The present disclosure relates to devices and methods for programming one-time programmable fuses of microphone assemblies. One microphone assembly includes a housing, a transducer, a filter circuit, and an integrated circuit. The integrated circuit has a fuse block having a one-time programmable (OTP) fuse configurable in a programming mode of operation during which a voltage applied to the supply voltage contact is increased relative to a voltage applied to a supply voltage contact in a normal mode of operation. The microphone assembly further includes a protection circuit configured to regulate a voltage at the voltage input terminal of the integrated circuit during the programming mode of operation based on a comparison of a voltage at the voltage input terminal with a reference voltage. The voltage on the voltage input terminal of the integrated circuit tracks the reference voltage during the programming mode of operation.

The present disclosure relates to devices and methods for programming one-time programmable fuses of microphone assemblies. One microphone assembly includes a housing, a transducer, a filter circuit, and an integrated circuit. The integrated circuit has a fuse block having a one-time programmable (OTP) fuse configurable in a programming mode of operation during which a voltage applied to the supply voltage contact is increased relative to a voltage applied to a supply voltage contact in a normal mode of operation. The microphone assembly further includes a protection circuit configured to regulate a voltage at the voltage input terminal of the integrated circuit during the programming mode of operation based on a comparison of a voltage at the voltage input terminal with a reference voltage. The voltage on the voltage input terminal of the integrated circuit tracks the reference voltage during the programming mode of operation.

A clamping circuit comprises a first field-effect transistor (FET) having a gate, a source, and a drain, a diode, a first voltage source, and coupling circuitry configured to couple the first voltage source to the drain of the first FET and the diode to the source of the first FET.

A clamping circuit comprises a first field-effect transistor (FET) having a gate, a source, and a drain, a diode, a first voltage source, and coupling circuitry configured to couple the first voltage source to the drain of the first FET and the diode to the source of the first FET.

Systems and methods are provided for detecting water within an electronic power steering assembly. A sensor assembly includes a resistor and a water-sensitive capacitor arranged to provide a series resistor-capacitor (RC) network having a cut-off frequency that is a function of a capacitance of the water-sensitive capacitor. An oscillator provides an excitation to the series RC network having a known frequency, such that the series RC network provides an output in response to the excitation. An envelope detector receives the output of the series RC network and generates an output representing an amplitude of the output of the series RC network. A microcontroller determines if water is present within the electronic power steering assembly from the amplitude of the output of the series RC network.

Systems and methods are provided for detecting water within an electronic power steering assembly. A sensor assembly includes a resistor and a water-sensitive capacitor arranged to provide a series resistor-capacitor (RC) network having a cut-off frequency that is a function of a capacitance of the water-sensitive capacitor. An oscillator provides an excitation to the series RC network having a known frequency, such that the series RC network provides an output in response to the excitation. An envelope detector receives the output of the series RC network and generates an output representing an amplitude of the output of the series RC network. A microcontroller determines if water is present within the electronic power steering assembly from the amplitude of the output of the series RC network.

An electronic device includes an IC mounted on a substrate and a filter circuit connected to the IC. The filter circuit includes a coil component and a capacitor. The coil component includes a multilayer body, a first coil including a portion of multiple wiring patterns laminated in the multilayer body, a second coil provided on layers different from those of the first coil and including a portion of the multiple wiring patterns, and first, second and third electrodes provided on side surfaces. An opening of the first coil is at least partially overlapped with an opening of the second coil when viewed from a main surface direction. The third electrode is grounded via the capacitor. The first coil has an inductance lower than that of the second coil.

An electronic device includes an IC mounted on a substrate and a filter circuit connected to the IC. The filter circuit includes a coil component and a capacitor. The coil component includes a multilayer body, a first coil including a portion of multiple wiring patterns laminated in the multilayer body, a second coil provided on layers different from those of the first coil and including a portion of the multiple wiring patterns, and first, second and third electrodes provided on side surfaces. An opening of the first coil is at least partially overlapped with an opening of the second coil when viewed from a main surface direction. The third electrode is grounded via the capacitor. The first coil has an inductance lower than that of the second coil.

A surface mount component can include a monolithic substrate, an input terminal, an output terminal, and a DC bias terminal. Each terminal can be formed over the monolithic substrate. A conductive trace can be formed over a surface of the monolithic substrate included in a signal path between the input terminal and the output terminal. A thin-film resistor can be connected in a DC bias path between the DC bias terminal and the signal path. The DC bias path can have, at one or more locations along the DC bias path between the DC bias terminal and the signal path, a cross-sectional area in a plane that is perpendicular to the surface of the monolithic substrate. The cross-sectional area of the DC bias path can be less than about 1,000 square microns.

A surface mount component can include a monolithic substrate, an input terminal, an output terminal, and a DC bias terminal. Each terminal can be formed over the monolithic substrate. A conductive trace can be formed over a surface of the monolithic substrate included in a signal path between the input terminal and the output terminal. A thin-film resistor can be connected in a DC bias path between the DC bias terminal and the signal path. The DC bias path can have, at one or more locations along the DC bias path between the DC bias terminal and the signal path, a cross-sectional area in a plane that is perpendicular to the surface of the monolithic substrate. The cross-sectional area of the DC bias path can be less than about 1,000 square microns.