A container for communication devices and communication systems used in cellular networks. There is a need for resilient systems that can withstand extreme weather events. Cellular network infrastructure located close to coastal regions is particularly prone to disruptive failures. A container for an electronic communications device is also provided including: a housing that surrounds at least one mounting plate on which electrical devices and electronic devices are supported. The housing is received around atop edge by a recess in a top plate and around a bottom edge by a recess in a bottom plate. The top and bottom plates are clamped to seal the housing. In some embodiments the housing is connected to a sea borne infrastructure such as buoy. Node frames enable a communications infrastructure that has no single point of failure.

A container for communication devices and communication systems used in cellular networks. There is a need for resilient systems that can withstand extreme weather events. Cellular network infrastructure located close to coastal regions is particularly prone to disruptive failures. A container for an electronic communications device is also provided including: a housing that surrounds at least one mounting plate on which electrical devices and electronic devices are supported. The housing is received around atop edge by a recess in a top plate and around a bottom edge by a recess in a bottom plate. The top and bottom plates are clamped to seal the housing. In some embodiments the housing is connected to a sea borne infrastructure such as buoy. Node frames enable a communications infrastructure that has no single point of failure.

An information handling system executing an integrated antenna power and cooling management system may comprise an antenna situated nearby components of the information handling system, a chassis enclosing the information handling system, the antenna, and a wireless interface device with a wireless radio to generate a signal to transmit data via the antenna, where the components and the chassis are capable of absorbing a total thermal heat capacity, the chassis having an outer surface coming into contact with human skin during execution of the information handling system, a temperature sensor to determine an operating temperature of the information handling system reaching a control point value, and a processor executing code instructions to estimate antenna thermal output during data transmission relative to the total thermal heat capacity of the components, based on the operating temperature of the information handling system, and control an active cooling system for cooling the chassis.

An information handling system executing an integrated antenna power and cooling management system may comprise an antenna situated nearby components of the information handling system, a chassis enclosing the information handling system, the antenna, and a wireless interface device with a wireless radio to generate a signal to transmit data via the antenna, where the components and the chassis are capable of absorbing a total thermal heat capacity, the chassis having an outer surface coming into contact with human skin during execution of the information handling system, a temperature sensor to determine an operating temperature of the information handling system reaching a control point value, and a processor executing code instructions to estimate antenna thermal output during data transmission relative to the total thermal heat capacity of the components, based on the operating temperature of the information handling system, and control an active cooling system for cooling the chassis.

A radio frequency module includes a module substrate; a power amplifier disposed on or over the module substrate, amplifies a radio frequency signal, and outputs the amplified radio frequency signal as the first transmission signal; a power amplifier disposed on or over the module substrate, amplifies a radio frequency signal, and outputs the amplified radio frequency signal as the second transmission signal; a temperature sensor disposed on or over the module substrate; and a PA control circuit disposed on or over the module substrate and controls amplification operations of the power amplifiers according to a measurement value of the temperature sensor. The maximum output power of the power amplifier is greater than the maximum output power of the power amplifier, and the distance between the temperature sensor and the power amplifier is less than or equal to the distance between the temperature sensor and the power amplifier.

Systems and methods for RF hazard protection are provided. In one embodiment, a RF protection coupler comprises: a first port to couple to an output of an RF source circuit; a second port to couple to an external RF load; a source side and load side RF switches, wherein the source side RF switch and the load side RF switch are each switch between a first and second states in response to a detected matting. In the first state the source and load side RF switches establish an electrical path between the first and second ports. In the second state: the source side RF switch couples the first port to an impedance load that is impedance matched to the output of the RF source circuit; the load side RF switch couples the second port to an electrical ground; and a gap between the switches electrically isolates the ports.

A protective case includes a protective shell and a heat dissipation film. The protective shell has an inner wall. The heat dissipation film is attached on the inner wall. The heat dissipation film includes a plastic base layer, a heat diffusion layer and a heat absorption layer stacked sequentially in a direction away from the inner wall. Therefore, the heat dissipation film is attached on the inner wall of the protective shell to make the protective case for a mobile device possess desirable efficiency of heat dissipation.

An electronic device may include at least one communication processor, at least one radio frequency integrated circuit (RFIC) configured to provide a radio frequency (RF) signal based on a signal from the at least one communication processor, and a first RF circuit and a second RF circuit configured to process and provide the RF signal. The at least one communication processor may be configured to control at least part of the electronic device to allow the first RF circuit to process at least one first RF signal provided from the RFIC, in an over-temperature state, identify that a sum of times when the first RF circuit processes the at least one first RF signal is at least the value of a designated period, and based on the sum of the times when the first RF circuit processes the at least one first RF signal being at least the value of the designated period, stop use of the first RF circuit and control at least part of the electronic device to allow the second RF circuit to process at least one second RF signal provided from the RFIC. Other various embodiments are possible as well.

A module for multiple network pluggable optics is disclosed. The module includes a Printed Circuit Board (PCB); a faceplate connected to the PCB; a plurality of cage assemblies connected to the PCB, each cage assembly is configured to receive a pluggable optical module via a corresponding opening in the faceplate; and a shared heat exchanger that is integrally formed and substantially covers the plurality of cage assemblies, wherein the shared heat exchanger is configured to cool multiple pluggable optics in the plurality of cage assemblies.

The embodiments include a stackable computing device that includes an integrated heatsink and antenna structure and a housing structure. The housing structure includes a housing casing that surrounds the integrated heatsink and antenna structure. The integrated heatsink and antenna structure includes a heatsink base and one or more radio frequency (RF) antenna portions. The heatsink base includes a connector port that provides an interface between components of the computing device and other computing or peripheral devices. For example, the heatsink base may include platform that is configured to have circuitry fixedly secured on a first side of the platform with a connector of the circuitry aligned with an aperture of the connector port such that a connection to the circuitry is accepted by circuitry of another computing device.