An acoustic wave sensor device, comprising an interdigitated transducer; a first reflection structure arranged on one side of the interdigitated transducer, and a second reflection structure arranged on another side of the interdigitated transducer; a first resonance cavity comprising a first upper surface and formed between the interdigitated transducer and the first reflection structure; a second resonance cavity comprising a second upper surface and formed between the interdigitated transducer and the second reflection structure; and wherein the second upper surface comprises a physical and/or chemical modification as compared to the first upper surface.

Improved surface acoustic wave structures (or elements) that can be used to realize any of a wide variety of dispersive or non-dispersive transversal SAW filters that are distinct from prior known means for producing such filters are disclosed. The devices and structures may include stepped acoustic wave delay modification elements that can be used to implement transversal filter impulse response functions in a manner analogous to the use of interdigital transducers. The structures disclosed are of particular usefulness to implement SAW devices at high frequencies where normal photolithographic resolution would prove limiting. Aspects and embodiments of the present invention would be useful to produce SAW devices for use in a wide variety of applications, including as components in cell phones, in radar and other communications and electronic systems, and as wired or wireless sensors or sensor-tags.

A micro-transfer printable transverse bulk acoustic wave filter comprises a piezoelectric filter element having a top side, a bottom side, a left side, and a right side disposed over a sacrificial portion on a source substrate. A top electrode is in contact with the top side and a bottom electrode is in contact with the bottom side. A left acoustic mirror is in contact with the left side and a right acoustic mirror is in contact with the right side. The thickness of the transverse bulk acoustic wave filter is substantially less than its length or width and its length can be greater than its width. The transverse bulk acoustic wave filter can be disposed on, and electrically connected to, a semiconductor substrate comprising an electronic circuit to control the transverse bulk acoustic wave filter and form a composite heterogeneous device that can be micro-transfer printed.

An acoustic wave sensor device comprises a quartz material layer comprising a planar surface, a first interdigitated transducer formed over the planar surface of the quartz material layer, a first reflection structure formed over the planar surface of the quartz material layer, a second reflection structure formed over the planar surface of the quartz material layer, a first resonance cavity formed between the first interdigitated transducer and the first reflection structure and a second resonance cavity formed between the first interdigitated transducer and the second reflection structure. The planar surface of the quartz material layer is defined by a crystal cut of a quartz material of the quartz material layer with angles φ in the range of −14° to −24°, θ in the range of −25° to −45° and ψ in the range of +8° to +28°.

An acoustic wave device includes: a piezoelectric substrate; a comb-shaped electrode located on the piezoelectric substrate; a wiring layer located on the piezoelectric substrate and electrically connected with the comb-shaped electrode; a first insulating film located on the piezoelectric substrate, the first insulating film covering the comb-shaped electrode, having an aperture on the wiring layer, and being thicker than the comb-shaped electrode; a second insulating film covering an upper surface of the first insulating film and at least a part of a side surface of the first insulating film in the aperture and having a higher moisture resistance than the first insulating film; and a pad being in contact with the wiring layer exposed by the aperture.

A micro-transfer printable transverse bulk acoustic wave filter comprises a piezoelectric filter element having a top side, a bottom side, a left side, and a right side disposed over a sacrificial portion on a source substrate. A top electrode is in contact with the top side and a bottom electrode is in contact with the bottom side. A left acoustic mirror is in contact with the left side and a right acoustic mirror is in contact with the right side. The thickness of the transverse bulk acoustic wave filter is substantially less than its length or width and its length can be greater than its width. The transverse bulk acoustic wave filter can be disposed on, and electrically connected to, a semiconductor substrate comprising an electronic circuit to control the transverse bulk acoustic wave filter and form a composite heterogeneous device that can be micro-transfer printed.

The present technology provides solidly-mounted, bi-dimensional mode acoustic resonators for use in high frequency electronic applications. The resonator devices are designed to constrain acoustic energy in the piezoelectric layer and electrodes. By concentration of the acoustic waves on the surface and reducing substrate leakage, the quality factor of the system is maintained, even at high frequencies where other resonators fail. The resonance frequency of the devices can be tuned in the 1-27 GHz range. Fabrication of the devices is simplified and cost reduced compared to similar technologies, because the piezoelectric layer is solidly supported and does not have to be released from the substrate.

An acoustic wave device includes: a piezoelectric substrate; a comb-shaped electrode located on the piezoelectric substrate; a wiring layer located on the piezoelectric substrate and electrically connected with the comb-shaped electrode; a first insulating film located on the piezoelectric substrate, the first insulating film covering the comb-shaped electrode, having an aperture on the wiring layer, and being thicker than the comb-shaped electrode; a second insulating film covering an upper surface of the first insulating film and at least a part of a side surface of the first insulating film in the aperture and having a higher moisture resistance than the first insulating film; and a pad being in contact with the wiring layer exposed by the aperture.

Improved surface acoustic wave structures (or elements) that can be used to realize any of a wide variety of dispersive or non-dispersive transversal SAW filters that are distinct from prior known means for producing such filters are disclosed. The devices and structures may include stepped acoustic wave delay modification elements that can be used to implement transversal filter impulse response functions in a manner analogous to the use of interdigital transducers. The structures disclosed are of particular usefulness to implement SAW devices at high frequencies where normal photolithographic resolution would prove limiting. Aspects and embodiments of the present invention would be useful to produce SAW devices for use in a wide variety of applications, including as components in cell phones, in radar and other communications and electronic systems, and as wired or wireless sensors or sensor-tags.

A filter working with surface acoustic waves comprises a piezoelectric substrate (SU), a first transducer (IDT1) arranged in the acoustic track coupled to an input, having a first mean finger period (pi) assigned to a center frequency of a pass band of the filter and a second transducer (IDT2) arranged in the acoustic track coupled to an output, having the same first mean finger period (p1), and a reflector arranged between first and second transducer having a second mean finger period (p2) assigned to a stop band frequency different from the center frequency. Further, a new type of very broad bandwidth filters with small insertion loss and high return loss and high rejection are given that use a substrate that can propagate a PSAW and comprises fan shaped transducers.