A dual-shell architecture and methods of fabrication of fused quartz resonators is disclosed. The architecture may include two encapsulated and concentric cavities using plasma-activated wafer bonding followed by the high-temperature glassblowing. The dual-shell architecture can provide a protective shield as well as a “fixed-fixed” anchor for the sensing element of the resonators. Structures can be instrumented to operate as a resonator, a gyroscope, or other vibratory sensor and for precision operation in a harsh environment. Methods for fabricating a dual-shell resonator structure can include pre-etching cavities on a cap wafer, pre-etching cavities on a device wafer, bonding the device wafer to a substrate wafer to form a substrate pair and aligning and bonding the cap wafer to the substrate pair to form a wafer stack with aligned cavities including a cap cavity and a device cavity. The wafer stack may be glassblown to form a dual-shell structure.

A resonator is provided that includes a vibration member including three or more vibration arms that each have a fixed end with at least two vibration arms performing out-of-plane bending at different phases. The resonator also includes a base having a front end connected to the fixed end of each of the vibration arms and a rear end opposing the front end. A frame holds the vibration member and two support arms are provided with first ends connected to the frame. The second ends of the two support arms are connected to a location in the rear end of the base.

A resonator may include a vibrating portion that includes a plurality of vibrating arms to numbering in three or more, each having a fixed end, and including at least two vibrating arms to bend out of plane with different phases and a base portion having a fore end portion to which the fixed end of each of the plurality of vibrating arms to is connected and a rear end portion opposed to the fore end portion; a holding portion configured to hold the vibrating portion; and a support arm having one end connected to the holding portion and the other end connected to the rear end portion of the base portion. The support arm is asymmetric with respect to a center line of the vibrating portion with respect to a longitudinal direction in plan view.

A method of manufacturing a collective substrate that includes: forming at least one first mark in or on a first main surface of a first substrate; joining the first main surface of the first substrate and a first main surface of a second substrate to each other; forming an opening in the second substrate such that the first mark is exposed therein; and forming a device portion in or on a second main surface of the second substrate while using the first mark as a reference.

Multiple degenerately-doped silicon layers are implemented within resonant structures to control multiple orders of temperature coefficients of frequency.

The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.

MEMS based sensors, particularly capacitive sensors, potentially can address critical considerations for users including accuracy, repeatability, long-term stability, ease of calibration, resistance to chemical and physical contaminants, size, packaging, and cost effectiveness. Accordingly, it would be beneficial to exploit MEMS processes that allow for manufacturability and integration of resonator elements into cavities within the MEMS sensor that are at low pressure allowing high quality factor resonators and absolute pressure sensors to be implemented. Embodiments of the invention provide capacitive sensors and MEMS elements that can be implemented directly above silicon CMOS electronics.

A package that includes an acoustic device, a frame coupled to the acoustic device and a cap substrate coupled to the acoustic device through the frame. The acoustic device includes a substrate and an acoustic element coupled to the substrate. The cap substrate includes an inductor. The cap substrate is configured as a cap for the acoustic device. The package includes a cavity located between the acoustic device and the cap substrate. The frame may include a polymer frame.

A vibrator is provided that includes a substrate having a major surface defined in width and length directions and one or more electrodes formed at least in a substantial entire region of the major surface of the substrate in the length direction, and that performs, as main vibration, expansion-contraction vibration along the width direction in accordance with a voltage applied to the electrodes. Moreover, a holder surrounds at least a portion of the vibrator; and a holding arm connects the vibrator to the holder. Moreover, the vibrator has a width Wo in the width direction positioned at an end in the length direction and includes, to have a width Wm differing from the width Wo and positioned between a pair of ends opposing in the length direction, a variant portion at least one or more locations that is in a shape recessed or projecting in the width direction.

An electronic device and associated methods are disclosed. In one example, the electronic device includes a MEMS die located within a substrate, and below a processor die. In selected examples, the MEMS die includes a resonator. Example methods of forming MEMS resonator devices are also shown.