Certain aspects of the present disclosure provide a surface acoustic wave (SAW) device with one or more intermediate layers for reduced self-heating and methods for fabricating such a SAW device. One example SAW device generally includes a piezoelectric layer and an interdigital transducer (IDT) disposed above the piezoelectric layer. The IDT generally includes a first electrode having a first busbar and a first plurality of fingers. The first electrode generally includes a first copper layer disposed above the piezoelectric layer, a first intermediate layer disposed above the first copper layer, the first intermediate layer comprising a different material than the first copper layer, and a second copper layer disposed above the first intermediate layer.

When a current flowing in a series circuit including an equivalent resistance, an equivalent inductor, and an equivalent capacitance in an electric equivalent circuit of a specific resonator in each filter is defined as an acoustic path current, under conditions that a phase of an acoustic path current of a first transmission filter at a side of a common terminal at a frequency within a first pass band is represented as θ1.sub.Tx1, a phase of an acoustic path current of the first transmission filter at the side of the common terminal at a frequency within a second pass band is represented as θ2.sub.Tx1, a phase of an acoustic path current of a second transmission filter at the side of the common terminal at a frequency within the first pass band is represented as θ1.sub.Tx2, and a phase of an acoustic path current of the second transmission filter at the side of the common terminal at a frequency within the second pass band is represented as θ2.sub.Tx2, a multiplexer satisfies a first condition: |(2.Math.θ1.sub.Tx1−θ2.sub.Tx1)−(2.Math.θ1.sub.Tx2−θ2.sub.Tx2)|=180°±90°, or a second condition: |(2.Math.θ2.sub.Tx1−θ1.sub.Tx1)−(2.Math.θ2.sub.Tx2−θ1.sub.Tx2)|=180°±90°.

An interdigital transducer for a surface-acoustic-wave resonator includes a conductive grid and a plurality of practical electrodes. The conductive grid includes a bus bar, a plurality of dummy electrodes and a conductive bar. The bus bar has a signal transmission terminal, and is disposed on a first side of the first conductive grid. The plurality of dummy electrodes directly extend from the bus bar. The conductive bar is disposed on a second side of the first conductive grid, and is opposite to the bus bar. Each of the plurality of practical electrodes extends from the conductive bar.

An acoustic wave device includes a piezoelectric substrate and an IDT electrode including electrode fingers, a first layer on the piezoelectric substrate, and a second layer on the first layer and including Cu as a main component. The first layer includes a first principal surface on a side closest to the piezoelectric substrate and a second principal surface in contact with the second layer. The second layer includes a third principal surface in contact with the first layer, a fourth principal surface opposite to the third principal surface, and a side surface connected to the third and fourth principal surfaces. The IDT electrode includes a barrier layer on the side surface of the second layer. A boundary between the side surface of the second layer and the barrier layer is on the second principal surface of the first layer, and the barrier layer does not reach the piezoelectric substrate.

There are disclosed acoustic resonators and radio frequency filter devices. A back surface of a single-crystal piezoelectric plate is attached to a surface of a substrate except for portions of the piezoelectric plate forming a plurality of diaphragms, each of which spans a respective cavity in the substrate. A conductor pattern is formed on the front surface, the conductor pattern including interdigital transducers (IDTs) of one or more pairs of sub-resonators, each pair consisting of two sub-resonators. The IDT of each sub-resonator includes interleaved fingers disposed on a respective diaphragm. The piezoelectric plate and the IDTs are configured such that respective radio frequency signals applied to each IDT excite respective shear primary acoustic modes in the respective diaphragms. The two sub-resonators of each pair of sub-resonators are positioned symmetrically about a central axis.

In an elastic wave device, an IDT electrode is provided on a piezoelectric substrate and a first silicon oxide film covers the IDT electrode. A high-acoustic-velocity dielectric film covers the first silicon oxide film. A second silicon oxide film is provided on the high-acoustic-velocity dielectric film. The piezoelectric substrate is made of lithium niobate. The high-acoustic-velocity dielectric film propagates longitudinal waves at an acoustic velocity higher than an acoustic velocity of longitudinal waves propagating through the first silicon oxide film. The high-acoustic-velocity dielectric film is provided at a distance of about (t1+t2)×0.42 or less from a first main surface of the piezoelectric substrate in a thickness direction of the piezoelectric substrate.

A surface acoustic wave filter includes series and parallel arm resonance sections. The series arm resonance section is in a series arm. The parallel arm resonance section is in a parallel arm. The series arm resonance section includes one or more surface acoustic wave devices. Each surface acoustic wave device includes a first resonator group and a second resonator group. The first and second resonator groups are connected in parallel and include surface acoustic wave resonators. The first resonator group includes at least one surface acoustic wave resonator. The second resonator group includes a greater number of surface acoustic wave resonators than the at least one surface acoustic wave resonator in the first resonator group. The resonant frequency of the surface acoustic wave resonator in the first resonator group is higher than the resonant frequency of the surface acoustic wave resonators in the second resonator group.

The present invention relates to a surface acoustic wave device package and a method of manufacturing the same, and more specifically, to a method of manufacturing a miniaturized surface acoustic wave device package.

A piezoelectric film on a substrate is provided comprising an aluminum nitride (AlN) layer, and a Al.sub.1-x(J).sub.xN compound layer comprising a graded section with a lower (J) composition, x, adjacent to the AlN layer and a higher (J) composition, x, located away from the AlN layer, the said (J) being a singular element or a binary compound. A method for forming such a piezoelectric film is also provided. A surface acoustic wave resonator comprising such a piezoelectric film, a surface acoustic wave filter comprising such a piezoelectric film, a bulk acoustic wave resonator comprising such a piezoelectric film, and a bulk acoustic wave filter comprising such a piezoelectric film are also provided.

A metallization, for carrying current in an electrical component, includes a bottom layer overlying a substrate surface and includes titanium (Ti) or a titanium compound as main constituent. An upper layer overlies the bottom layer and includes copper (Cu) as main constituent. The bottom layer and the upper layer form a base layer. A top layer is in direct contact with the upper layer and includes aluminum (Al) as main constituent. The base layer further includes a middle layer, consisting of silver, that is arranged between the bottom layer and the upper layer.