Apparatuses and methods for temperature and process corner sensitive control of power gated domains are described. An example apparatus includes an internal circuit; a power supply line; and a power gating control circuit which responds, at least in part, to a first change from a first state to a second state of a control signal to initiate supplying a power supply voltage from the power supply line to the internal circuit, and continue supplying the power supply voltage from the power supply line to internal circuit for at least a timeout period from a second change from the second state to the first state of the control signal, in which the timeout period represent temperature dependency.

According to some aspects, a low-leakage switch is provided. In some embodiments, the low-leakage switch includes a plurality of pass transistors in series that selectively couple two ports of the low-leakage switch and a node biasing circuit coupled to a node between the plurality of pass transistors. In these embodiments, the node biasing circuit may adjust a voltage at the node to change the gate-to-source voltage of the pass transistors and, thereby, reduce the leakage current through the pass transistors when the low-leakage switch is turned off. The node biasing circuit may also include circuitry to reduce the leakage current introduced by the node biasing circuit into the node when the low-leakage switch is turned on.

A regenerative gate charging circuit includes an inductor coupled to a gate of a FET. An output control circuit is coupled to a timing control circuit and a bridged inductor driver, which is coupled to the inductor. A sense circuit is coupled to the gate and to the timing control circuit, which receives a control signal, generates output control signals in accordance with a first timing profile, and transmits the output control signals to the output control circuit. In accordance with the first timing profile, the output control circuit holds switches or controllable current sources of the bridged inductor driver in an ON state for a first period and holds the switches or controllable current sources in an OFF state for a second period. Gate voltages are sampled during the second period and after the first period. The timing control circuit generates a second timing profile using the sampled voltages.

A switching controller generates control pulses for specifying on/off states of a first transistor and a second transistor. One end of a capacitor is coupled to a switching node. A constant voltage is applied to the other end of the capacitor via a rectifier element. A dead time controller controls a delay time between adjacent edges of the first control pulse and the second control pulse according to a sensing voltage across both ends of the capacitor.

A circuit arrangement is disclosed for controlling the switching of a field effect transistor (FET). A current controlled amplifier may be configured to amplify a current in a current sense device to generate an amplified current, wherein the current in the current sense device indicates a current through the FET. A comparator may be coupled to the current sense amplifier to compare a voltage corresponding to the amplified current with a voltage reference and to generate a comparator output based on the comparison, wherein the comparator output controls whether the FET is on or off.

This disclosure describes systems, methods, and apparatuses for a PIN diode switch comprising series connected PIN diodes, the series connected PIN diodes comprising two or more PIN diodes connected in series, wherein each of the two or more PIN diodes comprises a first node and a second node; and an internal node positioned where a first node of a first PIN diode connects to a second node of a second, adjacent PIN diode; a RF bypass capacitor connected between a reference node and a first end of the series connected PIN diodes, and wherein a second end of the series connected PIN diodes is connected to the reference node; an RF circuit connected between the reference node and the internal node; and a PIN diode driver connected across the RF bypass capacitor.

An apparatus includes a first leg having a plurality of transistors connected in series between a first node and a second node. Each of the plurality of transistors includes a respective body diode. The apparatus further includes a second leg connected between the first node and the second node and in parallel to the series connection of the plurality of transistors of the first leg. The second leg includes a first transistor. The second leg has lower reverse recovery losses relative to the first leg.

A method comprises configuring a power converter to operate as a boost converter, the power converter comprising a low side switch and a high side switch, during a first dead time after turning off the low side switch and before turning on the high side switch, configuring the power converter such that a current of the power converter flows through a high speed diode, and after turning on the high side switch, configuring the power converter such that the current of the power converter flows through a low forward voltage drop diode.

Wells formed in a semiconductor device can be discharged faster in a transition from a stand-by state to an active state. The semiconductor device includes an n-type well applied, in an active state, with a power supply voltage and, in a stand-by state, with a voltage higher than the power supply voltage, a p-type well applied, in the active state, with a ground voltage and, in the stand-by state, with a voltage lower than the ground voltage, and a path which, in a transition from the stand-by state to the active state, electrically couples the n-type well and the p-type well.

A driver circuit includes three sub-circuits. A first sub-circuit is configured to generate a drive current output by the driver circuit through an output node during first and second regions of operation and includes: a diode coupled to the output node and a first transistor, and a second transistor coupled to the first transistor and a current mirror. A second sub-circuit is configured to generate the drive current during the first and second and a third region of operation and includes: a third transistor coupled to the output node; and a fourth transistor. A third sub-circuit is configured to generate the drive current during the third region of operation and includes: a current source coupled to the current mirror and a buffer; and a fifth transistor coupled to the third transistor and the fourth transistor and configured to receive an output of the buffer.