A ladder filter in which the pass band is defined by serial arm resonators and first and second parallel arm resonators includes the serial arm resonators, the first and second parallel arm resonators, and a third parallel arm resonator. The third parallel arm resonator is connected in parallel to the first parallel arm resonator, the electrostatic capacitance of the third parallel arm resonator is smaller than that of the first parallel arm resonator, and the anti-resonant frequency of the third parallel arm resonator is positioned outside the pass band of the ladder filter. The anti-resonant frequency of the first parallel arm resonator is positioned at the high frequency side of the anti-resonant frequencies of the second parallel arm resonators.

The SAW filter chip comprises a plurality of SAW filters (1, 2), wherein at least one of the several electric filters is a first-type electric filter (1) comprising at least one first-type SAW-resonator (10). The first-type SAW-resonator comprises a piezoelectric layer (11), an intermediate layer (12) on the piezoelectric layer (11) and an interdigital electrode structure (13) on the intermediate layer (12). The interdigital electrode structure is separated from the piezoelectric layer by the intermediate layer. The intermediate layer is made of a dielectric, non-piezoelectric material and adjusts the electromechanical coupling factor and the bandwidth of the respective filter. The plurality of SAW filters form an LTE multiplexer, wherein the thickness of the intermediate layer is chosen to adjust the required bandwidth to the desired bands. The intermediate layer may be absent for larger required bandwidths.

Embodiments of the present application provide a wafer level surface acoustic wave filter and a package method, the surface acoustic wave filter includes a wafer, an electrode layer, a supporting wall and a cover plate; wherein, the wafer includes a substrate layer and a piezoelectric thin film layer combined together by wafer bonding, the electrode layer is arranged on a surface of the piezoelectric thin film layer, the supporting wall surrounds between the piezoelectric thin film layer and the cover plate to form a sealed cavity; and the cover plate includes at least a first material layer, which uses the same material as the substrate layer.

A surface acoustic wave (SAW) filter includes a bottom substrate, a piezoelectric layer disposed above the bottom substrate, the piezoelectric layer having a bottom surface facing the bottom substrate and a top surface opposite to the bottom surface, a lower cavity disposed below the piezoelectric layer, an interdigital transducer (IDT) disposed on the top surface of the piezoelectric layer, and a back electrode disposed on the bottom surface of the piezoelectric layer, and exposed in the lower cavity.

An acoustic filter device for telecommunication devices includes a first acoustic band pass filter having a corresponding first passband and a second acoustic band pass filter having a corresponding second passband. The second acoustic band pass filter is connected in parallel with the first acoustic band pass filter to provide a combined passband including the first and second passbands.

A multiplexer includes a filter (10) arranged between a common terminal and an input/output terminal (110) and configured to pass a radio frequency signal in a first frequency band, and a filter (20) arranged between the common terminal and an input/output terminal (120) and configured to pass a radio frequency signal in a second frequency band. The filter includes series arm circuits (31 and 32) connected in series, a series arm circuit (33) connected in parallel to the series arm circuit (32), and a parallel arm circuit. The series arm circuit (32) includes a series arm resonator that is an acoustic wave resonator. The series arm circuit (33) includes a switch arranged on a second path connecting nodes. In a CA mode, the switch is OFF. In a non-CA mode, the switch is ON.

A filter apparatus includes a low pass filter and a high pass filter connected in series to each other. The low pass filter includes first acoustic resonators including a resonant frequency and an anti-resonant frequency, first inductors, and first capacitive elements. The high pass filter includes second inductors, second capacitive elements, and second acoustic resonators. A first attenuation band caused by the anti-resonant frequency of the first acoustic resonators is provided at a low frequency side of a pass band and a second attenuation band caused by the resonant frequency of the second acoustic resonators is provided at a high frequency side of the pass band. A third attenuation band caused by a first LC resonant circuit is provided at a low frequency side of the first attenuation band and a fourth attenuation band caused by a second LC resonant circuit is provided at a high frequency side of the second attenuation band.

A surface acoustic wave (SAW) filter includes a bottom substrate, a piezoelectric layer disposed above the bottom substrate, the piezoelectric layer having a bottom surface facing the bottom substrate and a top surface opposite to the bottom surface, a lower cavity disposed below the piezoelectric layer, an interdigital transducer (IDT) disposed on the top surface of the piezoelectric layer, and a back electrode disposed on the bottom surface of the piezoelectric layer, and exposed in the lower cavity.

An acoustic wave device includes a substrate, an interdigital transducer electrode including electrode fingers on a main surface of the substrate, and a protection film covering the main surface of the substrate, and side surfaces and upper surfaces of the electrode fingers. The protection film includes a portion covering the main surface of the substrate, an intermediate portion between two of the electrode fingers adjacent to each other, and a vicinity portion of the electrode fingers. The intermediate portion is thicker than the vicinity portion.

Embodiments of the present application provide a wafer level surface acoustic wave filter and a package method, the surface acoustic wave filter includes a wafer, an electrode layer, a supporting wall and a cover plate; wherein, the wafer includes a substrate layer and a piezoelectric thin film layer combined together by wafer bonding, the electrode layer is arranged on a surface of the piezoelectric thin film layer, the supporting wall surrounds between the piezoelectric thin film layer and the cover plate to form a sealed cavity; and the cover plate includes at least a first material layer, which uses the same material as the substrate layer.