A method for detecting and attenuating the impact of interference in a signal of a radio receiver with multiple tuners. The method includes providing a first input signal RF.sub.1 to a first tuner T.sub.1; simultaneously providing a second input signal RF.sub.2 to a second tuner T.sub.2; simultaneously producing a first intermediate high injection signal IFH.sub.1, by the first tuner T.sub.1, using the first input signal RF.sub.1 filtered on a first frequency f.sub.E, and a first intermediate low injection signal IFB.sub.2, by the second tuner T.sub.2, using the second input signal RF.sub.2 filtered on the first frequency f.sub.E; comparing the first intermediate high injection signal IFH.sub.1 and the first intermediate low injection signal IFB.sub.2; selecting one out of the first intermediate high injection signal IFH.sub.1 and the first intermediate low injection signal IFB.sub.2 to be decoded by the radio receiver.

A vehicle and a controlling method of the same include a speaker outputting virtual engine sound integrated with a head lamp. The vehicle includes the head lamp; a head lamp case in which the head lamp is provided; and a speaker for outputting a virtual engine sound, and provided inside the head lamp case, where an internal cross-sectional area of the head lamp case may increase in a direction toward a front of the vehicle based on a position where the speaker is provided.

The present disclosure relates to a pre-5.sup.th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4.sup.th-Generation (4G) communication system such as Long Term Evolution (LTE). The present disclosure relates to connection structure for radio frequency components and electronic device including same According to various embodiments, a connection assembly for radio frequency (RF) components may include: a first RF component including an opening section and a protrusion formed in the opening section; an elastic structure; a printed circuit board (PCB); and a second RF component connected to the PCB. The elastic structure may be disposed on a first surface of the PCB, a first surface of the first RF component including the opening section may be coupled to the first surface of the PCB, and the protrusion of the first RF component may come in contact with the elastic structure, thereby forming an electrical connection between the first RF component.

In a radio-frequency module, a conductive layer covers a major surface opposite to the mounting board side of a resin layer and a major surface opposite to the mounting board side of an electronic component. The electronic component includes an electronic component body and a plurality of outer electrodes. The electronic component body includes an electrical insulating portion and a conductive portion provided inside the electrical insulating portion, forming at least a portion of a circuit element of the electronic component. The electronic component body has a third major surface and a fourth major surface opposite to each other, and an outer side surface. The third major surface forms the major surface of the electronic component, and the third major surface is in contact with the conductive layer. The plurality of outer electrodes are provided on the fourth major surface, but are not extended over the third major surface.

In a radio-frequency module, a conductive layer covers a major surface opposite to the mounting board side of a resin layer and a major surface opposite to the mounting board side of an electronic component. The electronic component includes an electronic component body and a plurality of outer electrodes. The electronic component body includes an electrical insulating portion and a conductive portion provided inside the electrical insulating portion, forming at least a portion of a circuit element of the electronic component. The electronic component body has a third major surface and a fourth major surface opposite to each other, and an outer side surface. The third major surface forms the major surface of the electronic component, and the third major surface is in contact with the conductive layer. The plurality of outer electrodes are provided on the fourth major surface, but are not extended over the third major surface.

A radio frequency module includes a module substrate including major surfaces that face each other; a first base part that is at least partially comprised of a first semiconductor material and in which an electronic circuit is formed; a second base part that is at least partially comprised of a second semiconductor material having a thermal conductivity lower than the thermal conductivity of the first semiconductor material and in which an amplifier circuit is formed; and an external connection terminal disposed on or over the major surface. The first base part and the second base part are disposed on or over the major surface out of the major surfaces; and the second base part is disposed between the module substrate and the first base part, is joined to the first base part, and is connected to the major surface via an electrode.

A radio frequency module includes a module substrate including major surfaces that face each other; a first base part that is at least partially comprised of a first semiconductor material and in which an electronic circuit is formed; a second base part that is at least partially comprised of a second semiconductor material having a thermal conductivity lower than the thermal conductivity of the first semiconductor material and in which an amplifier circuit is formed; and an external connection terminal disposed on or over the major surface. The first base part and the second base part are disposed on or over the major surface out of the major surfaces; and the second base part is disposed between the module substrate and the first base part, is joined to the first base part, and is connected to the major surface via an electrode.

A semiconductor chip includes a first wireless communication circuit, a local oscillator (LO) buffer, and an auxiliary path. The first wireless communication circuit has a signal path, wherein the signal path has a mixer input port and a signal node distinct from the mixer input port. The auxiliary path is used to electrically connect the LO buffer to the signal node of the signal path. The LO buffer is reused for a transmit (TX) function through the auxiliary path.

To reduce the effect on the communication performance of an antenna to secure a good communication state with respect to the antenna. An acoustic output device includes a speaker for outputting sound, a cell having one surface facing in a facing direction represented by a predetermined direction, a control board for controlling predetermined parts, and an antenna for sending and receiving signals, the antenna having at least a portion spaced from the control board and the cell. The cell and the control board are positioned side by side with each other in directions different from thicknesswise directions of the control board. The facing direction is different from the directions in which the cell and the control board are side by side with each other. The antenna is positioned side by side with at least one of the control board or the cell in the thicknesswise directions or the facing direction.

To reduce the effect on the communication performance of an antenna to secure a good communication state with respect to the antenna. An acoustic output device includes a speaker for outputting sound, a cell having one surface facing in a facing direction represented by a predetermined direction, a control board for controlling predetermined parts, and an antenna for sending and receiving signals, the antenna having at least a portion spaced from the control board and the cell. The cell and the control board are positioned side by side with each other in directions different from thicknesswise directions of the control board. The facing direction is different from the directions in which the cell and the control board are side by side with each other. The antenna is positioned side by side with at least one of the control board or the cell in the thicknesswise directions or the facing direction.