A signal processing apparatus, being configured for transmitting and receiving coherent parallel optical signals, comprises a transmitter apparatus including a first single soliton micro-resonator device and a modulator device, wherein the first single soliton micro-resonator device is adapted for creating a single soliton providing a first frequency comb, wherein the first frequency comb provides a plurality of equidistant optical carriers with a frequency spacing corresponding to a free spectral range of the first single soliton micro-resonator device, and the modulator device is adapted for modulating the optical carriers according to data to be transmitted, and a receiver apparatus including a coherent receiver device with a plurality of coherent receivers and a local oscillator device providing a plurality of reference optical signals, wherein the coherent receiver device and the local oscillator device are arranged for coherently detecting the transmitted modulated optical carriers, wherein the signal processing apparatus further includes at least one second single soliton micro-resonator device having a free spectral range being equal or approximated to the free spectral range of the first single soliton micro-resonator device and being adapted for creating at least one single soliton providing at least one second frequency comb, wherein the at least one second frequency comb provides at least one of additional optical carriers and the reference optical signals. Furthermore, a signal processing method, including transmitting and receiving coherent parallel optical signals via a communication channel is described.

A filter device includes a terminal, a switch that includes a common terminal and selection terminals and switches a connection of the common terminal to one of the selection terminals, a series arm resonator, and filter circuits. The filter circuits are connected to one end of the series arm resonator. The common terminal is connected to the terminal. One of the selection terminals is connected between one end of the series arm resonator and the filter circuits. Another one of the selection terminals is connected to the other end of the series arm resonator.

A ceramic resonator radio frequency filter includes a printed circuit board, one or more first coaxial resonators disposed on the printed circuit board, and one or more second coaxial resonators disposed over the one or more first coaxial resonators so that the one or more first coaxial resonators and one or more second coaxial resonators are arranged in a stacked configuration. The one or more first coaxial resonators and second coaxial resonators electrically connected to the printed circuit board.

A ceramic resonator radio frequency filter includes a printed circuit board, one or more first coaxial resonators disposed on the printed circuit board, and one or more second coaxial resonators disposed over the one or more first coaxial resonators so that the one or more first coaxial resonators and one or more second coaxial resonators are arranged in a stacked configuration. The one or more first coaxial resonators and second coaxial resonators electrically connected to the printed circuit board.

Reconfigurable bulk acoustic wave (BAW) devices include one or more ferroelectric materials as the transduction layer(s). A polarization state of at least one of the ferroelectric material(s) is adjusted by applying a bias voltage across electrodes of the BAW device. The application of the bias voltage can change one or more properties of the ferroelectric material, which in turn may change a response of the BAW device.

Reconfigurable bulk acoustic wave (BAW) devices include one or more ferroelectric materials as the transduction layer(s). A polarization state of at least one of the ferroelectric material(s) is adjusted by applying a bias voltage across electrodes of the BAW device. The application of the bias voltage can change one or more properties of the ferroelectric material, which in turn may change a response of the BAW device.

A ceramic resonator radio frequency filter includes a printed circuit board, one or more first coaxial resonators disposed on the printed circuit board, and one or more second coaxial resonators disposed over the one or more first coaxial resonators so that the one or more first coaxial resonators and one or more second coaxial resonators are arranged in a stacked configuration. The one or more first coaxial resonators and second coaxial resonators electrically connected to the printed circuit board.

A ceramic resonator radio frequency filter includes a printed circuit board, one or more first coaxial resonators disposed on the printed circuit board, and one or more second coaxial resonators disposed over the one or more first coaxial resonators so that the one or more first coaxial resonators and one or more second coaxial resonators are arranged in a stacked configuration. The one or more first coaxial resonators and second coaxial resonators electrically connected to the printed circuit board.

A MEMS resonator array is provided with improved electrical characteristics and reduced motional impedance at high frequency applications. The MEMS resonator array includes a pair of first piezoelectric resonators that are opposed to each other with a space defined therebetween. Moreover, the MEMS resonator array includes a pair of second piezoelectric resonators that are opposed to each other and that are each coupled to respective corners of each of the first piezoelectric resonators. As such, each of the second piezoelectric resonators is partially disposed in the space defined between the pair of first piezoelectric resonators.

Integrated Microelectromechanical System (MEMS) devices and methods for making the same. The integrated MEMS device comprises a substrate (200) with first electronic circuitry (206) formed thereon, as well as a MEMS filter device (100). The MEMS filter device has a transition portion (118) configured to (a) electrically connect the MEMS filter device to second electronic circuitry and (b) suspend the MEMS filter device over the substrate such that a gas gap exists between the substrate and the MEMS filter device. The transition portion comprises a three dimensional hollow ground structure (120) in which an elongate center conductor (122) is suspended. The RF MEMS filter device also comprises at least two adjacent electronic elements (102/110) which are electrically isolated from each other via a ground structure of the transition portion, and placed in close proximity to each other.