Patent classifications
H03H9/72
DUPLEXER
A duplexer includes a piezoelectric substrate, a receiving filter formed on the piezoelectric substrate, the receiving filter includes a plurality of resonators, and a transmitting filter formed on the piezoelectric substrate, the transmitting filter includes a plurality of resonators. One of the resonators of the receiving filter is a multi-mode type acoustic wave resonator having a capacitance that is two times or more the average capacitance of the other resonators formed on the piezoelectric substrate.
Wideband filter for direct connection to differential power amplifier
A filter device configured to directly connect to a differential power amplifier of a transmit chain circuit. The filter device may include a transformer and a filter configured as a half lattice equivalent topology and having a single-ended output. The filter may be a lattice filter configured as a full lattice topology or a lattice equivalent filter configured as a half lattice equivalent topology. The filter includes a first branch having a first impedance network of one or more first impedance elements and a second branch having a second impedance network of one or more second impedance elements. The single-ended output of the filter device may connect to an antenna switch that is in turn connected to an antenna.
Switch module
A switch module switches among a first state where first and second frequency bands are used in parallel, a second state where only the first frequency band is used, and a third state where none of the first and second frequency bands is used, and includes first, second, and third filters and an antenna switch. In the first state, a common terminal and the first and second filters are connected and the common terminal and the third filter are not connected. In the second state, the common terminal and the first and third filters are connected, and the common terminal and the second filter are not connected.
Method, System, and Apparatus for Resonator Circuits and Modulating Resonators
Embodiments of resonator circuits and modulating resonators and are described generally herein. One or more acoustic wave resonators may be coupled in series or parallel to generate tunable filters. One or more acoustic wave resonances may be modulated by one or more capacitors or tunable capacitors. One or more acoustic wave modules may also be switchable in a filter. Other embodiments may be described and claimed.
ELASTIC WAVE DEVICE, HIGH-FREQUENCY FRONT-END CIRCUIT, AND COMMUNICATION DEVICE
An elastic wave device includes a support substrate made of silicon, a piezoelectric film disposed directly or indirectly on the support substrate, and an interdigital transducer electrode disposed on one surface of the piezoelectric film. A higher-order mode acoustic velocity of propagation through the piezoelectric film is equal or substantially equal to an acoustic velocity V.sub.si=(V.sub.1).sup.1/2 of propagation through silicon or higher than the acoustic velocity V.sub.si, where V.sub.si is specified by V.sub.1 among solutions V.sub.1, V.sub.2, and V.sub.3 with respect to x derived from Ax.sup.3+Bx.sup.2+Cx+D=0.
ELASTIC WAVE DEVICE, HIGH-FREQUENCY FRONT-END CIRCUIT, AND COMMUNICATION DEVICE
An elastic wave device includes a support substrate made of silicon, a piezoelectric film disposed directly or indirectly on the support substrate, and an interdigital transducer electrode disposed on one surface of the piezoelectric film. A higher-order mode acoustic velocity of propagation through the piezoelectric film is equal or substantially equal to an acoustic velocity V.sub.si=(V.sub.1).sup.1/2 of propagation through silicon or higher than the acoustic velocity V.sub.si, where V.sub.si is specified by V.sub.1 among solutions V.sub.1, V.sub.2, and V.sub.3 with respect to x derived from Ax.sup.3+Bx.sup.2+Cx+D=0.
ELASTIC WAVE DEVICE, HIGH FREQUENCY FRONT-END CIRCUIT, AND COMMUNICATION APPARATUS
An elastic wave device includes an LiNbO.sub.3 substrate, a first elastic wave resonator including a first IDT electrode and a first dielectric film, and a second elastic wave resonator including a second IDT electrode and a second dielectric film. A Rayleigh wave travels along at least one surface of the elastic wave device. A thickness of the first dielectric film differs from a thickness of the second dielectric film. A propagation direction of an elastic wave in the first elastic wave resonator coincides with a propagation direction of an elastic wave in the second elastic wave resonator. Euler angles of the LiNbO.sub.3 substrate fall within a range of (0°±5°, θ, 0°±10°).
RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE
A radio-frequency module includes a mounting substrate, a first filter, a second filter, a shield layer, and a conductor. The mounting substrate has a first main surface and a second main surface on opposite sides. The shield layer is disposed on an outer surface of a resin layer with which the first filter and the second filter are covered. The radio-frequency module is capable of performing simultaneous transmission by using both the first filter and the second filter. The conductor is disposed on the first main surface of the mounting substrate and is in contact with the transmitting filter and the mounting substrate. The conductor is in contact with the shield layer on a side other than a side closer to the second filter than to the first filter.
RADIO-FREQUENCY MODULE
A radio-frequency module includes a module substrate, an inductor, and an acoustic wave filter. The inductor overlaps at least a portion of the acoustic wave filter when seen in a plan view from the normal direction of the module substrate. The inductor includes first and second coils connected in series. Each of the first and second coils is a spiral or helical coil that is wound with more than one turn. At least a portion of the first coil overlaps the second coil when seen in a plan view from the normal direction of the module substrate. A direction of a magnetic field generated by the first coil is opposite to a direction of a magnetic field generated by the second coil.
Electronic component
An electronic component includes: a first substrate having a first surface; a second substrate having a second surface facing the first surface across an air gap; a first coil pattern that is located on the first surface so as to face the second surface across the air gap; a second coil pattern that is located in a second region on the second surface and faces the first surface across the air gap, at least a part of the second region overlapping with a first region in plan view, the first region being formed of a region in which the first coil pattern is located and a region surrounded by the first coil pattern; and a connection terminal connecting the first coil pattern and the second coil pattern.