A passband filter includes a first and second microelectromechanical resonator system, each including a resonating beam, a drive electrode, and a sense electrode. An AC input signal is coupled to the drive electrode of the first and second microelectromechanical resonator system. A differential-to-single ended amplifier has a first input and second input respectively coupled to the sense electrodes of the first and second microelectromechanical resonator systems. An output of the differential-to-single ended amplifier is an output of the passband filter that provides a bandpass filtered signal of the AC input signal. A DC bias signal is coupled to the resonating beams of the first and second microelectromechanical resonator systems. The first microelectromechanical resonator system exhibits a hardening nonlinear behavior defining an upper stop frequency of the passband and the second microelectromechanical resonator system exhibits a softening nonlinear behavior defining a lower stop frequency of the passband.

The invention relates to a method of manufacturing a plurality of mechanical resonators in a manufacturing wafer, the resonators being intended to equip a regulating member of a timepiece, the method comprising the following steps: (a) fabricating a plurality of resonators in at least one wafer according to reference specifications; (b) measuring the actual frequency of each of the plurality of resonators; (c) determining the offset of the actual frequency of the resonators with respect to the reference specifications; and (d) applying on at least one of the resonators at least two masses from a series of tuning masses to compensate the offset of the concerning resonator to bring the resonator closer to the reference specifications.

The invention relates to a method for manufacturing an electroacoustic resonator comprising the steps of: Providing a first substrate having a first side and an opposite second side; depositing a diamond layer having a first side and an opposite second side on said first substrate, wherein the second side of the diamond layer is in contact with said first side of the first substrate; removing the first substrate; forming a piezoelectric layer on the second side of the diamond layer; applying a second substrate to the first side of the diamond layer.

The invention relates to a method for manufacturing an electroacoustic resonator comprising the steps of: Providing a first substrate having a first side and an opposite second side; depositing a diamond layer having a first side and an opposite second side on said first substrate, wherein the second side of the diamond layer is in contact with said first side of the first substrate; removing the first substrate; forming a piezoelectric layer on the second side of the diamond layer; applying a second substrate to the first side of the diamond layer.

A MEMS (microelectromechanical system) resonator includes a first layer of single-crystalline silicon, a second layer of single-crystalline silicon, and a piezoelectric layer in between said first layer of single-crystalline silicon and the second layer of single-crystalline silicon. A manufacturing method of the MEMS resonator includes at least one of the interfaces between the single-crystalline silicon layers and the piezoelectric layer be made by wafer bonding.

A dual-shell architecture and methods of fabrication of fused quartz resonators is disclosed. The architecture may include two encapsulated and concentric cavities using plasma-activated wafer bonding followed by the high-temperature glassblowing. The dual-shell architecture can provide a protective shield as well as a “fixed-fixed” anchor for the sensing element of the resonators. Structures can be instrumented to operate as a resonator, a gyroscope, or other vibratory sensor and for precision operation in a harsh environment. Methods for fabricating a dual-shell resonator structure can include pre-etching cavities on a cap wafer, pre-etching cavities on a device wafer, bonding the device wafer to a substrate wafer to form a substrate pair and aligning and bonding the cap wafer to the substrate pair to form a wafer stack with aligned cavities including a cap cavity and a device cavity. The wafer stack may be glassblown to form a dual-shell structure.

Three-dimensional (3D) micro-scale shells are presented with openings of various sizes and geometries on the surface. The shell consist of a suspended ring-shaped resonator, multiple support beams, a support post, and a cap region that connects the support beams to the support post. Shells with openings of various sizes and geometries allow the creation of micro electromechanical systems (MEMS) sensors and actuators with a wide range of engineered mechanical and electrical properties. The openings on the shell surface can, for example, control the mechanical quality factor (Q) and resonance frequencies of the shell when the shell is used as a suspended proof mass of a mechanical resonator of a vibratory gyroscope. The shells can also serve as mechanical supporting layers and/or an electrode connection layer for MEMS actuators and sensors that use 3D shells as proof masses.

An oscillator includes a package having a plurality of external terminals disposed on a mounting surface, a circuit element housed in the package, and a resonator which is housed in the package, and is electrically coupled to the circuit element, wherein the circuit element is electrically coupled to the package with a plurality of pads each of which is bonded to the package via a bump member, the circuit element overlaps at least one of the external terminals in a plan view, and each of the bump members is bonded to the package at a position where at least a part of the bump member does not overlap the plurality of external terminals in the plan view.

An oscillator includes a package having a plurality of external terminals disposed on a mounting surface, a circuit element housed in the package, and a resonator which is housed in the package, and is electrically coupled to the circuit element, wherein the circuit element is electrically coupled to the package with a plurality of pads each of which is bonded to the package via a bump member, the circuit element overlaps at least one of the external terminals in a plan view, and each of the bump members is bonded to the package at a position where at least a part of the bump member does not overlap the plurality of external terminals in the plan view.

An electronic component comprises a substrate including a main surface on which a functional unit is formed and a cap layer defining a cavity enclosing and covering the functional unit. The cap layer is provided with holes communicating an inside of the cavity with an outside of the cavity. A resin layer covers the cap layer and the main surface and includes one or more bores and a solder layer having a thickness less than a thickness of the resin layer disposed within the one or more bores.