Patent classifications
H04B10/801
OPTICAL COMMUNICATION EQUIPMENT AND COMPONENT MOUNTING MACHINE
An optical communication equipment performs optical communication between a first apparatus and a second apparatus. The optical communication equipment includes a monitoring section configured to monitor a light amount during optical communication, and a control device configured to output predetermined information when the light amount is less than a first threshold value and shut off communication between the first and second apparatuses when the light amount is less than a second threshold value lower than the first threshold value.
Apparatus and method for coupling the spatial light to the optical fiber light for achieving the stability of an optical axis without a position detector
An apparatus and method herein efficiently couple spatial light to optical fiber light for achieving stability of an optical axis without a position sensor. The basic concept of the method includes: first, obtaining, according to a theoretical coupling efficiency model, a model parameter by means of fitting calculation; second, using a four-point tracking algorithm to calculate an optical fiber nutation trajectory according to the optical fiber nutation principle; and finally, using the nutation trajectory to calculate the position deviation of a central point. The optical axis is ensured to be stable by correcting the position deviation, and the high coupling efficiency remains. The method is used for the stability of the optical axis in a space coherent laser communication DPSK link. The high efficiency coupling is a key technology of long-distance, high bit rate transmission in space laser communication, and is significant in the development of inter-satellite optical communications.
METHOD AND APPARATUS TO FACILITATE DIRECT SURFACE COOLING OF A CHIP WITHIN A 3D STACK OF CHIPS USING OPTICAL INTERCONNECT
In one embodiment, the disclosure relates to a system of stacked and connected layers of circuits that includes at least one pair of adjacent layers having very few physical (electrical) connections. The system includes multiple logical connections. The logical interconnections may be made with light transmission. A majority of physical connections may provide power. The physical interconnections may be sparse, periodic and regular. The exemplary system may include physical space (or gap) between the a pair of adjacent layers having few physical connections. The space may be generally set by the sizes of the connections. A constant flow of coolant (gaseous or liquid) may be maintained between the adjacent pair of layers in the space.
High density optical I/O inside a data center switch using multi-core fibers
A network device includes an enclosure, a multi-chip module (MCM), an optical-to-optical connector, and a multi-core fiber (MCF) interconnect. The enclosure has a panel. The MCM is inside the enclosure. The optical-to-optical connector, which is mounted on the panel of the enclosure, is configured to transfer a plurality of optical communication signals. The MCF interconnect has a first end coupled to the MCM and a second end connected to the optical-to-optical connector on the panel, for routing the plurality of optical communication signals between the MCM and the panel.
Cable termination assembly with disengagement prevention structures
An optical fiber termination system includes a housing, a cable, and a catch. The housing defines a portion of a passageway and a surface surrounding the passageway. The passageway defines a central axis and the surface defines an interior of the housing. The cable is receivable through the portion of the passageway. The cable includes an optical fiber and defines a longitudinal axis. The catch is receivable in the housing and attachable to and extendable from the cable in a direction transverse to the longitudinal axis such that the catch limits movement of the cable in a direction away from the interior of the housing when the catch is received in the housing and the cable is received through the portion of the first passageway.
Pooled memory system enabled by monolithic in-package optical I/O
A computer memory system includes an electro-optical chip, an electrical fanout chip electrically connected to an electrical interface of the electro-optical chip, and at least one dual in-line memory module (DIMM) slot electrically connected to the electrical fanout chip. A photonic interface of the electro-optical chip is optically connected to an optical link. The electro-optical chip includes at least one optical macro that converts outgoing electrical data signals into outgoing optical data signals for transmission through the optical link. The optical macro also converts incoming optical data signals from the optical link into incoming electrical data signals and transmits the incoming electrical data signals to the electrical fanout chip. The electrical fanout chip directs bi-directional electrical data communication between the electro-optical chip and a dynamic random access memory (DRAM) DIMM corresponding to the at least one DIMM slot.
OPTICAL BRIDGE INTERCONNECT UNIT FOR ADJACENT PROCESSORS
A system and method for efficient data transfer in a computing system are described. A computing system includes multiple nodes that receive tasks to process. A bridge interconnect transfers data between two processing nodes without the aid of a system bus on the motherboard. One of the multiple bridge interconnects of the computing system is an optical bridge interconnect that transmits optical information across the optical bridge interconnect between two nodes. The receiving node uses photonic integrated circuits to translate the optical information into electrical information for processing by electrical integrated circuits. One or more nodes switch between using an optical bridge interconnect and a non-optical bridge interconnect based on one or more factors such as measured power consumption and measured data transmission error rates.
Systems and methods for utilizing photonic degrees of freedom in a photonic processor
Systems and methods for increasing throughput of a photonic processor by using photonic degrees of freedom (DOF) are provided. The photonic processor includes a multiplexer configured to multiplex, using at least one photonic DOF, multiple encoded optical signals into a multiplexed optical signal. The photonic processor also includes a detector coupled to an output of an optical path including the multiplexer, the detector being configured to generate a first current based on the multiplexed optical signal or a demultiplexed portion of the multiplexed optical signal. The photonic processor further includes a modulator coupled to and output of the detector, the modulator being configured to generate a second current by modulating the first current.
Optical Shuffle Computation Network Using Multicore Fiber Arrays
Optical communication system communicates between an array of originating tiles and an array of terminating tiles. Each array is associated with a lenslet array, such as a two-layer array. Each originating tile has an array and each terminating tile has an array of transceivers. Each tile is associated with a common lenslet or lenslet pair. A beamlet from a representative originating transceiver passes through the lenslet pair adjacent to its tile via an originating Fourier transform element, collimating optics, and a terminating Fourier transform element. The beam then passes through the lenslet pair adjacent to the tile containing the terminating transceiver associated with the representative originating transceiver, and is focused onto that receiver by that lenslet pair. Originating and/or terminating arrays of multicore fibers may be used between the originating transceivers and the originating Fourier transform element and/or between the terminating Fourier transform element and the terminating transceivers.
BIT-WISE INVERSE MULTIPLEXING FOR OPTICAL CHANNELS UTILIZING MICROLEDS
An optical communication system may include microLEDs for use in communicating data between chips or multi-chip modules. The number of microLEDs may be greater than a number of electrical data lines for carrying data to be communicated. Signals on the electrical data lines may be inverse multiplexed, for example to allow for operation of the microLEDs at a rate slower than operation of electrical circuitry generating signals on the electrical data lines.