A configuration circuit of a flash FPGA for realizing external monitoring and configuration is provided. In the configuration circuit, a positive high-voltage output terminal of a positive high-voltage charge pump is connected to a positive high-voltage external monitoring port through a positive high-voltage bidirectional switch circuit, and the positive high-voltage output terminal of a positive high-voltage charge pump is further configured as a positive output end of a voltage supply circuit. A negative high-voltage output terminal of a negative high-voltage charge pump is connected to a negative high-voltage external monitoring port through a negative high-voltage bidirectional switch circuit, and the negative high-voltage output terminal of a negative high-voltage charge pump is further configured as a negative output end of the voltage supply circuit. Based on a received mode adjustment signal, a mode control circuit controls to enter an external monitoring mode or an external configuration mode.

A method of generating multiple gating signals for a multi-gated input/output (I/O) system. The system includes an output level shifter and an output driver which are coupled in series between an output node of a core circuit and an external terminal of a corresponding system. The method includes: generating first and second gating signals having corresponding first and second waveforms, the first waveform transitioning from a non-enabling state to an enabling state before the second waveform transitions from the non-enabling state to the enabling state; receiving the first gating signal at the output level shifter; and receiving the second gating signal at the output driver.

A repeater for open-drain bus communication and a system including the same is provided. The repeater includes at least one repeating unit having an A-side terminal connected to an A-side open-drain bus, and a B-side terminal electrically connected to a B-side open-drain bus. The repeater has a first mode to receive a signal at the A-side and to produce a signal at the B-side. The repeating unit includes a B-side accelerator element connected to the B-side terminal. The repeating unit when in a first mode includes a first control unit to, control the B-side accelerator element to pull up a voltage at the B-side when the voltage at the A-side surpasses a first threshold voltage during a rising edge of the voltage, and to subsequently control the B-side accelerator element to stop pulling up the voltage at the B-side when the voltage at the B-side surpasses a second threshold voltage.

A repeater for open-drain bus communication and a system including the same is provided. The bus repeater includes an A-to-B buffer to receive the signal at the A-side terminal and to produce a first buffered signal, a B-side pull-down control unit to produce a first control signal based on the received first buffered signal, and a B-side pull-down element to pull down the voltage at the B-side terminal based on the first control signal. The B-side pull-down element includes a B-side pull-down transistor that is arranged in between the B-side terminal and a B-side ground reference terminal. The first control signal controls a voltage at the control terminal of the B-side pull-down transistor. The B-side pull-down control unit includes a B-side comparing unit to compare the voltage at the B-side terminal to a first reference voltage, and to generate the first control signal based on a result of the comparison.

An electronic chip includes a chip core including an input terminal, an output terminal, an external pad, and an input-output circuit coupled to the chip core and the external pad. The input-output circuit includes an enable terminal coupled to the chip core, a connection terminal coupled to the external pad, a switchable diode device coupled between a supply voltage and a reference voltage, and a levelling circuit. The switchable diode device is coupled to the connection terminal and the enable terminal and is configured to operate as a diode in response to a control signal in a first state applied to the enable terminal and to operate as an open circuit in response to the control signal in a second state applied to the enable terminal. The levelling circuit is coupled to the connection terminal, the input terminal of the chip core, and the output terminal of the chip core.

An impedance calibration circuit includes a first code generation circuit connected to a first reference resistor, and configured to generate a first code for forming a resistance based on the first reference resistor, by using the first reference resistor; a second code generation circuit configured to form a resistance of a second reference resistor less than the resistance of the first reference resistor, based on the first code, and generate a second code by using the second reference resistor; and a target impedance code generation circuit configured to generate a target impedance code based on the first code, the second code, and a target impedance value, and form an impedance having the target impedance value in a termination driver connected to the impedance calibration circuit, based on the target impedance code.

A communication device is disclosed. The disclosed communication device comprises: a transmission circuit for generating a transmission signal by using a first field effect transistor (FET) and a signal inputted from a first control circuit, and transmitting the transmission signal to a second control circuit; and a reception circuit for generating a reception signal by using a second field effect transistor (FET) and a signal received from the second control circuit, and outputting the reception signal to the first control circuit.

A chip with pad tracking having an input/output buffer (I/O buffer), a pad, and a bias circuit. The I/O buffer is powered by a first power and is coupled to the pad. The pad is coupled to the system power. The bias circuit generates a bias signal to be transferred to the I/O buffer to block a leakage path within the I/O buffer when the system power is on and the first power is off. The bias circuit is a voltage divider which generates a divided voltage as the bias signal. In an example, the bias circuit is powered by a second power that is independent from the first power and is not drawn from the pad. In another example, a power terminal of the bias circuit is coupled to an electrostatic discharging bus, and the pad is coupled to the electrostatic discharging bus through a diode.

A chip package used as a logic drive, includes: multiple semiconductor chips, a polymer layer horizontally between the semiconductor chips; multiple metal layers over the semiconductor chips and polymer layer, wherein the metal layers are connected to the semiconductor chips and extend across edges of the semiconductor chips, wherein one of the metal layers has a thickness between 0.5 and 5 micrometers and a trace width between 0.5 and 5 micrometers; multiple dielectric layers each between neighboring two of the metal layers and over the semiconductor chips and polymer layer, wherein the dielectric layers extend across the edges of the semiconductor chips, wherein one of the dielectric layers has a thickness between 0.5 and 5 micrometers; and multiple metal bumps on a top one of the metal layers, wherein one of the semiconductor chips is a FPGA IC chip, and another one of the semiconductor chips is a NVMIC chip.

A semiconductor apparatus includes an internal circuit connected to a first power line to which a first power voltage is applied; a transistor including a first terminal, which is connected to a node to which an input voltage is applied, a second terminal connected to the internal circuit, and a control terminal to which a control voltage is applied; and a voltage control circuit, which is connected to the node, generating the control voltage. Further, the voltage control circuit includes a step-down circuit generating an internal voltage by lowering the input voltage applied to the node, and a switching circuit, which is connected to the first power line, generating the control voltage based on the first power voltage and the internal voltage.