Radio-frequency splitter circuits, devices and methods. In some embodiments, a power splitter can include an input port, a first output port and a second output port. The power splitter can further include a first signal path implemented between the input port and the first output port, and a second signal path implemented between the input port and the second output port. Each of the first and second signal paths can include a variable capacitance configured to provide a plurality of capacitance values that result in different frequency responses of the respective signal path.

Self-interference cancellers are provided. The self-interference cancellers can include multiple second-order, N-path G.sub.m-C filters. Each filter can be configured to cancel self-interference on a channel of a desired bandwidth. Each filter can be independently controlled using a variable transmitter resistance, a variable receiver resistance, a variable baseband capacitance, a variable transconductance, and a variable time shift between local oscillators that control switches in the filter. By controlling these variables, magnitude, phase, slope of magnitude, and slope of phase of the cancellers frequency responses can be controlled for self-interference cancellation. A calibration process is also provided for configuring the canceller.

A radio-frequency module includes a first terminal, a second terminal, a first switch including a first switch terminal connected to the first terminal and a second switch terminal connectable to the first switch terminal, a second switch including a third switch terminal connectable to the second terminal, a first filter connected between the second switch terminal and the third switch terminal, and a substrate. The first switch and the second switch are included in a single semiconductor chip. The first filter and the semiconductor chip are on the substrate. In a plan view of the substrate, a first distance between the third switch terminal and the first switch terminal or a second distance between the third switch terminal and the second switch terminal is greater than a third distance between the first switch terminal and the second switch terminal.

Systems, devices, and methods related to phase shifters are provided. An example true time-delay (TTD) phase shifter structure includes a signal conductive line disposed on a first layer of the structure; a first switchable ground plane comprising a first conductive plane disposed on a second layer of the structure; a second switchable ground plane comprising a second conductive plane disposed on a third layer of the structure, where the first, second, and third layers are separate layers of the structure; a first switch coupled between the first switchable ground plane and a first ground element, the first ground element disposed on the second layer; and a second switch coupled between the second switchable ground plane and a second ground element, the second ground element disposed on the third layer.

A broadband power splitter can include an input port, a first output port and a second output port. The power splitter can further include a first signal path implemented between the input port and the first output port, and a second signal path implemented between the input port and the second output port. Each of the first and second signal paths can include a variable capacitance configured to provide a plurality of capacitance values that result in different frequency responses of the respective signal path.

A radio-frequency module includes a multilayer substrate, an input switch, an output switch, and filters. A switch IC is disposed on a main surface of the multilayer substrate. The input switch is disposed in the switch IC and includes a first input terminal and first output terminals. The output switch is disposed in the switch IC and includes second input terminals and a second output terminal. The filters are disposed outside the switch IC and are connected to the first output terminals and the second input terminals. In a plan view of the multilayer substrate, the first input terminal and the first output terminals are disposed close to a first side of an exterior of the switch IC, and the second input terminals and the second output terminal are disposed close to a second side different from the first side of the exterior of the switch IC.

A radio-frequency module includes a first terminal configured to receive a signal from an antenna, a substrate, a first filter element on the substrate, a first switch including a first switch terminal and a second switch terminal connectable to the first switch terminal, and connected between the first terminal and the first filter element, and a second switch including a third switch terminal. The first filter element is connected between the second switch terminal and the third switch terminal, the first switch and the second switch are included in a semiconductor chip, and the semiconductor chip is on the substrate.

Radio-frequency splitter circuits, devices and methods. In some embodiments, a power splitter can include an input port, a first output port and a second output port. The power splitter can further include a first signal path implemented between the input port and the first output port, and a second signal path implemented between the input port and the second output port. Each of the first and second signal paths can include a variable capacitance configured to provide a plurality of capacitance values that result in different frequency responses of the respective signal path.

A radio-frequency module includes a first terminal configured to receive a signal from an antenna, a substrate, a first filter element on the substrate, a first switch including a first switch terminal and a second switch terminal connectable to the first switch terminal, and connected between the first terminal and the first filter element, and a second switch including a third switch terminal. The first filter element is connected between the second switch terminal and the third switch terminal, the first switch and the second switch are included in a semiconductor chip, and the semiconductor chip is on the substrate.

Broadband power splitter. In some embodiments, a power splitter can include an input port, a first output port and a second output port. The power splitter can further include a first signal path implemented between the input port and the first output port, and a second signal path implemented between the input port and the second output port. Each of the first and second signal paths can include a variable capacitance configured to provide a plurality of capacitance values that result in different frequency responses of the respective signal path.