A first sound element is connected to a left sound-emitting hole and an upper sound-emitting hole. A second sound element is connected to a right sound-emitting hole and the upper sound-emitting hole. A third sound element is connected to a lower sound-emitting hole. When the terminal is in a portrait mode, a processor controls the first sound element and the second sound element to play sound channels on different sides and emit a sound from the left sound-emitting hole and the right sound-emitting hole. When the terminal is in a landscape mode, the processor controls the first sound element and/or the second sound element to play a sound channel on one side and emit a sound from at least one of the left sound-emitting hole, the right sound-emitting hole, and the upper sound-emitting hole, and the processor controls the third sound element to play a sound channel on another side.

An electronic device is provided. The electronic device includes a first frame including a first surface, a second surface facing the direction opposite to that of the first surface, and a side surface encompassing the space between the first surface and the second surface, a guide path which is formed in the space of the first frame and which includes, from the side surface toward the space, an external environment connection hole formed at a specified depth, a first through-hole formed from the second surface up to the external environment connection hole, and a second through-hole formed at a location apart from the first through-hole so as to be formed from the first surface up to the second surface, and a sealing member including a sound module disposed on the first surface so as to correspond to the second through-hole, and a recess which is disposed on the second surface and connects the first through-hole to the second through-hole.

Aspects of the subject technology relate to electronic devices having sensors such as pressure sensors. A pressure sensor may be integrated into an audio component of an electronic device such that the pressure sensor is fluidly coupled to an environment external to a device housing via at least a portion of an internal cavity of the audio component housing. The audio component housing may include an opening. The pressure sensor may be mounted adjacent to or within the opening. The opening may be sealed to prevent passage of gas or liquid through the opening. The pressure sensor may be integrally formed with an inner wall of the audio component housing. The audio component may be a speaker or a microphone.

Aspects of the subject technology relate to electronic devices having sensors such as pressure sensors. A pressure sensor may be integrated into an audio component of an electronic device such that the pressure sensor is fluidly coupled to an environment external to a device housing via at least a portion of an internal cavity of the audio component housing. The audio component housing may include an opening. The pressure sensor may be mounted adjacent to or within the opening. The opening may be sealed to prevent passage of gas or liquid through the opening. The pressure sensor may be integrally formed with an inner wall of the audio component housing. The audio component may be a speaker or a microphone.

The embodiments of the present application disclose an electronic device, and the electronic device includes: a device body and a camera apparatus, where a sound-emitting device is installed in the device body, a first sound cavity is provided on the device body, the first sound cavity has an opening that communicates with the outside, the camera apparatus is detachably installed in the first sound cavity, in a case that the camera apparatus is installed in the first sound cavity, the sound cavity of the sound-emitting device has a first volume value, in a case that the camera apparatus is separated from the device body, the sound cavity of the sound-emitting device extends toward the first sound cavity and has a second volume value, and the first volume value is smaller than the second volume value.

The present disclosure discloses a telecommunications enclosure (1) and a method for coupling a cable (6) to a cable port (15) of the telecommunications enclosure (1). The latter comprises a casing (2) and a base (10) removably coupled to the casing (2). The base (10) comprises an outer structure (11) having an inner opening (12), and an inner assembly (130) comprising an inner structure (13), adapted to be removably inserted within the inner opening (12), and a plurality of sealing modules (14), each comprising a first part (14a) and a second part (14b). The outer structure (11) comprises a plurality of receiving portions (16) each having a recess (161) adapted to receive at least said first part (14a) of a respective sealing module (14) of the plurality of sealing modules (14). The base (10) is commutable between an assembled condition and a disassembled condition. In the assembled condition, the sealing modules (14), the inner structure (13) and the outer structure (11) are coupled to each other, the inner assembly (130) is inserted within the inner opening (12) of the outer structure (11) and, for each sealing module (14), at least said first part (14a) is received in the respective recess (161), the second part is coupled to the inner structure (13) and said first part (14a) and second part (14b) define a corresponding cable port (15). In the disassembled condition, at least part of the inner assembly (130) is removed from the inner opening (12) of the outer structure (13) to enable insertion of a cable (6) into the respective cable port (15). In both the assembled condition and disassembled condition, the plurality of receiving portions (16) of the outer structure (11) are connected to each other.

The present disclosure discloses a telecommunications enclosure (1) and a method for coupling a cable (6) to a cable port (15) of the telecommunications enclosure (1). The latter comprises a casing (2) and a base (10) removably coupled to the casing (2). The base (10) comprises an outer structure (11) having an inner opening (12), and an inner assembly (130) comprising an inner structure (13), adapted to be removably inserted within the inner opening (12), and a plurality of sealing modules (14), each comprising a first part (14a) and a second part (14b). The outer structure (11) comprises a plurality of receiving portions (16) each having a recess (161) adapted to receive at least said first part (14a) of a respective sealing module (14) of the plurality of sealing modules (14). The base (10) is commutable between an assembled condition and a disassembled condition. In the assembled condition, the sealing modules (14), the inner structure (13) and the outer structure (11) are coupled to each other, the inner assembly (130) is inserted within the inner opening (12) of the outer structure (11) and, for each sealing module (14), at least said first part (14a) is received in the respective recess (161), the second part is coupled to the inner structure (13) and said first part (14a) and second part (14b) define a corresponding cable port (15). In the disassembled condition, at least part of the inner assembly (130) is removed from the inner opening (12) of the outer structure (13) to enable insertion of a cable (6) into the respective cable port (15). In both the assembled condition and disassembled condition, the plurality of receiving portions (16) of the outer structure (11) are connected to each other.

An audio apparatus includes a housing, a piezoelectric vibration unit provided to the housing and having a piezoelectric element, and a communication unit for receiving an audio signal. When a received audio signal is applied to the piezoelectric element while a load of the audio apparatus is applied to the piezoelectric vibration unit, the piezoelectric element is deformed causing deformation of the piezoelectric vibration unit, whereby a contact surface in contact with the audio apparatus vibrates and generate a sound.

An audio apparatus includes a housing, a piezoelectric vibration unit provided to the housing and having a piezoelectric element, and a communication unit for receiving an audio signal. When a received audio signal is applied to the piezoelectric element while a load of the audio apparatus is applied to the piezoelectric vibration unit, the piezoelectric element is deformed causing deformation of the piezoelectric vibration unit, whereby a contact surface in contact with the audio apparatus vibrates and generate a sound.

In various embodiments, an electronic device includes: a diaphragm, a speaker module including a speaker configured to output a sound through a vibration of the diaphragm, and a housing accommodating the diaphragm and the speaker module therein and including a first space provided in a first direction from the speaker module and a second space provided in a second direction opposite the first direction. The electronic device further includes an air adsorption member comprising an air adsorbing material disposed in the first space and having a volume ratio of 90% or less of the first space, the air adsorption member configured to reduce air resistance to the diaphragm disposed above the speaker module without limiting the vibration of the diaphragm.