In an intercom system which is to be used in an apartment complex configured by a plurality of residential buildings and a centralized building (5) that can communicate with the residential buildings, each of the residential buildings includes: residential room master devices (30) which are disposed in residential rooms, respectively; a plurality of collective entrance devices (10A to 10D) which can communicate with the residential room master devices (30); and a building controller which communicably connects the residential room master devices (30) of the residential rooms in the own building, with the collective entrance devices (10A to 10D). The building controller has: a building controller ID that, when one of the residential room master devices (30) is called from the centralized building (5) via the building controller, is used in recognition in which the centralized building (5) recognizes the building controller; and a collective entrance device ID that, when the one residential room master device (30) is called from the centralized building (5) via the building controller, is used in recognition in which the one residential room master device (30) recognizes the building controller as a virtual collective entrance device that is different from the collective entrance devices (10A to 10D).

Microelectronic package communications are described that use radio interfaces that are connected through waveguides. One example includes an integrated circuit chip, a package substrate to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components, and a radio on the package substrate coupled to the radio chip to modulate the data over a carrier and to transmit the modulated data. A waveguide connector is coupled to a dielectric waveguide to receive the transmitted modulated data from the radio and to couple it into the waveguide, the waveguide carries the modulated data to an external component.

Microelectronic package communications are described that use radio interfaces that are connected through waveguides. One example includes an integrated circuit chip, a package substrate to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components, and a radio on the package substrate coupled to the radio chip to modulate the data over a carrier and to transmit the modulated data. A waveguide connector is coupled to a dielectric waveguide to receive the transmitted modulated data from the radio and to couple it into the waveguide, the waveguide carries the modulated data to an external component.