An image sensor module includes a light source unit that emits a linear light beam elongate in a primary scanning direction to an object to be read, and a lens unit including an incidence surface and an output surface oriented opposite to each other. The lens unit is configured to receive light from the object through the incidence surface and output the light through the output surface. The module also includes a sensor IC that receives the light outputted from the output surface, a housing that holds the light source unit and the lens unit, and a support member that supports the lens unit such that the incidence surface is located more distant from the sensor IC than the output surface in a secondary scanning direction. The support member includes a reflection surface that reflects the light from the object toward the incidence surface.

An image sensor module includes a light source unit that emits a linear light beam elongate in a primary scanning direction to an object to be read, and a lens unit including an incidence surface and an output surface oriented opposite to each other. The lens unit is configured to receive light from the object through the incidence surface and output the light through the output surface. The module also includes a sensor IC that receives the light outputted from the output surface, a housing that holds the light source unit and the lens unit, and a support member that supports the lens unit such that the incidence surface is located more distant from the sensor IC than the output surface in a secondary scanning direction. The support member includes a reflection surface that reflects the light from the object toward the incidence surface.

A linear image sensor includes first and second sensor chips, first and second substrates, a common support substrate, a support portion, a dam portion, and a sealing portion. The first sensor chip is mounted to partially protrude on one end side of the first substrate. The second sensor chip is mounted to partially protrude on one end side of the second substrate. The first and second substrates are mounted on the common support substrate. The support portion is provided in a gap between the end faces of the first and second substrates. The dam portion is provided annularly to surround the sensor chips. The sealing portion seals the sensor chips, in a region surrounded by the dam portion.

A linear image sensor includes first and second sensor chips, first and second substrates, a common support substrate, a support portion, a dam portion, and a sealing portion. The first sensor chip is mounted to partially protrude on one end side of the first substrate. The second sensor chip is mounted to partially protrude on one end side of the second substrate. The first and second substrates are mounted on the common support substrate. The support portion is provided in a gap between the end faces of the first and second substrates. The dam portion is provided annularly to surround the sensor chips. The sealing portion seals the sensor chips, in a region surrounded by the dam portion.

A linear image sensor includes first and second sensor chips, first and second substrates, a common support substrate, a support portion, a dam portion, and a sealing portion. The first sensor chip is mounted to partially protrude on one end side of the first substrate. The second sensor chip is mounted to partially protrude on one end side of the second substrate. The first and second substrates are mounted on the common support substrate. The support portion is provided in a gap between the end faces of the first and second substrates. The dam portion is provided annularly to surround the sensor chips. The sealing portion seals the sensor chips, in a region surrounded by the dam portion.

An image reading device (100) includes a first glass member (52), a plurality of condensing lenses (14) provided on a first surface (52a) of the first glass member (52), a first light blocking member (12) having a plurality of first openings (32) respectively corresponding to the plurality of condensing lenses (14), a second glass member (51) having a third surface (51a) in superimposition with the first light blocking member (12), a second light blocking member (11) having a plurality of second openings (31) respectively corresponding to the plurality of first openings (32), a third glass member (53) having a fifth surface (53a) in superimposition with the second light blocking member (11), a third light blocking member (15) having a plurality of third openings (34) respectively corresponding to the plurality of second openings (31), and a sensor unit (3) having a sensor substrate (9) and a plurality of light receiving pixels (10) arrayed in a predetermined array direction on the sensor substrate (9) and respectively corresponding to the plurality of third openings (34).

A linear image sensor includes first and second sensor chips, first and second substrates, a common support substrate, a support portion, a dam portion, and a sealing portion. The first sensor chip is mounted to partially protrude on one end side of the first substrate. The second sensor chip is mounted to partially protrude on one end side of the second substrate. The first and second substrates are mounted on the common support substrate. The support portion is provided in a gap between the end faces of the first and second substrates. The dam portion is provided annularly to surround the sensor chips. The sealing portion seals the sensor chips, in a region surrounded by the dam portion.

A photoelectric conversion device includes a current consumption circuit configured to consume current such that a difference between a current consumption during a blanking period and a current consumption during a standby period is reduced.

A light guide including a light scattering portion that reflects light guided inside the light guide, and a light emitting surface portion emitting light reflected by the light scattering portion to outside the light guide. A light emitting surface portion includes first and second light emitting surface portions, the first light emitting surface portion has a longer circumferential length than that of the second light emitting surface portion in the transversal cross section, and circumference curvature of the first light emitting surface portion in the transversal cross section increases away from the second light emitting surface portion. A normal line to the light scattering portion, passing through the center of the light scattering portion in the transversal cross section, intersects with the first light emitting surface portion, at a point at a near side to the second light emitting surface portion in the transversal cross section.

A photoelectric conversion device includes a current consumption circuit configured to consume current such that a difference between a current consumption during a blanking period and a current consumption during a standby period is reduced.