signal transmission-reception circuit includes a plurality of band pass filter groups each including a plurality of band pass filter pairs; a first switch including a plurality of band pass filter-side terminal groups each including a plurality of band pass filter-side terminals, and an antenna-side terminal group; a plurality of couplers configured to output respective signal strengths of high-frequency signals transmitted on a plurality of transmission paths; and a second switch including an input terminal group electrically connected to the plurality of couplers, and an output terminal configured to output a detection signal output from one of the plurality of couplers. The first switch electrically connects one band pass filter-side terminal in one band pass filter-side terminal group and one antenna-side terminal, and also electrically connects one band pass filter-side terminal in another band pass filter-side terminal group and another antenna-side terminal.

RECONFIGURABLE OUTPUT BALUN FOR WIDEBAND PUSH-PULL POWER AMPLIFIERS

Reconfigurable output baluns for wideband push-pull amplifiers are disclosed. In certain embodiments, a mobile device includes a transceiver that generates a first radio frequency signal of a first frequency band and a second radio frequency signal of a second frequency band, and a front-end system including a push-pull power amplifier that selectively amplifies one of the first radio frequency signal or the second radio frequency signal based on a band control signal. The push-pull power amplifier includes an input balun, an output balun, and a pair of amplifiers coupled between the input balun and the output balun. The band control signal is operable to control an impedance of the output balun.

MULTI-BAND POWER AMPLIFIER MODULE
20230016198 · 2023-01-19 ·

A multi-band power amplifier module includes at least one transmission input terminal, at least one power amplifier circuit that receives a first transmission signal and a second transmission signal through the at least one transmission input terminal, a first filter circuit that allows the first transmission signal to pass therethrough, a second filter circuit that allows the second transmission signal to pass therethrough, at least one transmission output terminal through which the first and second transmission signals output from the first and second filter circuits are output, a transmission output switch that outputs each of the first and second transmission signals output from the at least one power amplifier circuit to the first filter circuit or the second filter circuit, and a first tuning circuit that adjusts impedance matching between the at least one power amplifier circuit and the at least one transmission output terminal.

Acoustic wave resonator with mass loading strip for suppression of transverse mode

Aspects of this disclosure relate to an acoustic wave resonator with transverse mode suppression. The acoustic wave resonator can include a piezoelectric layer, an interdigital transducer electrode, a temperature compensation layer, and a mass loading strip. The mass loading strip can be a conductive strip. The mass loading strip can overlap edge portions of fingers of the interdigital transducer electrode. A layer of the mass loading strip can have a density that is at least as high as a density of a material of the interdigital transducer electrode. The material of the interdigital transducer can impact acoustic properties of the acoustic wave resonator.

Drain sharing split LNA
11705873 · 2023-07-18 · ·

A receiver front end having low noise amplifiers (LNAs) is disclosed herein. A cascode having a “common source” configured input FET and a “common gate” configured output FET can be turned on or off using the gate of the output FET. A first switch is provided that allows a connection to be either established or broken between the source terminal of the input FET of each LNA. A drain switch is provided between the drain terminals of input FETs to place the input FETs in parallel. This increases the g.sub.m of the input stage of the amplifier, thus improving the noise figure of the amplifier.

TRANSMISSION/RECEPTION MODULE
20230018236 · 2023-01-19 ·

A transmission/reception module includes a substrate including a transmission signal input terminal, a reception signal output terminal, and an antenna terminal, an antenna switch circuit provided on the substrate and configured to output a transmission signal input from the transmission signal input terminal to the antenna terminal and configured to output a reception signal input from the antenna terminal to the reception signal output terminal, and a first inductor included in an input/output filter circuit provided between the antenna switch circuit and the antenna terminal. The first inductor includes a conductor whose winding axis direction is orthogonal to the substrate.

WAFER LEVEL PACKAGE HAVING ENHANCED THERMAL DISSIPATION
20230013541 · 2023-01-19 ·

A surface acoustic wave device including a piezoelectric layer, an interdigital transducer electrode over the piezoelectric layer, and a polymeric roof layer arranged over the piezoelectric layer and interdigital transducer electrode. The polymeric roof layer is spaced apart from the piezoelectric layer to define a cavity to accommodate the interdigital transducer electrode. The polymeric roof layer is supported along a span of the polymeric roof layer by at least one pillar. The thermal conductivity of the pillar is greater than the thermal conductivity of the polymeric roof layer. Related wafer-level packages, radio frequency modules and wireless communication devices are also provided.